- Publication year : 2022
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Our Super Micro Sieve (particle sieve) is produced using electroforming technology. This document summarizes the differences between the "Super Micro Sieve technology," which achieves highly precise fine hole processing, and conventional methods such as etching, laser, drilling, milling, and electrical discharge machining. Additionally, "processing examples" are included with photographs. You can find more detailed information in related products and catalogs.
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