クボタ計装 List of Products and Services

The "Laser Explorer" is the latest wafer surface defect inspection device that also supports transparent wafers. A high-power laser detects minute defects such as scratches, pits, and particles! It can be utilized for shipping and receiving inspections of wafers, as well as for quality control in the epitaxial process! 【Other Features】 ■ High throughput (inspects 25 wafers in a cassette in about 40 minutes) ■ Discriminates the unevenness of defects ■ Automatic focusing for all samples ■ Customizable options ■ Supports automatic inspection of one cassette ■ High-precision marking for defects (optional) ■ Defect review using a laser microscope (optional)

This is a surface defect inspection device equipped with a differential interference microscope, applicable to transparent materials. It is capable of outputting defect maps through comprehensive inspections and allows for microscopic observation of detected defects. ■ Features of the device - Defect extraction and discrimination functions using proprietary image processing technology - High-precision marking while observing defects - Enables observation and creation of defect albums based on defect coordinates for wafers inspected by other devices - Development of a crystal defect detection function is underway

■This is a device that responds to the following requests and concerns! - We want to automate visual inspection of defects on wafers (substrates). - We want to reduce and prevent variability in pass/fail judgments among inspectors. - We want to save inspection data and trace quality. - We want to automatically discriminate defects. ■Features of the device - It can automatically detect, extract, and discriminate visually identifiable defects. - We can propose an optical system optimized for the types of defects. - We can suggest both manual and automatic transport (cassette to cassette). - It also implements AI functions, allowing for improved defect discrimination accuracy through ongoing learning.

By irradiating a high-power laser onto a wafer on a rotating stage, the entire surface is inspected at high speed, allowing for the detection of minute defects. By combining multiple channels such as scattering, reflection, and phase shift, defect detection suitable for various applications can be achieved, enabling discrimination by defect type such as unevenness. ■ Features of the device - High-speed inspection (approximately 181 seconds/12 inches) - Equipped with a review microscope - The microscope can be selected as either a laser microscope or a differential interference microscope - High-precision scribing using the microscope for analysis with SEM, etc. - Optional edge inspection functionality is available