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This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and connector plating-related applications, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is a back stripping agent developed for selective flash gold plating for continuous plating equipment and hoop plating equipment. It can be used with potassium cyanide (cyanide). For more details, please download the PDF (technical documentation in English).

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and plating related to connector plating, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is a selective silver plating process for semiconductor sheets. For more details, please download the PDF (technical documentation in English).

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and connector plating-related applications, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is an electrolytic stripping agent developed to remove silver and copper from stainless steel belts used in continuous plating systems and hoop plating systems. For more details, please download the PDF (technical documentation in English).

This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and plating related to connectors, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. Mainly used domestically in Japan, it is a pretreatment material for the selective silver plating process for semiconductor sheets. For more details, please download the PDF (technical documentation in English).