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  1. Home
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  3. TDK テクニカルセンター
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TDK テクニカルセンター

addressChiba/Ichikawa-shi/2-15-7 Higashiyamato
phone047-378-9090
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last updated:May 25, 2016
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FOUP Load Port "TAS300"

Exhibits stable high performance even with repeated long-duration door opening and closing operations! Excellent durability of the load port.

The "TAS300" is a standard load port designed to automatically open and close FOUPs (Front Opening Unified Pods) used in semiconductor manufacturing processes, and is installed on various semiconductor manufacturing equipment. It boasts top-class performance in terms of low particle generation, high throughput, and durability for repeated operations, which are required by semiconductor manufacturing equipment. All moving parts, including the mapping unit, are located below the wafer surface, achieving a high level of particle-free operation through thorough airflow analysis. 【Features】 ■ Reliable opening and closing of a wide variety of FOUPs without individual adjustments ■ Optional installation of a mapping unit (transmissive sensor) ■ Excellent durability that maintains stable high performance even after prolonged repeated door opening and closing ■ Equipped with an obstacle detection function during FOUP docking ■ Equipped with a FOUP presence detection function and normal placement detection function when FOUP is loaded ■ A positioning mechanism is installed on the BOLTS surface to reduce the time for load port attachment and detachment *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Other clean room equipment and facilities

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FOUP Load Port "TAS450"

The load port is moving to a new stage. The movable parts have a structure that enhances particle performance.

The "TAS450" is a standard load port designed to automatically open and close FOUPs (Front Opening Unified Pods) used in semiconductor manufacturing processes, and it can be installed on various semiconductor manufacturing equipment. It offers top-class performance in terms of low particle generation and high throughput, which are required by semiconductor manufacturing equipment. 【Features】 ■ SEMI Standard E154 ■ All moving parts, including the mapping unit, are located below the wafer surface, enhancing particle performance ■ Mapping unit (transmissive sensor) can be optionally installed ■ Equipped with obstacle detection functionality during FOUP docking ■ Equipped with FOUP presence detection and proper placement detection functionality when FOUP is loaded *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Other clean room equipment and facilities

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FOUP Load Port "TAS300 Type-4E"

Thorough cleaning performance, reliable design! 45nm clean technology.

The "TAS300 Type-4E" is a FOUP load port designed with thorough equipment cleanliness and non-contact operation for wiring and piping during operation. It minimizes the generation of microscopic particles to the extreme. In PWP testing, it has achieved world-class levels. Additionally, a unique mechanism that accommodates minute differences (tolerances) for each FOUP prevents collisions between the FOUP and the load port, ensuring secure latch key insertion and achieving high compatibility. 【Features】 ■ Achieves the highest level of cleanliness in the industry ■ High compatibility with various manufacturers' FOUPs ■ Improved maintainability ■ High reliability and durability *For more details, please download the PDF or contact us.

  • Other clean room equipment and facilities

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Flip Chip Assembly System "AFM-15"

For small and medium devices! Industry-leading performance in flip chip bonding.

The "AFM-15" is a flip chip mounting system ideal for small to medium-sized devices. We have identified the needs of production sites from the customer's perspective and turned them into products. This system realizes ideals such as high speed, high reliability, space-saving, and low cost. Additionally, we also offer the "MDM-50," which is optimal for high-precision, small-quantity, and quantitative coating applications. 【Features】 ■ High speed ■ High reliability ■ One of the smallest device sizes in the industry ■ Low-energy bonding ■ Compatible with 12-inch wafer supply *For more details, please refer to the catalog or feel free to contact us.

  • Other mounting machines

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