山城精機製作所 Company Profile

A transfer molding machine developed for motor encapsulation, IC sealing, and substrate sealing, operating at low speed and low pressure to prevent damage and performance degradation!

What is necessary for motor encapsulation, IC encapsulation, and substrate encapsulation? 【Advantages of Transfer Molding Machines】 ■ Since the softened molding material is injected, damage to the insert is minimized! ■ By placing the molding material while the mold is closed, dimensional accuracy is improved! ■ Characterized by thin burrs, making finishing work easy! 【Yamashiro Seiki Seisakusho's TF Molding Machine: Three Concepts】 ■ Emphasis on low speed and low pressure! - To prevent damage to insert work and deterioration of product performance due to resin, control is focused on low speed and low pressure as much as possible. ■ Outstanding workability! - Capable of handling various shapes of insert work while also considering automation, adopting a lower mold slide table method. ■ Balancing control stability and energy saving! - An energy-efficient inverter pump is used for mold clamping control. - Electric control using a servo motor is adopted for TF control, achieving stable independent control and energy saving. *For more details, please refer to the PDF document or feel free to contact us.