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  3. 河口・サポート 名古屋事務所
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河口・サポート 名古屋事務所

addressAichi/Midori-ku, Nagoya-shi/Ura 2-11
phone052-558-9235
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last updated:Mar 28, 2025
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PL BIOSCIENCE Culture medium made from human platelets. PL BIOSCIENCE Culture medium made from human platelets.
輸入ワイン 輸入ワイン
LEVPROT Solutions for the Pharmaceutical Industry Using Precision Fermentation Technology for Proteins LEVPROT Solutions for the Pharmaceutical Industry Using Precision Fermentation Technology for Proteins
CARLROTH Corporation, imported reagents, imported scientific and laboratory equipment CARLROTH Corporation, imported reagents, imported scientific and laboratory equipment
Ero Clamp Ero Clip Ero Clamp Ero Clip
Pump and filter (Hender Company, Netherlands) Pump and filter (Hender Company, Netherlands)
Plating and anodizing power supply (Germany, PE Company) Plating and anodizing power supply (Germany, PE Company)
Plastic piping fittings, valves, flow meters (FIP) Plastic piping fittings, valves, flow meters (FIP)
Barrel-related for input plating (Germany, Chavichike Co.) Barrel-related for input plating (Germany, Chavichike Co.)
Semiconductor plating-related (chemicals for plating from Dutch company MECO, etc.) Semiconductor plating-related (chemicals for plating from Dutch company MECO, etc.)
Semiconductor

Semiconductor plating-related (chemicals for plating from Dutch company MECO, etc.)

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and plating related to connectors, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies.

MECOSTRIP AU-2 Process Documentation (English Version)

Back stripping agent for selective flash gold plating developed for continuous plating equipment and hoop plating equipment.

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and connector plating-related applications, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is a back stripping agent developed for selective flash gold plating for continuous plating equipment and hoop plating equipment. It can be used with potassium cyanide (cyanide). For more details, please download the PDF (technical documentation in English).

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MECOJET AMS Process Document (English Version)

This is a selective silver plating process for semiconductor sheets.

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and plating related to connector plating, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is a selective silver plating process for semiconductor sheets. For more details, please download the PDF (technical documentation in English).

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MECOSTRIP CPL AGCU Process Documentation (English Version)

This is an electrolytic stripping agent developed for stainless steel belts used in continuous plating devices and hoop plating devices to strip silver and copper.

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and connector plating-related applications, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is an electrolytic stripping agent developed to remove silver and copper from stainless steel belts used in continuous plating systems and hoop plating systems. For more details, please download the PDF (technical documentation in English).

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SURCLEAN 201-204 Process Documentation (English Version)

It is a pretreatment material used mainly in Japan for selective silver plating processes for semiconductor sheets.

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and plating related to connectors, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. Mainly used domestically in Japan, it is a pretreatment material for the selective silver plating process for semiconductor sheets. For more details, please download the PDF (technical documentation in English).

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