HNS Product Lineup

Size: 18mm x 18mm x 10.1mm, 4g Supports Full HD (1920 x 1080 pixels) at 30 frames/s Low power consumption of approximately 500mW (when outputting Full HD) Compatible with USB Video Class (UVC), no driver installation required *Flexible custom options available to meet customer needs (firmware adjustments, lens settings, enclosure design, etc.)

• Embedded system design service
• Circuit board design and manufacturing
• Image Input Board

Size: 18mm x 18mm x 10.1mm, 4g Supports Full HD (1920 x 1080 Pixels) high resolution at 30 frame/s Low power consumption of approximately 500mW (when outputting Full HD) Compatible with USB Video Class (UVC), no driver installation required *Flexible custom options available to meet customer needs (firmware adjustments, lens selection, enclosure design, etc.)

• Embedded system design service
• Circuit board design and manufacturing
• Image Input Board

Equipped with a USB Mini-B connector, size 20mm × 20mm × 23.5mm, approximately 12g. Supports Full HD (1920×1080 Pixels) high resolution at 30 frames/s. Low power consumption of approximately 500mW (when outputting Full HD). Compatible with USB Video Class (UVC), no driver installation required. Supports S-mount (M12×0.5) lenses *Lens sold separately (tripod adapter can also be attached as an option). *Flexible custom solutions available to meet customer needs (firmware adjustments, lens settings, housing modifications, etc.).

• Embedded system design service
• Circuit board design and manufacturing
• High Speed Camera

Equipped with a USB Mini-B connector, size 20mm × 20mm × 23.5mm, approximately 12g. Supports Full HD (1920×1080 Pixels) high resolution at 30 frame/s. Low power consumption of approximately 500mW (when outputting Full HD). Compatible with USB Video Class (UVC), no driver installation required. Supports S-mount (M12×0.5) lenses *Lenses sold separately (tripod adapter can also be attached as an option). Flexible custom support available to meet customer needs (firmware adjustments, lens settings, housing modifications, etc.). Image sensor.

• Embedded system design service
• Circuit board design and manufacturing
• High Speed Camera

Realization of Ethernet connectivity for sensor devices with the optional technology cores e7tcpip and e7udpip licenses - High-reliability network performance Due to being non-microcontroller based, it does not go down even under DoS/DDoS attacks, and processing is done with a unique H/W circuit, making it unmodifiable. - High-speed processing / low time lag Direct input and output of data using FPGA without a microcontroller (Processing is possible for each event: packet command, trigger event, time event, loop event) Example: Data collection (20nsec cycle) → Data processing → Packet generation → Socket transmission (120μsec cycle) - Fast startup Starts up and begins processing in about 3msec (excluding Link-Up) - Power-saving / space-saving Composed only of network I/F and FPGA Link-Up: 180mW Link-Down: 3.12mW SD card size (32mm × 24mm)

• Embedded system design service
• Circuit board design and manufacturing

Features - Ethernet supports 10M/100M/1Gbps - Includes a board-limited license for the manufacturer’s product e7UDPIP core that supports Gigabit Ethernet - Compatible with pmod, allowing the use of various modules released by different companies. - Application development is possible for free using Vivado. Using the optional vision board - Equipped with an HDMI connector for video input and output. - Includes a Raspberry Pi Camera connector.

• Embedded system design service
• Circuit board design and manufacturing

The "copper inlay substrate" is a printed circuit board that improves heat dissipation characteristics in specific areas by press-fitting copper pins directly beneath heat-generating components. By directly contacting heat-generating components with copper, which has high thermal conductivity, it achieves excellent heat dissipation and can be relatively easily modified from existing substrates. It enhances heat dissipation performance, which was insufficient with thermal vias that only have through holes. Additionally, it can suppress cost and weight increases associated with heat dissipation, and since it can directly apply the existing printed wiring board structure, it allows for relatively easy adaptation in printed circuit board design. 【Features】 ■ Partially improves heat dissipation characteristics ■ Relatively easy to modify from existing substrates ■ Enhances heat dissipation performance ■ Can suppress cost and weight increases related to heat dissipation ■ Can directly apply the existing printed wiring board structure, allowing for relatively easy adaptation in printed circuit board design *For more details, please refer to the PDF document or feel free to contact us.

• others
• Printed Circuit Board

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

• others
• Printed Circuit Board

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

• others
• Printed Circuit Board

The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.

• others
• Printed Circuit Board