Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
This is a device that picks up diced devices attached to a wafer one by one, undergoes visual inspection (image processing), and tapes the good products onto an embossed tape.
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basic information
■Application Target Products WLCSP, CSP Chip Size 0.3 to 8.0 mm Wafer Size 6 inches, 8 inches, (12 inches under development) ■Main Equipment Specifications Cycle Time 0.25 to 0.3 sec/piece Chip Supply Method Automatic exchange from magazine (25-tier magazine) Wafer ring magazine Chip Positioning Image recognition Appearance Inspection Function Ink mark (NG mark), presence or absence of bumps, cracks, chipping, foreign matter attachment Classification Taping, BOX storage (2 classifications) Tray storage (optional) ■External Dimensions and Weight External Dimensions 1180(W) × 950(D) × 1690(H) *Excluding patrol light Equipment Weight 1,300 kg
Price information
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Price range
P7
Delivery Time
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Applications/Examples of results
【Usage】 - Semiconductor manufacturer production lines 【Examples of Achievements】 - Already adopted by several domestic component manufacturers.
Company information
Since its establishment in 1972, Haimeka Co., Ltd. has been engaged in the development of manufacturing equipment for electronic components and FA equipment in various fields, and is currently providing devices in the fields of capacitors, semiconductors, energy devices, and DNA testing.
