大洋電産 Product Lineup

This product is a semiconductor test handler integrated device using contact probes. It retrieves strip-shaped lead frames from the stacker magazine, processes the products into individual pieces with a lead processing device, and tests them using contact probes. The products in the testing section are transported using suction hands, and most of the transportation is numerically controlled by servo motors, allowing for settings and adjustments via a touch panel. Additionally, our company has various manufacturing achievements in high-temperature environments and more. 【Features】 ■ Products are processed into individual pieces by the lead processing device ■ Tested using contact probes ■ Transportation by suction hands ■ Settings and adjustments possible via touch panel ■ Various manufacturing achievements, including in high-temperature environments *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing
• Testing Equipment and Devices

We handle the tray cleaning device "Hurricane." The "Hurricane" is a tray cleaning device that cleans trays used for storing semiconductor products with air blow. Trays can be supplied stacked in multiple layers and are automatically taken out and cleaned one by one. The cleaned trays can be stored stacked in the same way as when they were supplied. 【Features】 ■ Cleans trays with internal circulation air blow ■ Trays can be supplied stacked in multiple layers ■ Cleaned trays can be stored stacked ■ Tray thickness can be adjusted as needed ■ Custom specifications are also available *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning tools

The "Automatic Rubber Plug Device" is a machine that automatically inserts rubber plugs on one side of sticks (tubes) stacked in a tower. We also accommodate special specifications and offer an option for automatic switching for product changeovers. Additionally, we handle a "Packing Device" that automatically packs a specified number of products supplied from parts feeders and other sources. 【Features】 ■ Capable of accommodating specifications such as built-in image inspection mechanisms and marking mechanisms ■ Option for automatic switching for product changeovers available (consultation required) ■ Accommodates special specifications *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Laser Resin Removal Device" is a device designed to remove excess black resin parts from various semiconductor products. It is capable of removing resin from metal parts, separating products, and removing resin gates from product sections. It supports products such as SOP series matrices, power modules, and TO-220/TO-3P series. 【Features】 ■ Removes excess black resin parts from various semiconductor products ■ Capable of removing resin from metal parts and separating products ■ Compatible with products such as SOP series matrices *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

"AIGAMO" is a device equipped with a laser marking system that performs marking on lead frames and deburring and removal of resin parts. In recent years, it has been used to solve issues in the processing of miniaturized semiconductor products, such as "chipping of the resin that shapes the elements" and "rapid damage and wear of the mold's punch and die," and it is appreciated for the production of various semiconductor products. [Features] - Equipped with a laser irradiation device - Reduces the defect rate of semiconductor products - Reduces maintenance work on molds *For more details, please feel free to contact us.

• Laser marker
• Resin processing machine