芝技研

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芝技研 Company Profile
Shiba Research Institute Supporting Tomorrow's Technology
Since our establishment in 1980, we have specialized in hard and brittle materials, focusing on precision processing development and the development of associated equipment. Our products have expanded into the fields of semiconductors, optical communications, and even space. We take great pride in receiving new themes from the research and development departments of various industries and bringing them to fruition. In recent years, miniaturization has advanced in the semiconductor sector, while larger sizes have progressed in LCD and PDP-related areas. For semiconductor-related fine processing, we continue to develop along traditional lines, while also working on new developments in fine processing for large products.

Business Activities
○ Contract Processing Processing of large brittle materials, small-diameter hole drilling of hard and brittle materials, deep hole processing, and fine processing utilizing special processing techniques. ○ Mechanical Engineering Dedicated machines for processing hard and brittle materials, general-purpose grinding centers, deep hole processing machines for hard and brittle materials (quartz, silicon, ceramics), small-diameter hole drilling machines for hard and brittle materials, photo mask edge beveling and polishing machines, and transport and positioning devices utilizing image processing technology.
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Detailed information
Company name | 芝技研 |
---|---|
number of employees | 37 |
Contact address | postalcode 239-0832 Kanagawa/ Yokosuka-shi/ 1-52 Shinmei-cho, Kurihama Techno Park FactoryView on map TEL:046-838-5620 FAX:046-838-5622 |
Industry | Manufacturing and processing contract |
