ゼストロンジャパン List of News Articles

Modern electronic devices are highly advanced, and even minor malfunctions can lead to significant incidents. Events that undermine insulation threaten the reliability of products, and one phenomenon that can contribute to this is ion migration, which has been considered a past issue. It has been said that this has been overcome due to the evolution of various insulating materials such as coatings and resists, as well as advancements in cleaning-free technologies. However, as the miniaturization and high density of electronic substrates rapidly progress, ensuring insulation has become increasingly difficult, and the risk of ion migration is once again on the rise. This article will explain why ion migration has become a trend again, exploring its mechanisms, specific countermeasures, and evaluation methods to assess the potential for its occurrence. You can view the detailed content of the article through the related links.

"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.

Flux residues require the selection of analytical methods based on their type. By conducting chemical analysis, it is possible to analyze the causes of defects and improve processes. You can download a free document summarizing our analysis service overview. If you are struggling with cleaning processes or defect analysis, please take a look. Zestron offers cleanliness analysis technology that can comply with ISO 9455-18:2024.

The "Printed Circuit Board (PCB)" can be considered the heart of electronic devices; it serves as a foundation for mounting electronic components and electrically connecting them. The fine wiring patterns formed on this board become pathways for electronic signals, and the electronic components are fixed and connected by solder. From smartphones to automobiles, home appliances, and medical devices, PCBs have become an indispensable part of various technologies in modern society. In this article, we will introduce the main types of printed circuit boards (PCBs), the future prospects seen from the development of these boards, and the cleaning technologies that are required. Please see the related links for more information.

An SDS (Safety Data Sheet) is a document that contains important information regarding the handling of chemical substances, relevant regulations, disposal and transportation methods, as well as hazards and toxicity. The applicable regulations for flux cleaning agents, the presence or absence of flash points, usage precautions, the necessity of protective equipment, and disposal methods are detailed over more than 10 pages. In this article, we will explain important points that we particularly want you to pay attention to, as well as frequently asked questions, in a column format. Please see the related links for more information.

This is the updated version (ver.2) of the popular document "Fundamentals of Flux Cleaning." In this revision, in addition to the existing content (how to choose cleaning agents and cleaning methods), we have added the basics of "Residue Evaluation (Analysis)." This document is recommended for those who are just starting with flux cleaning and for those who want to understand the entire process from cleaning to analysis. In addition to the purpose of cleaning and the fields where cleaning is necessary, we also explain the necessity and methods of chemical analysis, so please take a moment to read it.

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but cleaning has become essential to ensure high reliability. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information.

In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high temperatures, large currents, and high voltages. In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to considerations such as environmental regulations and costs, as it can form a high-density bonding layer. This article will examine effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduce the features and application examples of the cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics.

In current electronics assembly in Japan, rosin-based flux is predominantly used for soldering. However, due to the promotion of the SDGs and the growing interest in reducing environmental impact, there is an active evaluation of water-soluble flux, which is expected to reduce VOC emissions and cleaning burdens. This time, we will present an investigation into the actual cleaning conditions of water-soluble flux, which is recognized as easier to clean than rosin-based flux.

Long-side resistors refer to a type of chip resistor (resistor) on a substrate where the electrodes are arranged along the long side of the component. In recent years, there has been an increase in cases where they are used for the purpose of enhancing functionality and ensuring long-term stability. In this instance, we created a test board using general-purpose rectangular resistors (2012) and long-side resistors (1220), and conducted substrate cleaning using a cleaning agent primarily composed of water (manufactured by Zestron / VIGON PE 304N) and a general-purpose solvent-based cleaning agent primarily composed of organic alkali. For this verification, we received cooperation from Japan Superior Co., a solder manufacturer, and conducted a detailed analysis comparing the cleanliness of both types of resistors.