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コンガテックジャパン

addressTokyo/Minato-ku/301 Hamamatsucho 1-chome Building, 1-2-7 Hamamatsucho
phone03-6435-9250
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last updated:Dec 12, 2024
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8th Generation Intel Core equipped COM Express

8th Generation Intel Core equipped COM Express Basic Type 6 Module: conga-TS370

The 【conga-TS370】 is a COM Express Basic Type 6 module equipped with an 8th generation Intel Core (Coffee Lake H) processor. There are also products available with Xeon D for data center applications.

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Intel Atom equipped COM Express Type 7

Intel Atom C3000 equipped COM Express Basic Type 7 module: conga-B7AC

The 【conga-B7AC】 is a COM Express Basic Type 7 module equipped with an Intel Atom C3000 (Denverton) processor.

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Intel Atom equipped COM Express Mini

Intel Atom E3900 equipped COM Express Mini Type 10 module: conga-MA5

The 【conga-MA5】 is a COM Express Mini Type 10 module equipped with a low-power Intel Atom E3900 (Apollo Lake) processor.

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Low power consumption Intel Atom equipped Qseven module

Intel Atom E3900 (Apollo Lake) equipped Qseven module: conga-QA5

The 【conga-QA5】 is a Qseven module equipped with a low-power Intel Atom E3900 (Apollo Lake) processor.

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Low power consumption Intel Atom equipped SMARC module

Intel Atom E3900 (Apollo Lake) equipped SMARC module: conga-SA5

The 【conga-SA5】 is a SMARC module equipped with a low-power Intel Atom E3900 (Apollo Lake) processor.

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Intel Atom equipped COM Express Type 6

Intel Atom E3900 equipped COM Express Compact Type 6: conga-TCA5

The 【conga-TCA5】 is a COM Express Compact Type 6 module equipped with the low-power Intel Atom E3900 (Apollo Lake) processor.

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COM Express Type 7 with Intel Xeon D

COM Express Basic Type 7 with Intel Xeon D (Broadwell): conga-B7XD

The 【conga-B7XD】 is a COM Express Type 7 Basic module equipped with an Intel Xeon D (Broadwell) processor. The processor can support up to 16 cores of the Intel Xeon D 1577.

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Micro-ATX carrier board for COM-HPC Client

Micro-ATX application carrier board for COM-HPC Client: conga-HPC/uATX-Client

The 【conga-HPC/uATX-Client】 is an application carrier board for COM-HPC Client modules (Size A, B, C). Designed to be directly integrated into products in a Micro-ATX form factor, it enables early market entry while minimizing NRE costs by combining industrial-grade COM-HPC with customized cooling solutions and comprehensive BSPs for all major RTOS, as well as real-time hypervisors from Real-Time Systems, allowing for rapid response to changing market demands. Additionally, by swapping out the COM-HPC module, applications can be further enhanced for high performance or cost reduction, making it easy to scale and create a full range of product portfolios based on a single type of carrier board. Size: Micro-ATX 244 x 244 mm. Operating temperature range: 0℃ to +60℃.

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3.5-inch carrier board for SMARC (x86 processor)

3.5-inch Application Carrier Board for SMARC (x86 Processor): conga-SMC1/SMARC-x86

The 【conga-SMC1/SMARC-x86】 is a 3.5-inch size application carrier board for SMARC, suitable for commercial use. The implemented SMARC supports x86 processors. Size: 3.5 inches 146 x 102 mm. Operating temperature range: 0°C to +60°C.

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3.5-inch carrier board for SMARC (Arm processor)

3.5-inch application carrier board for SMARC (Arm processor): conga-SMC1/SMARC-ARM

The 【conga-SMC1/SMARC-ARM】 is a 3.5-inch size application carrier board for SMARC, suitable for commercial use. The implemented SMARC is compatible with Arm processors. Size: 3.5 inches 146 x 102 mm. Operating temperature range: 0℃ to +60℃.

  • Microcomputer

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COM-HPC Server Evaluation Board

COM-HPC Server Evaluation Carrier Board: conga-HPC/EVAL-Server

The 【conga-HPC/EVAL-Server】 is an evaluation carrier board for COM-HPC Server modules (Size D, E) and outputs all signals specified in the "COM-HPC Module Base Specification R1.0" to standard interface connectors. Size: Extended ATX: 304.8 x 330.2 mm. Operating temperature range: -40℃ to +85℃.

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COM-HPC Client Evaluation Board

COM-HPC Client Evaluation Carrier Board: conga-HPC/EVAL-Client

The 【conga-HPC/EVAL-Client】 is an evaluation carrier board for COM-HPC Client modules (Size A, B, C) that outputs all signals specified in the "COM-HPC Module Base Specification R1.0" to standard interface connectors. Size: Extended ATX: 304.8 x 330.2 mm Operating temperature range: 0℃ to +60℃.

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COM Express Type 7 Evaluation Board

COM Express Type 7 Evaluation Carrier Board: conga-X7EVAL

The 【conga-X7EVAL】 is an evaluation carrier board for COM Express Type 7, outputting all signals to standard interface connectors. Size: 294 x 244 mm. Operating temperature range: Commercial: 0°C to +60°C, Industrial: -40°C to +85°C.

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COM Express Type 6 Evaluation Board

COM Express Type 6 Evaluation Carrier Board: conga-TEVAL/COMe 3.0

The 【conga-TEVAL/COMe 3.0】 is an evaluation carrier board for COM Express Type 6 (Basic, Compact) that outputs all signals to standard interface connectors. Size: 294 x 244 mm. Operating temperature range: -40℃ to +85℃.

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COM Express Mini Type 10 Evaluation Board

COM Express Mini Type 10 Evaluation Carrier Board: conga-MEVAL

The 【conga-MEVAL】 is an evaluation carrier board for COM Express Mini Type 10, outputting all signals to standard interface connectors. Size: 294 x 244 mm. Operating temperature range: -40°C to +85°C.

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SMARC module evaluation board: conga-SEVAL

SMARC module evaluation carrier board: conga-SEVAL

The 【conga-SEVAL】 is an evaluation board for SMARC modules, outputting all SMARC outputs to standard interface connectors. Size: 294 x 172 mm. Operating temperature range: -40°C to +85°C.

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Qseven module evaluation board: conga-QEVAL

Qseven 2.0 Module Evaluation Carrier Board: conga-QEVAL/Qseven 2.0

The 【conga-QEVAL/Qseven 2.0】 is an evaluation carrier board for Qseven 2.0, outputting all signals of Qseven to standard interface connectors. Size: 294 x 172 mm. Operating temperature range: 0°C to +60°C.

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