美方 Product Lineup

Mikata Co., Ltd. is a company that specializes in various label printing. We are also engaged in research and development of "resin die-cutting" technology, which is based on the skills cultivated through label printing, and we take pride in our top-class dimensional accuracy in Japan. Furthermore, our company conducts daily research and development to provide processing technologies that satisfy our customers. 【Business Activities】 ■ Processing and sales of mobile phone parts, LCD parts, electromagnetic wave shielding materials, sound-absorbing materials, cushioning materials, insulating materials, water purifier filters, composite products, quasi-drugs, various insulating materials, and other double-sided tapes. ■ Production of tape application jigs, tape application processing, punching processing (resin), and anti-splash film processing. ■ Sample cutting using CAD data (short lead time production). ■ Roll silk screen printing. ■ Character stickers (patented product). ■ TATTOO labels (tattoo stickers). ■ Display labels, product labels, distribution labels, lightweight labels, barcode number rings. ■ Various labels compatible with automatic applicators, submerged labels, security labels, and other types of labels. ■ Various stencil processing (cutting, etching), etc. ■ Non-metal slitting processing. *For more details, please contact us or download the catalog.

• Other contract services
• Label printing

At Mikata Co., Ltd., we propose a resin cutting process that allows for stress-free extraction of resin films. When processing adhesive materials and wrapping them, there can be adhesive overflow from the side of the adhesive material (cut surface) as it approaches the paper tube (core) section. However, our company has successfully implemented a wrapping technique to prevent this overflow. With this stress-free method, we have achieved minimal adhesive overflow and a cross-section with almost no burrs during the cutting process. 【Features】 ■ Almost no adhesive overflow occurs during the cutting process with our stress-free method. ■ Achieves a cross-section with almost no burrs. *For more details, please contact us or download the catalog.

• Other contract services

At Mikata Co., Ltd., we propose a resin cutting process that allows for stress-free extraction of resin films. When processing adhesive materials and wrapping them, there can be adhesive overflow from the side of the adhesive material (cut surface) as it approaches the paper tube (core) section. However, we have successfully implemented a wrapping technique that prevents overflow. 【Features】 ■ Almost no adhesive overflow occurs during the cutting process with our stress-free method. ■ Achieves a cross-section with almost no burrs. *For more details, please contact us or download the catalog.

• others