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ヒガシ電子工業

addressIshikawa/Uchinada-cho, Kahoku-gun/1-379 Daikonbu,
phone076-286-2795
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last updated:Sep 25, 2024
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ヒガシ電子工業 List of Products and Services

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[Work Example] PS4 Power Connector Repair

We will introduce a case where the connector was detached along with the board pads and patterns when pulling out the power cable!

Here is a case of a request for repair of a PlayStation 4 power connector. The cable coming from the power supply unit is connected to the motherboard, but in this case, the connector was pulled out, causing it to detach along with the board pads and patterns. All pads (including reinforcement pads) were detached and came off with the connector. In this instance, since the power and ground remained on the board side, we only performed adhesion, while for the two signal lines, we transplanted the patterns and connected them. We also ensured continuity with a tester. 【Work Steps】 ■1. Remove the connector still attached to the power cable. ■2. Remove the pads that are still attached to the connector. ■3. Main work: reform the removed pads and restore them. ■4. Remove residual solder from the regenerated pads on the board. ■5. Solder the removed connector. ■6. Conduct a visual inspection and complete without issues. *For more details, please download the PDF or feel free to contact us.

  • Other Connectors

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[Work Example] WLCSP Rework

Supporting everything from tiny components to large BGAs! Introducing our achievements in WLCSP (Wafer Level Chip Size Package) rework.

Here is an introduction to a case where we received a request for WLCSP rework. WLCSP (Wafer Level Chip Size Package) is a package size equivalent to a bare chip called a die, and is considered one of the smallest levels in semiconductors. The requested component also has an outer dimension of 1.5mm and a pitch of 0.4mm. This time, we replaced the part that had been coated with a preservative, ensuring that there were no remnants left behind during the work. [Case Overview] ■ Content: Replacement of the part coated with a preservative ■ Outer Dimension: 1.5mm ■ Pitch: 0.4mm *For more details, please download the PDF or feel free to contact us.

  • Chip type LED

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[Work Example] LED Replacement (Vehicle Parts)

We would like to introduce our achievements in replacing parts prepared by our customers!

Here is a case where we received a request for replacing vehicle parts with bullet-shaped LED lights. This time, the customer requested a color change (from orange to blue), so we carried out the replacement with the parts provided by the customer. We can handle this type of LED replacement if the customer disassembles the unit (in terms of the condition of the circuit board) and prepares the replacement parts. If you have any other concerns, please feel free to let us know. 【Work Procedure】 ■1. Remove the LED from the circuit board ■2. Remove the solder from the through-hole (TH) ■3. Main task: Install the new LED ■4. After adjustments, solder it in place and cut off any excess leads ■5. Finally, perform a lighting check to complete *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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[Work Example] LED Replacement (Blind Spot Monitor)

Introducing our achievements in LED replacement for vehicle parts (blind spot monitor)!

We would like to introduce a case where we received a request for LED replacement (vehicle parts: blind spot monitor). This time, the customer requested a color change (from orange to red), so we carried out the work in the following sequence: disassembly of the mirror → investigation of LED specifications, procurement → replacement. If you are unable to disassemble the unit (condition of the circuit board) or prepare replacement parts like in this LED replacement case, please feel free to consult us. If you have any other concerns, please let us know. 【Work Steps】 ■1. Remove the LED case from the mirror ■2. Disassemble the case (case, lens, circuit board) ■3. Main task, replace the LED ■4. Reassemble the disassembled case, lens, and circuit board ■5. Finally, perform a lighting check to complete *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Higashi Electronic Industry Co., Ltd. Production System <Factory Introduction, Equipment List, Quality Policy>

Every year, we incorporate quality goals into our management plan and continuously strive for quality improvement for our customers!

At Higashi Electronic Industry Co., Ltd., we undertake the assembly processes of circuit boards and electronic components at the request of our clients. We respond quickly to a variety of requests, from "mass production" to "small-batch production of diverse products." Our main clients include top-level domestic gas appliance manufacturers and medical device manufacturers that are committed to high quality and reliability made in Japan. The products we create are utilized in familiar gas appliances as well as advanced analyzers, optical devices, and component inspection equipment. 【Equipment Owned】 ■ Lead-free soldering automatic soldering machines (Tokyo Production Technology TS-300 / Koki Tech WS-302LF) ■ Spray fracturer (Koki Tech WIS-350-21M) ■ In-circuit tester (Kyouritsu Test System Focus-2000) *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment

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Higashi Electronic Industry Co., Ltd. VISION <Shu-Ha-Ri>

Always looking ahead, the entire staff is united in striving to improve our technical capabilities! An explanation of our beliefs, projects, and challenges.

We would like to introduce Higashi Electronic Industry Co., Ltd.'s "VISION <Shu-Ha-Ri>." Listening to our customers and continuously providing products that satisfy them is our unwavering commitment and a shared principle that spans from the past to the future across the entire company. By employing the "in-house company" approach, we have objectively reviewed our manufacturing processes through numerical analysis and achieved two improvement goals—quality and delivery time—using the know-how accumulated through trial and error. Furthermore, we will build on the achievements of the first and second phases to challenge unexplored fields. 【VISION】 ■ Shu: A principle inherited by the next generation in accordance with our founding spirit "One thought: to create good products." ■ Ha: A plan for further contributions to our customers based on the "Long-term Continuation Project" initiated in 2009. ■ Ri: Building on the achievements of the first and second phases, we will challenge unexplored fields "Third Phase Project Name: 21-25 Challenge." *For more details, please download the PDF or feel free to contact us.

  • Solder

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EMS Solution Rework Service

For those who have no rework experience or have rework equipment but are unable to use it effectively!

We perform rework on various types of mounted components (SMD, IMD). We offer five patterns of service: "new component rework," "new component addition," "removal (live capture)," "component regeneration/re-implementation," and "component regeneration only." Additionally, we possess rework equipment from reliable domestic manufacturers, allowing us to measure and provide temperature profiles as needed. 【Rework Lineup for Mounted Components (partial)】 ■BGA ■QFP ■SOP ■PLCC ■HTD *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing

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Rework Service <EMS Solution>

We also offer "Rework Technical Consulting," where we dispatch experienced engineers from our company!

At Higashi Electronic Industry Co., Ltd., we accept rework of various types of mounted components (SMD, IMD), including BGA (Ball Grid Array). By performing BGA reballing, it is possible to reuse components (reinstallation on different boards due to component depletion, failure analysis of individual components, failure analysis and reproducibility confirmation through component swap reinstallation, etc.). We can also handle the removal (live capture) of components other than BGA that you wish to reuse, as well as modifications to the circuit board. 【Supported Patterns】 ■1. New component rework ■2. New component post-installation ■3. Removal (live capture) ■4. Component regeneration/reinstallation ■5. Component regeneration only *For more details, please refer to the related links or feel free to contact us.

  • Other electronic parts

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Mass production <capable of handling 1 million units per year>

We propose specifications that will maximize your satisfaction with the balance of quality and cost you require!

We would like to introduce the "mass production" services offered by Higashi Electronic Industry Co., Ltd. Even if you have designs or prototypes, we ask you to share the product concept with us, allowing both our company and the customer to share the final goal. Based on the completed specifications, we will conduct prototype trials to evaluate the feasibility of mass production. As a result of the prototype trials, we will finalize the mass production process and carry out production based on the quality assurance content. We will also manage the quality control of the produced products. 【Specific Flow of Mass Production】 ■1. Hearing (Session) ■2. Specification Development (Most Important Step) ■3. Prototyping ■4. Mass Production *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing

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Higashi Electronic Industry Co., Ltd. Business Introduction

Leave electronic component assembly, soldering, and mass production to us!

At Higashi Electronic Industry Co., Ltd., we undertake the assembly processes of circuit boards and electronic components at the request of our clients. We respond quickly to all requests, from mass production to small-batch production of various types. Our main clients include top-level domestic gas appliance manufacturers and medical equipment manufacturers, who are committed to high quality and reliability made in Japan. 【Business Activities】 ■ Assembly of electronic components ■ Soldering ■ Mass production *For more details, please download the PDF or feel free to contact us.

  • Processing Contract

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