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This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

As the performance and miniaturization of multilayer build-up substrates progress, increasingly stringent flattening processing is required. The FCMP-II series maximizes the characteristics of the wrapping tape, making it easy to achieve the desired polishing and simplifying equipment management. It enables polishing with minimal hole formation. By selecting the appropriate tape gauge, roughness management becomes easy, and it can be used for both wet and dry applications. Once set up, anyone can use it easily. For more details, please contact us or refer to the catalog.

As products become more advanced, there is a growing demand for more precise polishing methods. The polishing equipment handled by Sanshin uses polishing films coated with abrasive particles on polyester film, making it easy to improve surface roughness and flattening in the final finishing process of various workpieces. While manual polishing requires skilled techniques, introducing polishing equipment can also address issues related to labor shortages and the transfer of skills. This document explains the purpose and features of Sanshin equipment. [Contents] 1. About film polishing methods 2. Outer diameter polishing equipment 3. Inner diameter polishing equipment 4. Flat polishing equipment 5. Automatic supply and discharge *For more details, please refer to the PDF document or feel free to contact us.