List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1～45 item / All 4174 items
Micron diamond powder, industrial diamond powder
- Grindstone
- Wafer
- Other semiconductors
Secure and high-speed short-range wireless communication technology with a limited communication range.
- Dedicated IC
We also accommodate various special-shaped dicing tape frames in different sizes!
- Other semiconductors
We also support various special-shaped dicing tape frames in different sizes!
- Other semiconductors
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
September 9 (Tuesday) Webinar "Fundamentals of Chiplet Implementation and Testing/Evaluation Techniques"
Chiplets are a technology that integrates multiple chips into a single package, necessitating new testing methods not only for traditional chip-level testing but also specifically for chiplets. This course will introduce the fundamental technologies of electronic circuit testing, followed by an overview of chiplets, the concepts of chiplet testing, testing methods for true KGD (Known Good Die) selection, challenges and latest trends in wafer probing, testing of interposers, system-level testing, SDC (Silent Data Corruption), boundary scan for chiplet interconnect testing and the IEEE 1838 standard, TSV connection failure repair methods and the UCIe standard, as well as new measurement methods to evaluate ultra-narrow pitch TSV connections such as hybrid bonding. Target Audience for the Seminar: Individuals interested in the implementation and testing of chiplets. Knowledge Gained from the Seminar: - Basic knowledge of electronic circuit testing - Overview of chiplets - Concepts and trends in chiplet testing - Basic knowledge of boundary scan and chiplet testing standard IEEE 1838 - TSV connection failure avoidance technologies and UCIe standard - New evaluation techniques for TSV connections using analog boundary scan
A systematic explanation of the overall picture of the rapidly growing optical semiconductor sensor market, its core technologies, and various application examples in different fields, all within thre...
- Other semiconductors
- Technical Seminar
