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Leave it to us for vacuum component processing. Vacuum chambers made of SUS/AL, various parts, exhaust piping, and base holders.
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Free membership registrationBy neutralizing the beam, it is also optimal for irradiation and etching processes of dielectrics and semiconductors, where charged particles have been a concern until now. ≪Applications≫ ■ Substrate cleaning before film formation ■ Sample cleaning and surface activation before room temperature bonding ■ Etching of semiconductor substrates, etc. ■ Microfabrication ■ Reactive atom beam etching ≪Features≫ ■ Unlike impacts from charged ions, there is no charge damage to insulating or semiconductor samples ■ Since the beam is charge-free, it travels straight without bending even in electric or magnetic fields.
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Free membership registrationIt is an all-metal leak valve compatible with UHV equipment, controlled using a piezo element.
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Free membership registrationAdvanced control is possible, allowing for a range of 0.1 to 50 Å/min for many materials. ≪Applications≫ Fabrication of thin films in the nanometer range, semiconductor doping ≪Features≫ ■ Design that is free from contamination with high cooling efficiency ■ Choice of materials in rod or crucible form ■ Precise film thickness control enabled by the standard flux monitoring plate ■ Available in single pocket and four pocket types; the four pocket type allows for independent control of each pocket and simultaneous deposition of up to four materials.
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