吉川ハイプレシジョン君津工場 List of Products and Services

Lens unit in the rear camera section built into the smartphone "The exterior case components" require high-difficulty processing such as side cutting, crushing, barrelling, and small hole punching. Barrel processing that does not affect the product is possible. In addition to various plating options, high-difficulty SUS plating is also available. We performed progressive press processing within the same mold using complex and high-difficulty processing techniques such as top corner crushing, side irregular shape cutting, side small hole processing, and barrelling. 【Processing Technology Examples】 ■ Barrel processing that does not affect the product is possible ■ Various plating options are available, including high-difficulty SUS plating ■ Materials: SPC series/SUS series (304, 305, 316L)/Cu series (brass, phosphor bronze, nickel silver, etc.) ■ Progressive press processing within the same mold using complex and high-difficulty processing techniques *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract
• Other electronic parts

The "plug case" of the next-generation connector standard "USB type-C" is being processed through progressive die forming. Mass production is possible through progressive die forming. The uniform thickness achieved through the forming process sufficiently meets the design specifications for inner and outer dimensions. Additionally, surface condition control is possible through barrel processing, and we can accommodate requests for single-stage and double-stage forming. 【Processing Technology Examples】 ■ Successful mass production ■ Mass production possible through progressive die forming ■ Accommodating requests for single-stage/double-stage forming ■ Hole drilling on the sides is possible ■ Materials: SUS304L/SUS316L *Other materials available upon consultation *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract
• Other electronic parts

The "CAP," formed in a tapered shape to shift the hollow part of the ceramic package towards the lid side, can secure a larger internal volume by adopting an acute angle shape. By transitioning from a multilayer to a single layer, it is possible to reduce package costs. The tapered shape allows for minimizing the inner radius. Additionally, it is effective for ultra-small types below 1210 type, allowing for a cavity on the metal side. 【Processing Technology Examples】 ■ Possible to reduce package costs (multilayer ⇒ single layer) ■ Possible to minimize the inner radius with a tapered shape ■ Compact package size ■ Secure adhesive area ■ Compatible with Ni and Au plating *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract
• Other electronic parts

Our company provides metal lids, known as "LID," used for sealing ceramic packages in mobile phones and home appliances. We have successfully achieved the press manufacturing of "stepped LID," reaching a monthly production of 600 million units. We have a track record of transactions with 85% of global customers. We always maintain a material stock of 0.05t to 0.10t and can mass-produce from 0806 type. Additionally, we can accommodate similar open sizes with a prototype lead time of 10 business days. 【Processing Technology Examples】 ■ Successful press manufacturing of "stepped LID" ■ Achieved monthly production of 600 million units ■ Transaction record with 85% of global customers ■ Constant material stock of 0.05t to 0.10t ■ Mass production possible from 0806 type ■ Prototype lead time of 10 business days for similar open sizes *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract
• Other electronic parts

At our factory, we provide solutions that meet cutting-edge technology on a global scale. Based on our extensive experience and achievements accumulated over many years, we respond to customer needs with a consistent production system, from press processing to secondary processing such as barrel plating, plating, and cleaning, as well as tape packaging in clean rooms. We continue to challenge high-precision press processing for products such as LIDs for crystal devices, SAW filters, sensor devices, actuators for mobile cameras, and next-generation connectors like USB Type-C. 【Business Overview】 ■ Manufacturing of precision pressed components (from press processing to plating) *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract