大橋製作所 機器事業部

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大橋製作所 Company Profile
We develop, manufacture, and sell a wide range of mounting devices, from tabletop models to fully automatic types, centered around ACF bonding devices.
Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.

Business Activities
〇 Equipment Division - Main Products - ACF Line (Bonding Machines, Mounting Machines, Hot Press Machines, etc.) We develop, manufacture, and sell from manual tabletop machines to fully automatic mass production machines. Supports various processes such as FOB, COG, COF, FOG, COB, etc. - Optical Resin Laminator Applies OCR (UV-curable resin), bonds cover glass/touch panels/LCDs (LCDM), and performs temporary curing. - LED Flip Chip Mounting Equipment Manufacturing equipment for LED modules with integrated COB, eliminating the need for Au wire. - System Integration (Si, Automation Equipment) Includes laser markers, film bonding machines, pre-focus adjustment machines, etc.
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Detailed information
Company name | 大橋製作所 機器事業部 |
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number of employees | 97 |
Contact address | postalcode 349-1148 Saitama/ Kazo-shi/ Toyonodai 1-471-8View on map TEL:0480-72-7500 FAX:0480-78-1455 |
Industry | Industrial Machinery |
