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スパッタリングコンポーネンツジャパン

capital300Ten thousand
number of employees2
addressChiba/Ichikawa-shi/Arai 3-25-14
phone050-3550-0824
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last updated:Aug 08, 2016
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スパッタリングコンポーネンツジャパン List of Products and Services

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Powder Dispenser SDM-1

Dispense the powder in accurate volume amounts.

The Powder Dispenser SDM-1 dispenses a predetermined volume of powder with high accuracy and reproducibility. It is designed to be very compact, making it easy to integrate into current workflows, and it does not require a power source. The SDM-1 can be set to dispense amounts ranging from 5mg to 250mg per portion.

  • Other powder equipment
  • Powder Supply Device
  • Other laboratory equipment and containers

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Powder Dispenser SDH-1

It is a handheld powder dispenser that dispenses a predetermined volume with high precision.

The handheld powder dispenser SDH-1 can dispense a predetermined volume of powder with high precision and high reproducibility. If the bulk density of the powder is known, it is also possible to dispense by weight conversion.

  • Other powder equipment
  • Powder Supply Device
  • Other laboratory equipment and containers

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Powder Dispenser SDB-1

Dispense the powder in precise volumetric amounts.

The desktop powder automatic dispenser SDB-1 can dispense a specified volume of powder with high precision and reproducibility. The dispensing speed is 2.5 to 3.5 seconds per dispense. The dispenser head is interchangeable, and the small dispensing head can discharge amounts ranging from 5mg to 250mg (depending on bulk density) at once, with the possibility of multiple discharges. The large particle dispensing head can discharge amounts from 5mg to 5g at once, also allowing for multiple discharges. The LED display shows the amount of powder dispensed. The power supply for the SDB-1 is provided via an AC socket, and it can switch between 115V and 230V.

  • Powder Supply Device
  • Other powder equipment
  • Dispenser

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Air-cooled small-sized sputtering power supply

It is a compact air-cooled sputtering power supply manufactured by ADL in Germany.

The "GS Series: GS05-GS30" includes a total of 11 models covering capacities from 0.5 kW to 3 kW. These products are primarily targeted at small sputtering devices for research and development purposes. All models are air-cooled, eliminating the need for cumbersome cooling water.

  • Other semiconductors
  • Other optical parts
  • End Mills

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Cylindrical ITO target

This is a cylindrical ITO sputtering target made by Yumicoa, a pioneer in cylindrical ITO targets.

Features: - Composition: Of course, 90wt% In2O3 - 10wt% SnO2, but we can flexibly accommodate SnO2 composition ratios from 1wt% to 20wt%. - Can be manufactured up to 670 mm in length without division. - Available in flat and disc shapes.

  • Other consumables

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Rotary magnetron

The U.S. SCI-made rotary magnetron cathodes have a delivery record of approximately 3,000 units worldwide.

Sputtering Components Inc., commonly known as SCI, was established in 2001 in Owatonna, Minnesota, USA. As of 2015, SCI's rotary magnetron cathodes have been delivered approximately 3,000 units worldwide. Their applications include various uses such as Low-E glass for construction, solar cells, electrode films for displays, and anti-reflective films, among others, at various customer sites. Our company, Sputtering Components Japan Co., Ltd., commonly known as SCJ, serves as the sales base in Japan for SCI products and the cylindrical and planar targets manufactured by our sister company, PMI.

  • Vacuum Equipment
  • Organic EL
  • LCD display

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Cylindrical target

We offer high-quality cylindrical targets, planar targets, and deposition materials for sputtering equipment at reasonable prices.

The following methods will be used to produce cylindrical targets. 1. Method: Integrated extrusion of melting materials Typical materials: Ti, Al, Cu Advantages: No risk of breaking, can rotate at low speeds Disadvantages: No high-purity products available 2. Method: Plasma spray Typical materials: Si, Ag, ZnAl, etc. Advantages: Relatively low risk of breaking, inexpensive Disadvantages: Difficult to achieve high-purity products above 5N, prone to defects, takes time to start up Note: Initial startup time can be shortened depending on the surface finishing method 3. Method: Cold spray Typical materials: Ag, etc. Advantages: Relatively low risk of breaking, can be sprayed directly onto used targets. Disadvantages: More expensive than plasma spray method. Takes time to start up. Note: Same as above 2 4. Method: Indium bonding of cast targets Typical materials: Special alloys, etc. Advantages: High-purity products are possible. Disadvantages: Risk of arcing from cuts. Can break or melt indium at low rotation speeds. Expensive. Low power input limit. 5. Method: Indium bonding of sintered targets Typical materials: ITO, AZO, etc. Advantages: High-purity products are possible. No restrictions on materials. Disadvantages: Same as above 4.

  • Vacuum Equipment
  • Touch Panel
  • Organic EL

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