共栄電資 List of Products and Services

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum part ■ Dramatically improves the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND for the aluminum part ■ Dramatic improvement in the utilization of the aluminum part ■ Automatic mounting with reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

The "Active Filter / Harmonic Suppression Device" can be used not only for harmonic suppression but also as a countermeasure against flicker (the flickering of lighting or malfunction of control devices due to voltage fluctuations). It is compact and lightweight, with dimensions of 520x778x172mm (WxDxH) and a weight of 50kg (capacity 70KVA). It can be expanded up to a maximum of 10 units / 700KVA according to the desired capacity. This single unit can handle harmonic suppression, analysis, and diagnostics. 【Features】 ■ Harmonic measurement, data analysis, and display functions ■ Functions for harmonic compensation along with reactive power compensation (automatic power factor improvement) and unbalanced active power compensation ■ Compact and lightweight ■ Also addresses flicker ■ Easy capacity expansion *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

We would like to introduce the "Polyester Hybrid Laminated Board" handled by Kyoei Electric Co., Ltd. The polyester resin can be colored with pigments such as white and N7 gray. The laminate thickness ranges from T1 to T40, and the substrate consists of alternating layers of glass cloth and glass mat. Our company can manufacture products exceeding 1 meter, so please feel free to contact us when needed. 【Features】 ■ Polyester resin, vinyl ester resin ■ Substrate: alternating layers of glass cloth and glass mat ■ Laminate thickness: approximately T1 to T40 ■ Maximum dimensions: approximately 1000*2300 ■ Can be colored with pigments in polyester resin (white, N7 gray, etc.) *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND connection for the aluminum part ■ Dramatic improvement in the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities by machining only the substrate portion to mount components. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum ・High-frequency bonding film ・Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. Our special technology enables substrate-ization, achieving high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the equipment - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transportation and installation. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and miniaturization. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and operations during transport and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-formed busbars used for high current applications. By utilizing our special technology for substrate formation, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate formation is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Miniaturization of the entire device - The greatest advantage of substrate formation is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transport and installation. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplified substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those found in powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be done safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

This is an introduction to low-voltage control equipment from GE and C&S (India). We offer products with specifications not available domestically at low prices. If you are considering cost reductions for commonly used products like MCBs, please take a look. 【Product Examples】 ■ Air Core Reactor A maintenance-free reactor that does not use oil, with weight and price reduced to one-third compared to conventional products. ■ Active Filter Provides measures against harmonics up to the 50th order, reactive power compensation, and data measurement and monitoring functions. ■ Capacitor Each element is equipped with built-in fuses (approximately a dozen). ■ MCB-AC Miniature Circuit Breaker Compact high-breaking capacity, 415V, 0.5–63A [10kA], 35mm DIN rail. *We have individual detailed catalogs available, so please feel free to contact us. For more details on the lineup, please view the PDF data available for download.

• Capacitor

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

Features: - Molded oil-free structure - Compact and lightweight (weight 4kg)

• Capacitor

【Features】 ■ Resin molded type ■ Circuit voltage: 3.6~36kV ■ Coreless type - The current-limiting reactor SA, SB, SC limits the transient current to below the allowable value of the capacitor unit and reduces the surge current to below the allowable value of the control device. - The main advantage of using a current-limiting reactor is the expected extension of the lifespan of the capacitor unit.

• Capacitor

GE's capacitors comply with most domestic and international capacitor standards, allowing the capacitor units to be designed and manufactured to meet customer requirements. 【Features】 ■ Comparison with domestic products - Equipped with built-in fuses → Fuses are installed internally for each internal element - In the event of an element failure, it operates instantly before affecting others, and no arcs or gases are generated to isolate the faulty area. - Moreover, the capacitor itself can continue to operate as is. → All domestic products have external fuses. - The capacitor elements have an oil-free structure without impregnating liquid.

• Capacitor

【Features】 ■ Protection level IP20 ■ Trip-free mechanism ■ Current limiting design_Class 3 ■ High terminal capacity with deep serrated shape ■ Bi-connection terminals available ■ DIN reel mountable ■ Low power consumption Support for 35mm DIN reels makes installation easy. * For detailed product specifications, please refer to the catalog. * For more information, please check the PDF materials or feel free to contact us.

• Capacitor

【Features】 ■ Excellent inrush current limiting ■ Reduced watt loss in the "on" state ■ Switching capacitor banks in parallel without output reduction ■ Extended equipment lifespan ■ Simplified maintenance and reduced downtime ■ Improved power quality ■ Optimized solution cost

• Capacitor

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

Hybrid substrates integrate multiple substrate materials with different characteristics by combining them in horizontal and vertical directions (layering), allowing for the unification of what was previously divided into multiple boards, thus achieving a reduction in assembly labor and space-saving. Additionally, we offer "honeycomb substrates" that are ultra-lightweight and have excellent electrical properties through a composite technology that incorporates honeycomb materials into the substrate and layers them. Honeycomb materials are particularly effective when bonded with fluoropolymer (Teflon) substrates. Fluoropolymers are used as materials for high-frequency substrates due to their low dielectric constant, but the base material itself is soft, making it difficult to handle. When scaled up, thin substrates can bend or break, while making the substrate thicker can lead to warping due to its own weight. Honeycomb materials are lightweight and have high strength, allowing for reinforcement of the substrate when bonded, which helps to reduce warping. Furthermore, not only does it contribute to weight reduction, but the air within the honeycomb also serves as an insulating layer, making it effective when a lower dielectric constant is desired. Moreover, because the honeycomb material provides reinforcement, handling becomes easier compared to when using the substrate alone, thus improving work efficiency. *For more details, please refer to the PDF document or feel free to contact us.*

• Printed Circuit Board
• Circuit board design and manufacturing

Molded cast products can conform to any shape for mold production and ensure insulation performance. They also excel in electrical properties, mechanical strength, dimensional stability, and chemical resistance. Leveraging our unique position as both a manufacturer and a trading company, we propose the optimal resin from multiple options based on the usage environment and the most important performance criteria you prioritize. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve the desired properties. Resins come with various performance characteristics. If you want to use them outdoors or need something resistant to chemicals, please feel free to consult us. 【Cast Products】 ■ High-strength resins ■ Low thermal expansion resins ■ Thermal conductive resins 【Applications and Examples】 ■ Switching devices ■ Circuit breakers ■ Power conditioners ■ Gap spacers 【Quality Control】 ■ Dielectric strength testing ■ Corona discharge testing *For more details, please refer to the PDF document or feel free to contact us using the form below.

• Vacuum Equipment
• Resin mold

We solve heat problems caused by the miniaturization of devices with the power of resin. We offer proposals for applications such as EV vehicles, high-efficiency motors, and power devices, where the demand for heat dissipation is increasing. Leveraging our unique position as both a manufacturer and a trading company, we suggest suitable resins from multiple manufacturers based on the usage environment and other factors. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve desired properties. Please feel free to consult us with any other requests. 【Features】 ■ Achieves thermal conductivity of 2.6 W/m·K ■ Breakdown voltage of 17 kV/mm *For more details, please refer to the PDF document or feel free to contact us.

• Other Auto Parts

GE's capacitors comply with most domestic and international capacitor standards, allowing the capacitor units to be designed and manufactured to meet customer requirements. 【Features】 ■ Comparison with domestic products - Equipped with built-in fuses → Fuses are installed internally for each internal element - In the event of an element failure, it operates instantly before affecting others, and does not generate arcs or gas to isolate the faulty part. - Moreover, the capacitor itself can continue to operate as is. → All domestic products have external fuses. - The case material is made of stainless steel → Compared to iron domestic products, it is lightweight and rust-resistant. - The insulating oil used is an environmentally friendly biodegradable non-PCB*, non-chlorinated insulating oil developed specifically for capacitors. *PCB: A general term for polychlorinated biphenyl compounds. Disposal (and possession) of high-concentration PCBs is mandatory, and low-concentration PCBs must also be disposed of by 2027. (In some regions, the disposal period has already passed, so please check if you have relevant products.) *For more details, please refer to the PDF document or feel free to contact us.

• Capacitor

GE's manufacturing facilities are equipped with clean rooms and utilize highly reliable advanced winding machines. The technology combined with the carefully controlled assembly process and oil filling process provides high-quality and long-lasting products for the industry. All capacitors are electrically tested to check for oil leaks. 【Product Lineup】 ■ GE Induction Heating Furnace Capacitors for Melting Furnaces ■ GE Water-Cooled DC Capacitors *For more details, please refer to the PDF document or feel free to contact us.

• Capacitor

■Design to estimate in 10 days ■Price is less than half of that of oil-filled reactors ■Due to the use of FRP (fiber-reinforced plastic) structure, it is high-strength, lightweight, and excellent in weather resistance ■Stable insulation performance using air insulation → Can be used with only annual visual inspections since it does not use oil ■Despite its large capacity, it can be installed in a vertical arrangement, reducing installation space 【Applications】 ■Short-circuit current (current limiting) ■For transmission lines 【Track Record】 Numerous delivery records to domestic manufacturers ■Railway industry ■Heavy electrical industry ■Power industry *For more details, please refer to the PDF materials or feel free to contact us.

• Other energy equipment
• others

The "MOM2" is a lightweight, handheld unit designed to supply up to 240 amperes. It measures the resistance of circuit breaker contacts, bus bar joints, and other high-current links. It is designed with safety, ease of use, and versatility in mind. 【Features】 ■ Test current up to 240A ■ Pass/fail testing against adjustable limits using Bluetooth audible method ■ Battery-powered ■ Portable and ultra-lightweight ■ Auto range: 1μΩ to 1000mΩ 【Track Record】 ■ Widely adopted in the power industry *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Instruments/Electrometers
• Other measurement, recording and measuring instruments

The "Patch Seal Series" is a waterproof silicone adhesive sheet for construction and civil engineering that demonstrates excellent airtightness and waterproofing effects over an extended period. Starting with the reliable "Shinetsu Patch Seal," which combines excellent workability and reliability, we also offer products suitable for applications requiring strength, such as "Patch Seal Cross" and "Patch Seal Transparent." 【Features】 ■ Exhibits stable performance over a wide temperature range of -40℃ to 180℃ ■ Excellent adhesion, sticking well to most materials, including metal and concrete ■ Made of silicone, providing outstanding durability and weather resistance ■ Can be easily cut and applied on-site to match the shape of the waterproof surface ■ Demonstrates excellent airtightness and waterproofing effects over an extended period *For more details, please refer to the PDF materials or feel free to contact us.

• others

Kyoei Denshi owns numerous facilities, including large vacuum chambers and vacuum stirrers. We carry out manufacturing and processing through the following steps: main agent/hardener → vacuum injection → pressurization → curing → demolding → product. 【Casting Method (Mass Production) Tohoku Factory Equipment Line】 ■ Large Vacuum Chambers (2 units) ■ Blast Equipment (1 unit) ■ Tg Measurement Device (Rigaku) (1 unit) ■ Vacuum Stirring Machines (2 units) *For more details, please refer to the PDF materials or feel free to contact us.

• Vacuum Equipment
• Other measurement, recording and measuring instruments

At Kyoei Denshi, we handle LED lighting manufactured by Vulkano. The company provides support for the consideration of LED implementation, including on-site environmental measurements and evaluation services using illuminance meters, as well as investment recovery simulations for LED introduction. We take pride in our many achievements through total coordination, including product delivery. 【Support for Implementation Consideration】 ■ On-site environmental measurements and evaluation services using illuminance meters ■ Investment recovery simulations for LED introduction ■ LED lighting selection and simulation services based on the customer's lighting layout, height, and target illuminance *For more details, please refer to the PDF materials or feel free to contact us.

• LED lighting

At Kyoei Denshi Co., Ltd., we are capable of producing long and large substrates exceeding 1,000mm in length. We accommodate various specifications such as high frequency, thick copper, and high multilayer. We support ultra-large size "large high multilayer substrates" for motherboards used in information and communication devices and for BTB applications, as well as "long substrates" up to a maximum of 1,000mm for LED lighting and A0 print heads. 【Features】 ■ Capable of producing ultra-large sizes ■ Vacuum forming press machine / heating plate size 750×1,100 ■ Supports up to 24 layers ■ Products up to a maximum of 1,000mm for LED lighting and A0 print heads *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

The manufacturing base of Kyoei Denshi has established the latest production lines, is engaged in the development of new technologies, and is capable of producing printed circuit boards from prototypes to mass production across a wide range of fields. 【Features】Our unique manufacturing technology allows us to provide circuit boards that cannot be made elsewhere. ■ By utilizing technology to bond aluminum and substrates, we have significantly improved the design flexibility of aluminum-based substrates and enabled aluminum grounding. ■ By laminating honeycomb materials, we achieve both warpage prevention and lightweight, low dielectric properties for the circuit boards. ■ By converting busbars and coils into circuit boards, we realize insulation and miniaturization. *For more details, please contact us or download the PDF for more information.

• Printed Circuit Board