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テックインサイツジャパン株式会社(TechInsights)

number of employees443
addressTokyo/Chiyoda-ku/Room 614, 6th Floor, Imperial Hotel Main Building, 1-1-1 Uchiyamacho
phone03-6869-7700
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last updated:Sep 18, 2025
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テックインサイツジャパン株式会社(TechInsights) Product Lineup

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Microsoft Band 1619

Recently prominent wearable products. This time, we introduce Microsoft's Band.

This product is equipped with a pedometer, calorie counter, sleep tracker, and 24-hour heart rate monitor, and even has GPS built-in. It works in conjunction with a smartphone and has various features. Although the product is small, it might be assumed that not many ICs are used, but the total number is 25. While there are few semiconductors from Japanese manufacturers, they are uniquely used in the battery protection part. The ICs are cleverly placed within the small circuit board, but the arrangement does not give a sense of complexity in appearance.

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Report: ValleyView Atom Z3740 SoC

Detailed structural analysis report of the Intel Atom 23740 processor.

The "Intel(R) 22nm ValleyView Atom(TM) Z3740 SoC" is a detailed structural analysis report of the Intel Atom 23740 processor. The 24740 is designed for Windows and Android tablets and is a power-efficient quad-core SoC. This SoC operates at a clock speed of 1.33GHz and is based on the Intel Bay Trail-Silvermont architecture. 【Features】 ■ The 23740 is manufactured using a 9-layer metal, dual-gate dielectric, 22nm SoC process. ■ Device: HKMG FinFET transistors with a minimum pitch of 90nm. ■ Silicon diffusion layer section: Used for NMOS transistors, while SiGe is used for PMOS transistors. For more details, please contact us or download the catalog.

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Detailed teardown report that reveals the analysis of products and parts.

Ideal for when you want to know about product development or other companies' designs! You can quickly research using the largest data library instead of analyzing it in-house.

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the related supply chain. Tear-down reports for major market products such as mobile devices, medical equipment, and digital home products are available individually or through licensing agreements. Various manufacturers utilize our tear-downs to obtain information such as the following: 【Examples of Use by Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Examples of Use by Semiconductor/Component Suppliers】 - Potential for sockets - Trends in component integration - Trends in packaging - Competitive threats 【Examples of Use by Intellectual Property Stakeholders】 - Verification of design wins - Tracking of target claims - Market sizing for relevant products and technologies (Custom tear-downs tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

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Report: Intel 22nm Haswell eDRAM

This is a detailed structural analysis report of Intel(R) eDRAM.

The "Intel(R) 22nm Haswell eDRAM" is a detailed structural analysis report on Intel(R) eDRAM, which is embedded DRAM corresponding to the Haswell G82494 processor equipped with the Intel GT3 graphics unit (GPU). This integrated graphics unit has various features, including low-end GT1, mid-range GT2, and high-end GT3. The version with the best performance among GPU ICs is GT3e. 【Features】 ■ GT3e: Composed of embedded DRAM with 9 metal layers and 22nm TriGate transistor technology ■ Silicon source-drain is used for NMOS transistors, while SiGe is used for PMOS transistors For more details, please contact us or download the catalog.

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Report: Detailed Structural Analysis of Application Processor Logic

This is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core).

This report is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core) application processor. The MT6592 features an ARM Cortex-A7 processor and is marketed as a "true octa-core" SoC, equipped with a 4-core ARM MaliTM GPU, supporting Full HD displays, cameras up to 16 million pixels, multi-mode cellular modems, and dual-band 802.11n Wi-Fi, among other features. The MT6592 is manufactured using TSMC's HPM CMOS process with an 8-layer metal (7 Cu, 1 Al) structure, high-k metal gate (HKMG), and a gate length of 28nm. 【Features】 ○ Crystal orientation of the transistor channel <110> ○ Hafnium oxide (HfO2) material for the gate insulating film ○ Dual work function metal gate ○ nMOS (NiSi) and pMOS (NiSiGe) source/drain regions, and low-k interlayer insulating film For more details, please contact us or download the catalog.

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Tear Down Report for Game Developers

Analyze competitors' designs and innovate in game development.

In the gaming industry, innovative product development is essential for establishing a competitive advantage. Understanding what designs other companies are adopting and how they are incorporating the latest technological trends is crucial for creating new gaming experiences. TechInsights' teardown reports provide deep insights into product design and supply chains, assisting in solving technical challenges in game development. 【Use Cases】 - Teardown analysis of the latest gaming consoles - Analysis of competitors' design strategies - Investigation of the feasibility of adopting new technologies 【Benefits of Implementation】 - Shortening of the product development cycle - Establishment of technological superiority - Achievement of cost reductions

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Wearable Device Tear Down Report

Understand product durability design and establish competitive advantage.

In the wearable device industry, product durability is a crucial factor. Designs must withstand harsh environments, including impacts, water exposure, and temperature changes. Tear-down reports provide a detailed analysis of the design of competing products and identify design elements that can enhance durability. This information can be used to improve the design of one's own products and to introduce new technologies. 【Usage Scenarios】 - Justification of design in durability testing - Design analysis of the durability of competing products - Improvement of product reliability 【Effects of Implementation】 - Contributes to improved product durability - Shortens development time - Reduces costs

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Improving Reliability with Tear Down Reports for Automobiles

Deeply understand product design and the supply chain, contributing to improved reliability.

In the automotive industry, product reliability is one of the most important issues. To ensure vehicle safety and performance, quality management in the design and manufacturing processes of electronic components is essential. TechInsights' teardown reports provide deep insights into the technological and cost factors that affect product design and the related supply chain, contributing to improved reliability. 【Use Cases】 - Competitive design analysis among automotive manufacturers - Reliability assessment of components in supplier selection - Design optimization in new product development 【Benefits of Implementation】 - Reduction of product defect risks - Strengthening quality management in the supply chain - Shortening product development time and reducing costs

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Tear Down Report for the Telecommunications Industry

We support the optimization of product design and respond to miniaturization needs.

In the telecommunications industry, there is a constant demand for miniaturization and high performance of devices. It is important to utilize the latest technologies and conduct efficient designs within limited space. By understanding the technologies of competitors and applying them to our own designs, we can accelerate product development and reduce costs. TechInsights' teardown reports address this challenge. 【Usage Scenarios】 - Miniaturization design for smartphones, base stations, IoT devices, etc. - Technical analysis of competing products - Component selection and cost optimization 【Benefits of Implementation】 - Increased efficiency in product design - Shortened development periods - Cost reduction - Strengthened competitiveness

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Teardown Report for Home Appliance Manufacturers

Analyze product design and cost structure in detail to establish competitive advantage.

In the home appliance industry, product cost optimization is a crucial factor that influences competitiveness. Understanding the designs of competitors and grasping the selection of components and cost structures are essential for improving profit margins. TechInsights' teardown reports provide deep insights into product design and cost factors, supporting home appliance manufacturers in reducing costs and enhancing competitiveness. 【Usage Scenarios】 - Analysis of the cost structure of competing products - Examination of the substitutability of components - Setting cost targets in new product development 【Effects of Implementation】 - Detailed understanding of the product's cost structure - Optimization of component procurement strategies - Reduction of new product development time and costs

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Improving safety with teardown reports for medical devices.

Deeply understand the design of medical devices and the supply chain to enhance safety.

In the medical device industry, product safety is the top priority. Design errors and component defects can have serious impacts on patient health. Tear-down reports contribute to identifying potential risks of products and enhancing safety by thoroughly analyzing competitors' designs, supplier selections, and cost factors. 【Usage Scenarios】 - Design verification of medical devices - Risk assessment in component selection - Safety comparison through competitive product analysis 【Benefits of Implementation】 - Improved product reliability - Early detection and countermeasures for risks - Optimization of the design process

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