ハイメカ List of Products and Services

Haimeka Co., Ltd. has been engaged in the development of electronic component manufacturing equipment and FA equipment in various fields since its establishment in 1972, with dissimilar metal welding as its core technology. We currently provide equipment for the capacitor, semiconductor, and energy device fields. It is our engineers' wish to create "beautiful equipment" that delights our customers. Focusing on the electronic components and energy device fields, we will continue to walk alongside our customers while responding to their needs with cutting-edge technology. 【Product Line】 ■ Tantalum capacitor manufacturing equipment and quartz device manufacturing equipment ■ Welding power supplies ■ Various FA equipment ■ Taping & forming automatic machines ■ Energy device manufacturing equipment ■ Chip aluminum electrolytic capacitor manufacturing equipment, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing
• Other semiconductor manufacturing equipment
• Circuit board design and manufacturing

Our company supports the resolution of issues and challenges in production lines through the design and development of automated machines and labor-saving equipment, assembly operations/OEM, and parts processing. We cater to the development and manufacturing of various FA machines, including mass production equipment for electronic components, as well as in the energy and medical fields. If you are considering automating your manufacturing processes, please feel free to contact us. 【Business Introduction】 ■ Automated machine design/development ■ Assembly operations/OEM ■ Parts processing *For more details, please refer to the external link page or feel free to contact us.

• Mechanical Design
• Circuit board design and manufacturing
• Processing Contract

The "MAG-PT" is a pick-and-taping device that excels in customization to meet customer needs, including support for special unit attachments. With a pickup technology of 10 pieces per second, it quickly extracts chips from wafering and packages them into embossed tape. Additionally, motion control reduces dynamic load. For chip positioning, image recognition is utilized, ensuring accurate packaging of even the smallest chips through θ-direction correction on the horizontal transport chuck and position correction of the embossed tape. It also offers a variety of optional features, including mapping functionality and image processing capabilities (for cracks, chips, and foreign material contamination). 【Features】 ■ High-speed pickup technology ■ Reduction of dynamic load through motion control ■ Non-contact, damage-free positioning of components ■ Reliable packaging of ultra-small chips ■ Time-saving technology for product changeover *For more details, please refer to the PDF document or feel free to contact us.

• Wafer
• Taping Machine

Electrical characteristic tests and wavelength/luminance characteristic inspections are conducted simultaneously to automatically eject defective products! Conversion between Top View and Side View is possible with dedicated parts! (Optional) Even after tape insertion, defective products can be automatically replaced through image inspection! (Optional)

• Chip type LED

Our company designs and manufactures automation equipment for precision resistance welding (spot welding). We are committed to tackling the increasingly miniaturized and precise resistance welding of metals, including electronic components, and assisting our customers in improving their production capacity and quality. In combination with our self-developed welding power supply "Clean Spot PW-30D" for welding automation machines, we guarantee reliable and stable welding.

• Assembly Machine

This is a device that picks up diced devices attached to a wafer one by one, undergoes visual inspection (image processing), and tapes the good products onto an embossed tape.

• Wafer