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JMT

EstablishmentJune 10, 1988
capital5000Ten thousand
addressSaitama/Hidaka-shi/Saruta 289-1
phone042-985-8855
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last updated:Oct 07, 2025
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Test socket Test socket
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LID Less Socket for Semiconductors

Optimal for optical testing, achieving high speed with a lidless structure.

In the semiconductor industry, the acceleration of image sensors and other technologies is progressing, increasing the importance of optical testing. In traditional socket structures, the pressurized LID can hinder the entry of light, potentially obstructing accurate measurements. The LID Less Socket ensures conductivity by attracting the package from the backside in a vacuum and distorting the contactor. Without a pressurized LID, light intake becomes unrestricted, contributing to faster speeds. 【Usage Scenarios】 - Measurement of image sensors - Evaluation of optical characteristics - Testing of semiconductor devices requiring high-speed data transfer 【Benefits of Implementation】 - Improved accuracy of optical testing - Greater design flexibility for sockets - Potential cost reduction

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Socket for Advanced Package for IoT

We propose affordable measurement of high-performance, multi-pin packages that fuse various chips.

In the IoT industry, the miniaturization and high performance of devices are advancing, leading to a demand for multi-pin semiconductor packages and support for high-speed data communication. Stable connectivity and high reliability are crucial factors that influence the performance of IoT devices. Advanced package sockets leverage the characteristics of PCR sockets to achieve stability and cost efficiency in multi-pin connections. 【Usage Scenarios】 - Testing high-performance chips for IoT devices - Situations requiring stable connections for multi-pin packages - Inspection of IoT devices that require high-speed data communication 【Benefits of Implementation】 - Improved reliability of testing due to stable contacts - Realization of cost-efficient multi-pin connections - Compatibility with a variety of IoT devices

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Socket for Advanced Package for AI

Affordable proposal for measuring high-performance, multi-pin packages.

For AI and big data processing, high-performance and high-density advanced package semiconductor testing requires multi-pin support and high-speed operation. A measurement method that can achieve stable contact and cost efficiency is essential. PCR sockets provide stable contact through short-distance connections and cost benefits through multi-pin support. They also accommodate warping of large packages, alleviating concerns about insufficient stroke. 【Use Cases】 - Testing high-performance chips for AI - Package testing for chiplet structures - Testing packages with a high number of pins 【Benefits of Implementation】 - Realization of stable electrical connections - Cost-effective testing solutions - Capable of handling packages with over 10,000 pins

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Socket for Advanced Packages for Communication

Achieve low-cost measurement of multi-pin packages and contribute to bandwidth expansion.

In the telecommunications industry, with the spread of high-speed communication standards such as 5G and 6G, bandwidth expansion has become a crucial challenge to accommodate the increase in data transfer volume. High-performance chips that adopt advanced packaging (such as chiplet structures) support this bandwidth expansion, but measuring them requires measurement methods that can handle multiple pins and operate at high speeds. PCR sockets enable stable contact and cost efficiency, making it possible to measure multi-pin packages. They provide stable contact through short-distance connections and cost benefits, contributing to the performance improvement of communication infrastructure. 【Use Cases】 - 5G/6G base stations - Data centers - High-speed communication devices 【Benefits of Implementation】 - Stable measurement of multi-pin packages - Improved cost efficiency

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Socket for Advanced Package for Automotive Use

For high-performance, multi-pin package measurement for miniaturized automotive electronic devices.

In the automotive industry, there is a simultaneous demand for miniaturization and high performance of in-vehicle electronic devices. Particularly with the evolution of ADAS (Advanced Driver Assistance Systems) and autonomous driving technology, the reliability evaluation of densely packaged semiconductor packages has become crucial. To pack more functions into limited space, the adoption of multi-pin packages is increasing. Sockets for advanced packages have been developed to meet these needs. 【Usage Scenarios】 - Testing of in-vehicle ECUs - Evaluation of ADAS-related devices - Reliability testing of automotive SoCs 【Benefits of Implementation】 - Stable measurement of multi-pin packages - Compatibility with miniaturized devices - Provision of cost-effective measurement solutions

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Socket for Advanced Packages for Data Centers

Achieving high-density package measurement at a low cost. Balancing stable contact and cost efficiency.

In the data center industry, there is an increasing demand for high-performance and high-density semiconductor packages due to the rise of AI and big data processing. In the testing of these packages, multi-pin support and high-speed operation are essential. It is important to have measurement methods that ensure stable electrical connections while also achieving cost efficiency. Our "Advanced Package Socket" utilizes PCR technology to achieve short-distance connections and stable contact, providing cost advantages in multi-pin package testing. It also accommodates warping in large packages, alleviating concerns about insufficient stroke. 【Use Cases】 - Testing of high-density packages - Measurement of multi-pin packages - Testing of chips for AI and big data processing 【Benefits of Implementation】 - Ensuring stable electrical connections - Improving cost efficiency - Supporting high-speed operation testing

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Automotive IC Measurement Board Damage Protection Tool

Protects the measurement board from damage to the pad of the probe pin socket, improving reliability.

In automotive electronic components, stable measurements during the inspection process are essential under a strict quality assurance system. In particular, automotive electronic devices must withstand harsh environments, requiring high reliability. Damage to the substrate pads from probe pin sockets during IC measurements can lead to failures or performance degradation of the measurement board, potentially compromising reliability. The Board Protector is placed between the probe pin and the measurement board to avoid physical damage to the pads, ensuring the longevity of the measurement board and stable contact. 【Usage Scenarios】 - Quality inspection of automotive electronic components - Reliability testing - Quality control in production lines 【Benefits of Implementation】 - Cost reduction through the longevity of measurement boards - Avoidance of pad repair work and line stoppages - Improved inspection accuracy due to enhanced contact stability

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IC Measurement Board Damage Protection Tool for IoT Devices

Protecting the measurement board of small IoT devices from pad damage.

In the IoT device industry, products are becoming smaller, and as a result, the pads on measurement boards are also becoming finer. Repeated contact with probe pins can damage the pads, necessitating repair work and the preparation of spare boards, which can decrease development efficiency. The Board Protector is placed between the probe pins and the measurement board to avoid physical damage to the measurement board. 【Usage Scenarios】 - Mass production testing of small IoT devices - Inspection of high-density mounted boards - Reliability testing 【Benefits of Implementation】 - Extended lifespan of measurement boards - Reduced repair work and costs for pads - Avoidance of line stoppages

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High-frequency measurement test socket for IoT wireless applications

Solving high-frequency measurement challenges for high-speed wireless communication in the 5G/6G era.

The wireless communication technology in the IoT field is becoming increasingly advanced, with a growing demand for high-speed data communication. In this area, the miniaturization and high performance of devices are progressing, making accurate measurement of high-frequency characteristics essential. In particular, accurate transmission and measurement of high-frequency signals are required in testing wireless communication modules and antennas. The PCR socket addresses the challenges in high-frequency measurements through freely designed electrode diameters and short-distance connections, enabling stable measurements. It is also capable of measuring in the millimeter wave band. 【Usage Scenarios】 - Evaluation and verification of wireless communication devices for IoT - Design verification of semiconductor devices requiring high-frequency and millimeter wave measurements 【Benefits of Implementation】 - Accurate measurement of high-frequency characteristics - Realization of a stable measurement environment

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High-frequency measurement test socket for ADAS

High-frequency measurement socket compatible with 5G/ADAS high-speed communication.

ADAS (Advanced Driver Assistance Systems) requires high-speed data communication and high-precision semiconductor technology to enhance the safety and performance of vehicles. With the evolution of ADAS systems, the importance of high-frequency measurements in semiconductor testing is increasing. Our high-frequency measurement test sockets contribute to solving the challenges of high-frequency measurements and ensuring the reliability of ADAS systems. 【Application Scenarios】 - Testing of vehicle radar equipped with ADAS - Evaluation of millimeter-wave radar modules - Characterization of semiconductors for high-speed data communication 【Benefits of Implementation】 - Improved reliability of ADAS systems - Ensured stability of high-frequency measurements - Support for diverse ADAS applications

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High-frequency measurement test socket for semiconductor packages

High-frequency measurement socket compatible with high-speed communication in the 5G/6G era.

In the semiconductor industry, with the spread of high-speed communication standards such as 5G and 6G, accurate measurement of high-frequency characteristics is essential. To maximize the performance of packages (PKG), precise measurements during the testing process are crucial, and there is a demand for improved measurement accuracy and stability. PCR sockets address challenges in high-frequency measurements through freely designed electrode diameters and short-distance connections, enabling stable measurements. They are also capable of millimeter-wave measurements. 【Application Scenarios】 - Characterization evaluation of 5G/6G compatible packages - Quality inspection of high-speed data communication packages - Testing of packages for ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Improved stability in high-frequency measurements - Reduced measurement time - Enhanced product quality

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High-frequency measurement test socket for data centers

5G/6G compatible! PCR socket that solves high-frequency measurement challenges for servers.

In data center servers, high-speed communication and stable operation are essential. With the spread of 5G/6G, semiconductor devices within servers are also becoming faster, and high-frequency measurements are crucial for their testing. To ensure accurate measurements, a reliable test socket is required. PCR sockets solve challenges in high-frequency measurements through freely designed electrode diameters and short-distance connections, achieving stable measurements. They are also capable of millimeter-wave measurements. 【Usage Scenarios】 - High-frequency characteristic evaluation of semiconductor devices for servers - Evaluation and verification of high-speed communication devices intended for data center applications - Design verification and reliability evaluation of high-speed compatible devices 【Benefits of Implementation】 - Improved evaluation accuracy and quality through stable high-frequency measurements - Accurate evaluation and verification of high-speed communication device performance - Contribution to the realization of highly reliable data center systems

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High-frequency measurement test socket for communication.

High-frequency measurement sockets supporting signal quality in the 5G/6G era.

In the telecommunications industry, with the spread of 5G/6G, there is a demand for high-speed and large-capacity data communication. Deterioration of signal quality can lead to reduced communication speeds and connection failures, resulting in decreased customer satisfaction. High-frequency measurement test sockets achieve stable measurements through freely designed electrode diameters and short-distance connections, addressing signal quality issues. They are also capable of millimeter-wave measurements. 【Usage Scenarios】 - Signal quality evaluation of 5G/6G compatible devices - Performance evaluation of high-speed communication equipment - High-frequency characteristic evaluation in the millimeter-wave band 【Benefits of Implementation】 - Improved product quality through high-precision measurements - Cost reduction through early detection of defective products - Compliance with high-speed communication standards

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Socket for System Level Testing (SLT) for Communication

Achieve characteristic verification close to the implementation state with short-distance connections.

In the telecommunications industry, with the spread of high-speed data communication, the speed and reliability of devices are becoming increasingly important. System Level Testing (SLT) is essential to meet these demands. In SLT, conducting accurate characterization evaluations in an environment close to the implementation state is crucial for maximizing product performance and reducing time to market. PCR sockets enable characterization evaluations in conditions close to the implementation state through short-distance connections and surface contact, contributing to the improvement of speed and reliability in communication devices. 【Use Cases】 - Design verification of high-speed communication devices - System level testing - Failure analysis 【Benefits of Implementation】 - More accurate data acquisition through characterization evaluation close to the implementation state - Minimization of characteristic loss, achieving stable measurements - Improved product reliability and shortened development periods

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SLT socket for data centers

Contributing to the efficiency of data centers through characteristics verification close to the implementation state.

In data centers, the reliability of equipment and efficient operations are essential. System Level Testing (SLT) is crucial to meet these demands, but accurate measurements are required. PCR sockets can verify characteristics in a state close to the implementation condition due to short-distance connections and surface contact. This enables stable measurements in conditions similar to actual equipment, contributing to efficient system operations. 【Use Cases】 - Characterization evaluation of servers and network equipment - Testing of high-density implemented circuit boards 【Benefits of Implementation】 - Improved reliability through high-precision measurements - Efficient system operations

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Socket for SLT for semiconductors

Achieve characteristic verification close to the implementation state with short-distance connections.

In the semiconductor industry, product reliability is one of the most important challenges. In particular, system-level testing (SLT) requires evaluating product performance in conditions that closely resemble actual usage environments. Unreliable measurements can lead to early product failures or performance degradation. Our sockets for SLT leverage the advantages of short-distance connections, allowing for characteristic verification in conditions close to the implementation state. This enables a more accurate reliability assessment. 【Usage Scenarios】 - Design verification - System-level testing - Failure analysis 【Benefits of Implementation】 - More accurate characteristic evaluation through measurements close to the implementation state - Reduced characteristic loss, achieving stable measurements - Improved reliability through verification of detailed characteristic data

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High-Frequency Measurement Test Socket for the Telecommunications Industry

High-frequency measurement sockets supporting signal quality in the 5G/6G era.

In the telecommunications industry, with the spread of 5G/6G, there is a demand for high-speed and large-capacity communication, making the maintenance of signal quality crucial. Accurate measurements are essential in testing high-frequency devices, and even slight signal degradation is unacceptable. The PCR socket addresses challenges in high-frequency measurements through free design of electrode diameter and short-distance connections, enabling stable measurements. It is also capable of millimeter-wave measurements. 【Usage Scenarios】 - Characterization evaluation of 5G/6G compatible devices - Quality inspection of devices for base stations - Signal integrity measurement for high-speed transmission lines 【Benefits of Implementation】 - Improved product quality through accurate measurement of high-frequency characteristics - Reduced development time by achieving a stable measurement environment - Compatibility with a wide frequency range, including the millimeter-wave band

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What is a pressurized conductive sheet that allows for stable electrical testing? *Technical materials available.

A sheet socket that enables stable inspection in semiconductor back-end process inspection! What is "PCR" that allows for high-speed and high-density measurements? Technical materials on operating principles and more will be provided!

Sheet Socket PCR (Pressure-sensitive Conductive Rubber) is a pressure-contact conductive sheet connector with metal particles aligned in the thickness direction. By applying pressure to the electrodes, the metal particles inside the sheet come into contact with each other, forming numerous conductive pathways. This achieves low contact resistance and high signal stability compared to spring pins and other conductive rubber applications! Additionally, its structure allows for solderless connections, minimizing damage to the device under test (DUT) and measurement substrates. It has a high tolerance for positional misalignment, enabling stable connections even in fine pitch and multi-pin environments. Adoption is progressing in a wide range of applications, including advanced packages, chiplets, SoC/memory evaluation, and BtoB connections. 【Features】 ■ Does not damage solder balls or measurement substrates! ■ Exhibits excellent performance in high-frequency testing ■ Offers superior cost advantages in fine and multi-pin package testing ■ Easy maintenance due to its simple structure You can download technical materials that clearly explain the "operating principle" and "PCR" in the PDF download. *For more details, please download the PDF or contact us directly.

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What is a test contactor sheet socket/PCR?

Supports various testing processes! Sheet socket "PCR" enables high-speed and high-density measurements.

PCR (Pressure-sensitive Conductive Rubber) is a pressure-conductive sheet contactor with metal particles aligned in the thickness direction. By applying pressure to the electrodes, the metal particles inside the sheet come into contact with each other, forming numerous conductive pathways. This results in lower contact resistance and higher signal stability compared to conventional spring pins and general conductive rubber. Additionally, its structure allows for solderless connections, minimizing damage to the device under test (DUT) and measurement substrates. It has a high tolerance for positional misalignment, enabling stable connections even in fine pitch and multi-pin environments. With a short contact length, it reduces reflection loss and impedance variation, resulting in excellent waveform reproducibility and measurement data stability in the high-frequency range. Due to these characteristics, PCR is increasingly being adopted for a wide range of applications, including advanced packaging, chiplets, SoC/memory evaluation, and BtoB connections.

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LID Less Socket

We can propose a socket structure that does not require LID for measurements such as image sensors that need optical testing.

In measurements such as those involving image sensors, it is essential to incorporate light; however, in a typical socket structure, the presence of a pressurized LID can create a situation where light has difficulty entering. To address this issue, PCR has developed a LID LESS socket that distorts the contactor by attracting the package from the backside in a vacuum, allowing for conduction. The absence of a pressurized LID enables free light intake, eliminating constraints in socket design. Additionally, the lack of a LID simplifies and reduces the cost of the socket, making it feasible for cost reduction efforts beyond just image sensor measurement applications. However, since the pressure is determined by atmospheric pressure, there may be cases that cannot be accommodated depending on the size and pin count of the semiconductor package. For detailed specifications, we will conduct individual designs for each project, so please feel free to contact our company for inquiries.

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Socket for System Level Testing (SLT)

By leveraging the advantages of short-distance connections, it is possible to conduct characteristic verification in a state close to the implementation status.

The PCR socket is a sheet contact type, allowing for short-distance connections that make contact with the target object over a surface (area). The connection state is close to that of the implementation state, and with minimal characteristic loss, it enables stable measurements that are closer to the actual equipment. Therefore, it can be applied in applications that require detailed characteristic data verification, such as design validation, system-level testing, and failure analysis. The shape can also be freely designed, allowing measurements on actual products where socket installation is difficult (a pressure mechanism needs to be considered separately). For detailed specifications, individual designs will be conducted for each project, so please feel free to contact our company representative.

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Short-distance connection connector

Leveraging the advantages of short-distance connections, we will replace the connections that only had implementation solutions with a socket-based approach.

We will replace the top and bottom connections of the circuit board, which were previously soldered, with a socket method. This allows for easy insertion and removal, making maintenance simpler. Additionally, since soldering will not be performed, there will be no damage to the circuit board from heat, allowing for an extended lifespan of the board. The connection length will be comparable to that of soldered connections, and there are no concerns regarding characteristic loss. We will improve the variability of manual soldering with a contact sheet that has absorption capabilities. For detailed specifications, we will conduct individual designs for each project, so please feel free to contact our company representative.

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IC measurement substrate damage protection tool

Protects the measurement board from damage to the pad of the probe pin socket. Enables the operation of expensive measurement boards without the need for maintenance.

When probe pin sockets are applied, there may be situations where damage occurs to the terminals of the measurement board, necessitating pad repairs. Pad repairs require both cost and time, and there may be cases where spare boards need to be prepared. By applying JMT's board damage protection tool, we can eliminate damage to important measurement boards and reduce the costs and time associated with repair work. Additionally, we can propose stable contacts by applying distributed PCR at the connection points between the socket board and the measurement board. The board damage protection tool receives the connection with the probe pin through a socket board (top and bottom conductive board), and by replacing this socket board, we eliminate damage to the measurement board. *The JMT board protection is approximately 0.3mm thick and can be used without significant characteristic loss. For detailed specifications, we will conduct individual designs for each project, so please feel free to contact our company representative.

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High-frequency IC measurement PCR sheet (distributed PCR)

Distributed PCR is a sheet-type semiconductor test contactor that can connect to all points in the plane without the need for positioning.

This is a conductive sheet that randomly incorporates conductive particles into a thin silicone rubber. By applying pressure (distorting it), the conductive particles within the sheet come into contact and create conductivity in the vertical direction. Since the areas that are pressed (distorted) conduct electricity, the entire surface can act as an electrode, allowing for use without the need for positioning. Additionally, when combined with a ProbePin socket, it is expected to reduce pin damage to the measured object. However, please understand that the operating environment is limited to room temperature, and there may be differences in resistance values depending on the connection points. For more detailed information, please feel free to contact our company.

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Characteristic verification socket

PCR sockets leverage the advantages of short-distance connections and can be applied in various applications that require detailed characteristic data verification.

The PCR socket is a sheet contact type, allowing for short-distance connections that make contact with the target object over a surface (area). The connection state is close to the condition during implementation, and the small characteristic loss enables stable measurements that are closer to the actual device. Therefore, it can be applied in cases where detailed characteristic data verification is necessary, such as design verification, system-level testing, and failure analysis. The shape can also be freely designed, allowing measurements on actual products where socket installation is difficult (a pressure mechanism needs to be considered separately). For detailed specifications, individual designs will be conducted for each project, so please feel free to contact our company representative.

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High-frequency measurement test socket

As communication generations progress with 5G, 5G-Advanced, and 6G, the PCR socket addresses the challenges of high-frequency measurements in the demand for increased speed.

As a wide range of devices become increasingly connected to the internet, the demand for high-speed communication continues to expand. At the same time, with the rapid advancement of Advanced Driver Assistance Systems (ADAS), the need for high-performance semiconductors is growing significantly. However, testing these high-specification semiconductors presents various technical challenges, requiring more stable and reliable testing solutions. The PCR socket addresses these challenges by enabling flexible electrode diameter design and leveraging the advantages of short-distance signal paths. This ensures stable and accurate measurement performance, even under demanding conditions. We also provide solutions for millimeter-wave measurement requirements. For detailed specifications, we offer fully customized designs tailored to each project. Please feel free to contact our representative for further information.

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Socket for advanced packages

We can offer affordable measurements of high-performance, multi-pin packages that integrate various chips.

Advanced packages that handle AI and big data are expected to become even more high-performance and see increased demand due to chiplets. The measurement of these high-performance advanced packages requires stable contacts with high-speed operation and multiple pins. The only method that can achieve both is PCR. PCR sockets leverage the advantages of sheet contact to realize stable connections over short distances while offering cost benefits for multiple pins. To address warping issues common in large packages, we adjust the contact positions at the center and outer edge on the PCR side, alleviating concerns about insufficient stroke length. For detailed specifications, we conduct individual designs for each project, so please feel free to contact our office. (We can also accommodate packages exceeding 10,000 pins.)

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IC test socket

IC testing is possible from fine pitch to large packages using a test socket with a sheet-type contactor that can be easily attached.

This is a high-performance test socket using a sheet-type contactor (PCR). It can be proposed for various applications, ranging from small ICs with fine pitches to large advanced packages. By using PCR, the structure becomes simpler, making maintenance easier. The socket's pressure structure can be customized to meet customer requirements, including clam-shell type, dual-side latch, and screw-fixed types. We can accommodate requests starting from one unit and provide it in a short delivery time (approximately three weeks after the request). For detailed specifications, we conduct individual designs for each project, so please feel free to contact our company representative.

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Semiconductor package test contactor PCR

This is a sheet-type contactor that achieves advanced measurements at low cost. It allows for stable connections without damaging the measurement object or the measurement board.

PCR is a pressure-sensitive conductive contact sheet that aligns conductive particles in the thickness direction of the sheet using a special method. By applying pressure to the electrode area where the conductive particles are arranged, the particles come into contact with each other, forming multiple conduction paths that maintain stable electrical characteristics. Since the main material is silicone rubber, it can be operated without damaging the IC package and measurement board during contact. Additionally, because PCR uses surface contact, it allows for a large tolerance for positional misalignment. Leveraging the advantages of short-distance connections, it is ideal for measuring high-end products with high-frequency requirements. When pressure is applied to PCR, countless conductive paths are formed instantaneously, achieving exceptional stability and unparalleled electrical reliability. Due to the very short connection distance, PCR enables the speed and precision required for high-frequency and high-performance testing. PCR test sockets can be custom-designed, allowing us to propose shapes and structures tailored to customer requirements. They excel in balancing cost efficiency and reliability, making them ideal for testing various types of semiconductor packages.

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Test solution "PCR"

Test solution that does not damage solder balls or measurement substrates with soft contact!

"PCR" is an optimal test solution for high-spec packages aimed at the upcoming 5G and IoT era. It demonstrates excellent performance in high-frequency testing that requires low inductance, low resistance, and low contact characteristics. Additionally, its simple structure allows for easy maintenance, reducing downtime during socket replacement and enabling productivity improvements. 【Features】 ■ Does not damage measurement substrates, etc. ■ Excellent price competitiveness ■ Easy maintenance ■ Potential for productivity improvement *For more details, please request documentation or view the PDF data available for download.

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