大日本科研 List of Products and Services

In the exposure technology used in semiconductor manufacturing processes, micro-sensor (accelerometer, pressure sensor, temperature sensor, gas sensor) manufacturing processes, and printed circuit board manufacturing processes, the mainstream method involves using photomasks to transfer patterns onto substrates. On the other hand, the maskless exposure device "MX Series" employs a unique point array method using DMD (Digital Micromirror Device), allowing for direct exposure from CAD data. This exposure method, which does not use photomasks, achieves world-class exposure precision (below 1 micron). It facilitates easier prototyping and contributes to reductions in time and cost. 【Features】 ○ Expensive masks are no longer necessary ○ Prevention of external leakage of mask data ○ Reduced time from design of drawing patterns to actual drawing ○ Easy modification of drawing pattern designs ○ Correction of exposure patterns to match the distortion of each substrate is possible - For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment

【Main Features】 - A manual batch exposure device ideal for multi-variety, small-lot production and experiments/research. - Equipped with high-precision auto-alignment and backside alignment functions. - Capable of auto-alignment for cracked substrates. - Achieves space-saving by reducing the footprint. - UV-LED light source can be installed. - Recipe management function. - Operator assistance and log storage using a barcode reader.

• Other semiconductor manufacturing equipment

【Main Features】 - All functions are compactly integrated. - Equipped with a unique alignment system. - Operator assistance and production management using a barcode reader. - Compatible with higher-level communication systems. - Over 500 units sold for mass production.

• Other semiconductor manufacturing equipment

**Main Features** - Equipped with a self-developed mirror optical lamp house, achieving uniformity on the irradiation surface and high brightness. - Adopts a unique coaxial alignment method and high-speed image processing technology, enabling high-precision alignment. Compatible with IR methods and back-side methods. - Utilizes a proprietary optical gap sensor to set the proximity gap between the mask and substrate non-contactly with high speed and precision. - Equipped with a mask changer that can automatically exchange up to 20 photomasks. Up to 3 load ports can be installed.

• Other semiconductor manufacturing equipment