We perform assembly and packaging of semiconductors (communication systems/MEMS, etc.). We also offer rework services. There is a vacuum reflow available.
In the 3rd Business Division (formerly the Electronic Device Division), we receive semiconductor chips (silicon-based, compound semiconductors, MEMS, etc.) from our customers and carry out assembly and inspection for ceramic packages and other applications. We also have experience in COB (Chip on Board) assembly, where chips are directly mounted onto substrates. 【Features】 - Prototyping is possible, as well as mass production with single processes. - We can handle chips that are difficult to manage and prone to cracking or chipping with care. For more details, please contact us or download the catalog.
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basic information
【Engineering】 ○ Chip sorting ○ Die bonding (chip mounting) Both bare chips and 0402 chips, as well as flip chips, are possible. ○ Introduced vacuum reflow. ○ Wire bonding (aluminum wire, gold wire, wedge, ball) ○ Rework (IC re-implementation, re-wiring) is possible. ○ Sealing (seam welding, solder sealing) ○ Leak testing (He leak, bubble leak) ○ Marking (laser, ink) ○ Package lead cutting and molding ○ Various reliability tests (high temperature and humidity, heat cycle, etc.) ● For more details, please contact us or download the catalog.
Price information
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Applications/Examples of results
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Company information
At Hayashi Repic Co., Ltd., the 3rd Business Division focuses on the assembly of semiconductor components, particularly for optical microwave communication-related parts. We specialize in inspections and work using microscopes within clean rooms. Additionally, we conduct clean washing for semiconductor equipment, thick film printing on ceramic substrates, and durability testing and failure analysis for HDDs/SSDs. We have obtained ISO 9001, ISO 14001, and ISO 27001 certifications, and we are confident in our cost and delivery capabilities, so we hope you will consider utilizing our services.
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