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  1. Home
  2. Manufacturing and processing contract
  3. 河村産業
Manufacturing and processing contract
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河村産業

EstablishmentDecember 2, 1967
capital8000Ten thousand
number of employees260
addressMie/Yokkaichi-shi/330 Nishidaikōchō
phone059-337-1122
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last updated:Mar 01, 2023
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  • Products/Services(20)
  • catalog(27)
  • news(20)

河村産業 Company Overview

We provide top-level precision slitting processing and plasma treatment technology that we have developed over more than 50 years.

Our company specializes in insulation processing, electronic materials, and microfabrication, achieving high quality, high performance, and timely production through high technology and refined skills.

Business Activities

■Insulation Business - Slitting processing - Insulation material processing for automotive motors - Insulation material processing for industrial motors - Cutting processing - Board molding processing ■Electronic Materials Business - Slitting processing - Plasma surface treatment - Thermal lamination processing - Perforation processing - Cutting processing - Pure water washing processing - Clean coating processing - Sputtering processing ■In-house Developed Products - Adhesive-free laminated material 'Namli TM' - Transparent (soluble) polyimide 'KPI-MX300F' - Polyimide laminated board 'PI-Plate' - SUS/polyimide substrate 'KSH series' - Backup tape 'KT series' ■ISO Certification Obtained - ISO 9001: Obtained company-wide - ISO 14001: Obtained company-wide

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Products/Services (20)

Environmentally friendly "backup tape" made from recycled PET. product image
Environmentally friendly "backup tape" made from recycled PET.
Achieved a line resistance of 50Ω/m with a high aspect ratio! 'Transparent Low Resistance Circuit Processing' product image
Achieved a line resistance of 50Ω/m with a high aspect ratio! 'Transparent Low Resistance Circuit Processing'
"Vacuum Heat Press and Resin Coating on Metal Foil for Electronic Materials" [Kawamura Sangyo] product image
"Vacuum Heat Press and Resin Coating on Metal Foil for Electronic Materials" [Kawamura Sangyo]
Transparent (soluble) polyimide material 'KPI-MX300F' product image
Transparent (soluble) polyimide material 'KPI-MX300F'

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catalog(27)

Survey responses are required to view e-book details. Click to view the e-book.

Backup Tape HE-type

Backup Tape HE-type

PRODUCT
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Transparent Low Resistance Circuit Processing (Development Technology)

Transparent Low Resistance Circuit Processing (Development Technology)

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[Introduction Materials] We can do this! - Prototype and mass production of vacuum heat press

[Introduction Materials] We can do this! - Prototype and mass production of vacuum heat press

TECHNICAL
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[Introduction Materials] We can do this! - Resin Coating on Metal Foil

[Introduction Materials] We can do this! - Resin Coating on Metal Foil

TECHNICAL
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news(20)

20250514_094902667.jpg

Thank you for visiting the High-Performance Materials Week Osaka Exhibition - Recycle Tech Japan.

  • COMPANY

Thank you to everyone who visited our booth at the "High-Performance Materials Week Osaka Exhibition Recycling Tech Japan" held in Osaka from May 14 to 16, 2025. We will continue to provide technology to support you. We kindly ask for your continued patronage.

May 22, 2025

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We will exhibit at the High-Performance Materials Week Osaka held from May 14 to 16, 2025.

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We are pleased to announce that we will be exhibiting at the "High-Performance Materials Week Osaka - Recycle Tech Japan" held at Intex Osaka. We invite you to visit our booth when you attend. We look forward to seeing you. This time, we will mainly showcase unique polyimide materials. ◆ Exhibition Details ◆ Exhibition Name: Recycle Tech Japan [Osaka] *Registration is required for entry. Pre-registration Method: Please register using the URL from the related link. Date and Time: May 14 (Wed) to May 16 (Fri), 2025 Venue: Intex Osaka Remarks: We will be co-exhibiting at the booth of the Osaka Industrial Bureau. Booth Number: '8-48'

Apr 11, 2025

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Thank you for visiting the Adhesive Technology Exhibition 2024.

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Thank you to everyone who visited our booth at the Adhesive and Bonding Technology Exhibition 2024 held at the Osaka Industry Creation Center on May 24, 2024. We will continue to provide technology to support you. We kindly ask for your continued patronage.

May 27, 2024

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Detailed information

Company name 河村産業
number of employees260
Contact addresspostalcode 512-8052 Mie/ Yokkaichi-shi/ 330 NishidaikōchōView on map TEL:059-337-1122 FAX:059-337-1125
Industry Manufacturing and processing contract
河村産業 Building Image

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