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Our company utilizes semiconductor assembly and inspection technology to perform fine assembly and inspection. Of course, this work is done in a clean room. To date, we have a track record of micron-order component joining, adhesive assembly, fine soldering, and visual inspection of subcomponents and IC chips.
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Free membership registrationThe heating head HDR-0670 is a heating head with a thick film heater that accommodates plastic cards with a width of 54mm. It can be driven by DC24V, making it easier and safer to integrate into setups compared to heating rollers that operate on AC100V to 240V. Unlike heating rollers that maintain high temperatures constantly, the heating head uses on-demand heating, raising the temperature only when necessary, which saves energy. Additionally, it enables real-time control that increases energy only when cards pass through, even when cards are continuously passing at regular intervals. The surface of the heater is made of durable ceramic, and you can choose a surface coating material according to your needs.
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Free membership registrationAt Hayashi Repic Co., Ltd., we perform cleaning of parts that require a high level of cleanliness in a clean environment, such as semiconductor manufacturing equipment. We provide clean washing and clean packaging for products (mainly parts used in semiconductor equipment, connector wire harnesses, etc.). All processes are carried out in a clean room (Class 1000). We can accommodate cleaning items up to the size of 300mm × 250mm × 150mm. We also accept assembly of cleaned items. 【Features】 - Double packaging from clean room to clean room maintains cleanliness. - Gas chromatography testing (GC/MS) is also available upon request. For more details, please contact us or download the catalog.
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Free membership registrationWe conduct reliability evaluations of HDDs (Hard Disk Drives) and SSDs (Solid State Drives), durability tests in high-temperature and high-humidity environments, cycle tests, and failure analysis. By screening HDDs and aging SSDs, we can reduce the initial failure rate and field incidental failure rate. This is also ideal for performance verification of used HDDs, inventory items, and operational products. 【Features】 ○ Support for small quantities and single items ○ Collaborative service with San-ei Electronic Industries For more details, please contact us or download the catalog.
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Free membership registrationIn the 3rd Business Division (formerly the Electronic Device Division), we receive semiconductor chips (silicon-based, compound semiconductors, MEMS, etc.) from our customers and carry out assembly and inspection for ceramic packages and other applications. We also have experience in COB (Chip on Board) assembly, where chips are directly mounted onto substrates. 【Features】 - Prototyping is possible, as well as mass production with single processes. - We can handle chips that are difficult to manage and prone to cracking or chipping with care. For more details, please contact us or download the catalog.
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Free membership registrationHayashi Repic Co., Ltd. manufactures substrates using thick film technology. We cater to high heat-resistant and high heat-dissipating electronic circuit substrates such as ceramic substrates. Thick film printing technology has no limitations on the printed materials and challenges various materials and applications. We accept small-scale prototypes and custom items. 【Related Products】 ○ Thick film circuits ○ Heaters ○ Radiation detectors ○ Sensors For more details, please contact us or download the catalog.
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