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We will be exhibiting at the Thermal Tech 2026 event held at the Osaka Industrial Creation Center. At this exhibition, we will introduce our unique material technologies to engineers who face challenges in material selection for high-temperature environments, focusing on polyimide sheets suitable for high heat resistance and insulation applications. As attendance is by prior registration, please apply through the related link before your visit, and we encourage you to stop by our booth. We sincerely look forward to your visit. ◆ Our main exhibition content - PI Plates (Polyimide Laminates) - SUS/Polyimide Substrates ◆ Exhibition Details ◆ Exhibition Name: Thermal Tech 2026 (Pre-registration required) Pre-registration Method: Please apply via the URL in the related link Date and Time: April 24, 2026 (Friday) 10:30 AM - 4:30 PM Venue: Osaka Industrial Creation Center, 3rd and 4th Floors (Reception on the 4th Floor)