We will exhibit at the High-Performance Materials Week Osaka held from May 14 to 16, 2025.

By simply dissolving the powder in a solvent and drying it, you can obtain a transparent and high-heat-resistant polyimide film!

Kawamura Industries' "KPI-MX300F" is a polyimide powder material that can dissolve in various solvents. The films obtained by dissolving in a solvent and then heating and drying have minimal coloring and high transparency, which is a significant feature. **Features of Kawamura Industries' "KPI-MX300F"** - Can dissolve in various solvents - Produces transparent, high-heat-resistant polyimide films - The resulting films have minimal coloring and high transparency *For property values, please refer to the PDF document or feel free to contact us.*

• Composite Materials
• Other polymer materials
• Organic Natural Materials

It is a heat-resistant laminated board that integrates polyimide film without adhesive.

Kawamura Industries' "Polyimide Laminate (PI-Plate)" is a laminate made by layering and thermally bonding polyimide film that has been activated on its surface through plasma treatment. **Features of Kawamura Industries' "Polyimide Laminate"** - Excellent heat resistance due to being adhesive-free → Continuous: 200°C / Short-term: 400°C - Exhibits excellent mechanical properties derived from polyimide film - Laminates can be produced in sizes up to 480mm x 1,100mm - Maximum thickness of 10mm (proven) *Please feel free to consult us regarding thicknesses over 10mm. *For examples of properties, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other polymer materials
• Other contract services

"5% weight reduction temperature is 534℃!" This is a stainless steel/polyimide substrate suitable for high-temperature planar heating heater applications, without the use of adhesives.

Kawamura Industries provides stainless steel/polyimide materials by leveraging the know-how of polyimide coating technology developed over many years on stainless steel foil. **Features of Kawamura Industries' "SUS/Polyimide Material"** - Excellent heat resistance due to being adhesive-free → 5% weight loss temperature (534°C) - High adhesion strength achieved through unique polyimide technology → Stainless steel/polyimide adhesion strength (2.4 kN/m) - Wide range of thickness options → Stainless steel thickness (15, 18, 20, 30, 50 μm) → Polyimide thickness (selectable between 5-25 μm) *For examples of properties, please refer to the PDF document or feel free to contact us.*

• stainless
• Composite Materials
• Other polymer materials

Features: ●Core 3 N355/N150 ●DDR5 SODIMM x 1 (up to 16GB) ●HDMI 1.4, VGA, LVDS ●2.5GbE x 3, SATA 6Gb/s, GPIO 8-bit ●USB 3.2 Gen 2 x 2, RS-232/422/485 x 2, RS-232 x 2 ●Mini PCIe x 1, M.2 2230 E-Key x 1, M.2 3052 B-Key x 1 ●DC input 9V～36V

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, DP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x 1, M.2 2230 E-Key x 1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Our company will be exhibiting at the "28th IoT & Edge Computing Expo [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday), 2026! We will showcase an AI compact edge PC equipped with NVIDIA's Jetson Thor, boards and PCs featuring Intel's Panther Lake and Bartlett Lake, a vending machine-type demo using ARM boards, as well as touch panel PCs, tablet PCs, and other peripheral devices. ■ Dates: April 8 (Wednesday) - April 10 (Friday), 2026 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, West Hall 3 ■ Booth Location: W22-22 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1606569853287533-WSW

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)