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テックインサイツジャパン株式会社(TechInsights)

number of employees443
addressTokyo/Chiyoda-ku/Room 614, 6th Floor, Imperial Hotel Main Building, 1-1-1 Uchiyamacho
phone03-6869-7700
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last updated:Sep 18, 2025
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Microsoft Band 1619

Recently prominent wearable products. This time, we introduce Microsoft's Band.

This product is equipped with a pedometer, calorie counter, sleep tracker, and 24-hour heart rate monitor, and even has GPS built-in. It works in conjunction with a smartphone and has various features. Although the product is small, it might be assumed that not many ICs are used, but the total number is 25. While there are few semiconductors from Japanese manufacturers, they are uniquely used in the battery protection part. The ICs are cleverly placed within the small circuit board, but the arrangement does not give a sense of complexity in appearance.

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Report: ValleyView Atom Z3740 SoC

Detailed structural analysis report of the Intel Atom 23740 processor.

The "Intel(R) 22nm ValleyView Atom(TM) Z3740 SoC" is a detailed structural analysis report of the Intel Atom 23740 processor. The 24740 is designed for Windows and Android tablets and is a power-efficient quad-core SoC. This SoC operates at a clock speed of 1.33GHz and is based on the Intel Bay Trail-Silvermont architecture. 【Features】 ■ The 23740 is manufactured using a 9-layer metal, dual-gate dielectric, 22nm SoC process. ■ Device: HKMG FinFET transistors with a minimum pitch of 90nm. ■ Silicon diffusion layer section: Used for NMOS transistors, while SiGe is used for PMOS transistors. For more details, please contact us or download the catalog.

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Detailed teardown report that reveals the analysis of products and parts.

Ideal for when you want to know about product development or other companies' designs! You can quickly research using the largest data library instead of analyzing it in-house.

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the related supply chain. Tear-down reports for major market products such as mobile devices, medical equipment, and digital home products are available individually or through licensing agreements. Various manufacturers utilize our tear-downs to obtain information such as the following: 【Examples of Use by Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Examples of Use by Semiconductor/Component Suppliers】 - Potential for sockets - Trends in component integration - Trends in packaging - Competitive threats 【Examples of Use by Intellectual Property Stakeholders】 - Verification of design wins - Tracking of target claims - Market sizing for relevant products and technologies (Custom tear-downs tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

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Report: Intel 22nm Haswell eDRAM

This is a detailed structural analysis report of Intel(R) eDRAM.

The "Intel(R) 22nm Haswell eDRAM" is a detailed structural analysis report on Intel(R) eDRAM, which is embedded DRAM corresponding to the Haswell G82494 processor equipped with the Intel GT3 graphics unit (GPU). This integrated graphics unit has various features, including low-end GT1, mid-range GT2, and high-end GT3. The version with the best performance among GPU ICs is GT3e. 【Features】 ■ GT3e: Composed of embedded DRAM with 9 metal layers and 22nm TriGate transistor technology ■ Silicon source-drain is used for NMOS transistors, while SiGe is used for PMOS transistors For more details, please contact us or download the catalog.

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Report: Detailed Structural Analysis of Application Processor Logic

This is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core).

This report is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core) application processor. The MT6592 features an ARM Cortex-A7 processor and is marketed as a "true octa-core" SoC, equipped with a 4-core ARM MaliTM GPU, supporting Full HD displays, cameras up to 16 million pixels, multi-mode cellular modems, and dual-band 802.11n Wi-Fi, among other features. The MT6592 is manufactured using TSMC's HPM CMOS process with an 8-layer metal (7 Cu, 1 Al) structure, high-k metal gate (HKMG), and a gate length of 28nm. 【Features】 ○ Crystal orientation of the transistor channel <110> ○ Hafnium oxide (HfO2) material for the gate insulating film ○ Dual work function metal gate ○ nMOS (NiSi) and pMOS (NiSiGe) source/drain regions, and low-k interlayer insulating film For more details, please contact us or download the catalog.

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