テックインサイツジャパン株式会社（TechInsights） List of Products and Services

Semiconductor Insights (SI), a group company of TechInsights, is a leading global technology consulting firm targeting the global microelectronics industry. Through detailed technical investigations and analyses of VLSI integrated circuits and electronic systems, we support clients in exercising their intellectual property (IP) rights and in the development and commercialization of new technologies and products. **TechInsights Solutions (for Technology Professionals)** - Competitive Analysis (other companies, target products, etc.) - Design Analysis (circuits, systems, functional operations, etc.) - Process Analysis (structure and manufacturing processes of target products) - Cost Analysis (costs of target devices, etc.) - Smart Card Security Analysis For more details, please contact us or download the catalog.

If you need to understand the inner workings of cutting-edge technology products, Tech Insights is here to help. We have the ability to analyze the inner workings of products, their operational principles, and reasons through our unique methods, from systems to the nanoscale. Equipped with one of the world's most sophisticated in-house reverse engineering and technical analysis capabilities, we can uncover the technological innovations within a wide range of electronic devices and semiconductor elements. With the insights we provide, our clients can make informed decisions regarding technology investments that are suitable for their applications. [Examples of Analysis and Insight Utilization] - Identify successful products in high-growth technology markets and the reasons for their success. - Discover and anticipate problematic events such as technological innovations and the entry of new players. - Understand cutting-edge technology through independent and objective analysis of actual products. - Mitigate risks in product strategy, enter new markets, and capitalize on new opportunities. - Make product and pricing decisions more accurately, quickly, and confidently. *For more details, please refer to the PDF document or feel free to contact us.

Tech Insights has the ability to analyze the internal workings and principles of products, from systems to the nano level, using its unique methods. With sophisticated in-house reverse engineering and technical analysis capabilities, we can uncover the technological innovations within a wide range of electronic devices and semiconductor components. If you need to understand the internals of cutting-edge technology products, please use our services. 【World's Largest Technology Product Database】 ■ Over 7,000 detailed analysis reports and reference materials ■ Multiple generations of products ■ Subscription options tailored to business needs *For more details, please refer to the PDF materials or feel free to contact us.

Tech Insights supports patent-holding companies in creating, managing, and utilizing their patent portfolios to achieve business goals. We conduct structured portfolio structuring and patent analysis using a systematic approach to identify the potential of patents. The data generated through this process enables fact-based decision-making regarding patent applications, disposals, sales, purchases, and litigation strategies. We offer solutions and services to maximize the value of our clients' intellectual property. 【Intellectual Property Services】 ■ Patent Landscape ■ Patent Strengthening ■ Patent Research ■ Prior Art Search ■ Infringement Evidence ■ Portfolio Evaluation ■ Patent Transaction Services *For more details, please refer to the PDF materials or feel free to contact us.

Introducing Tech Insights' "Automotive Subscription." We provide forecasts and analyses of a B2B automotive electronics ecosystem focused on OE-installed systems and small (under 6 tons) four-wheeled vehicles. Additionally, we trace detailed demand for semiconductors and sensors back to specific vehicle functions and research data on semiconductor market share. [Features] ■ Realistic and fact-based forecasts on where, when, and how demand will grow. ■ Extensive research to understand trends that impact the automotive user experience. *For more details, please download the PDF (English version) or feel free to contact us.

This product is equipped with a pedometer, calorie counter, sleep tracker, and 24-hour heart rate monitor, and even has GPS built-in. It works in conjunction with a smartphone and has various features. Although the product is small, it might be assumed that not many ICs are used, but the total number is 25. While there are few semiconductors from Japanese manufacturers, they are uniquely used in the battery protection part. The ICs are cleverly placed within the small circuit board, but the arrangement does not give a sense of complexity in appearance.

The MN101LR05D is a low-power 8-bit single-chip microcontroller developed for portable healthcare, security devices, and sensor processing. The MN101LR05D features a CPU core with a 10MHz 8-bit AM13L, 64KB of ReRAM capacity, and 4KB of SRAM capacity. The MR101LR05D is the world's first mass-produced practical example of ReRAM (Resistive RAM), and it is expected to be widely utilized as a successor technology to existing non-volatile memory. The MN101LR05D is manufactured using a 180nm CMOS process with four layers of AI metallization. The ReRAM cell of this metal oxide is formed between stack W vias connecting metal 3 to metal 4. The results of the report are based on data from scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy-dispersive X-ray analysis (TEM-EDS), electron energy loss spectroscopy (TEM-EEKS), and spreading resistance measurement (SRP).

This is a reconstruction of the structural analysis of the "Samsung 20nm class 3GB (6x4Gbit) LPDDR3." The main purpose is to compare the cell configurations of the 20nm class DRAM with its predecessor, the 30nm class 2Gb DDR3 DRAM (the 20nm class is simply designated as "2X nm"). 【Features】 ■ Chip using six 2X nm class 4GB ■ Symmetrical configuration of two sets of three chip stacks within one package ■ Package thickness: 0.8mm with six die configuration For more details, please download the catalog or contact us.

The "Oracle SPARC T5 Multi-Core Processor" is a structural analysis report created using TSMC's 28nm HP process. The T5 operates at a clock speed of 3.6GHz and is a 16-core SoC. It is built using TSMC's 28nm HP CMOS process with 13 metal layers (12 Cu, 1 Al) and high-K metal gate (HKMG), featuring 16KB of L1 data cache, 16KB of L1 instruction cache, and 128KB of L2 cache for each core, along with an additional 8MB of shared L3 cache. **Features** - Two PCI-Express 3.0 controllers integrated into the die - Four DDR3 memory controllers included - Device: <110> channel-oriented transistors For more details, please download the catalog or contact us.

The "Intel(R) 22nm ValleyView Atom(TM) Z3740 SoC" is a detailed structural analysis report of the Intel Atom 23740 processor. The 24740 is designed for Windows and Android tablets and is a power-efficient quad-core SoC. This SoC operates at a clock speed of 1.33GHz and is based on the Intel Bay Trail-Silvermont architecture. 【Features】 ■ The 23740 is manufactured using a 9-layer metal, dual-gate dielectric, 22nm SoC process. ■ Device: HKMG FinFET transistors with a minimum pitch of 90nm. ■ Silicon diffusion layer section: Used for NMOS transistors, while SiGe is used for PMOS transistors. For more details, please contact us or download the catalog.

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the related supply chain. Tear-down reports for major market products such as mobile devices, medical equipment, and digital home products are available individually or through licensing agreements. Various manufacturers utilize our tear-downs to obtain information such as the following: 【Examples of Use by Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Examples of Use by Semiconductor/Component Suppliers】 - Potential for sockets - Trends in component integration - Trends in packaging - Competitive threats 【Examples of Use by Intellectual Property Stakeholders】 - Verification of design wins - Tracking of target claims - Market sizing for relevant products and technologies (Custom tear-downs tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

The "Intel(R) 22nm Haswell eDRAM" is a detailed structural analysis report on Intel(R) eDRAM, which is embedded DRAM corresponding to the Haswell G82494 processor equipped with the Intel GT3 graphics unit (GPU). This integrated graphics unit has various features, including low-end GT1, mid-range GT2, and high-end GT3. The version with the best performance among GPU ICs is GT3e. 【Features】 ■ GT3e: Composed of embedded DRAM with 9 metal layers and 22nm TriGate transistor technology ■ Silicon source-drain is used for NMOS transistors, while SiGe is used for PMOS transistors For more details, please contact us or download the catalog.

This report is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core) application processor. The MT6592 features an ARM Cortex-A7 processor and is marketed as a "true octa-core" SoC, equipped with a 4-core ARM MaliTM GPU, supporting Full HD displays, cameras up to 16 million pixels, multi-mode cellular modems, and dual-band 802.11n Wi-Fi, among other features. The MT6592 is manufactured using TSMC's HPM CMOS process with an 8-layer metal (7 Cu, 1 Al) structure, high-k metal gate (HKMG), and a gate length of 28nm. 【Features】 ○ Crystal orientation of the transistor channel <110> ○ Hafnium oxide (HfO2) material for the gate insulating film ○ Dual work function metal gate ○ nMOS (NiSi) and pMOS (NiSiGe) source/drain regions, and low-k interlayer insulating film For more details, please contact us or download the catalog.