共栄電資 List of Products and Services

In data center power supply systems, stable power supply and space-saving are required. Especially as density increases, improving power supply efficiency and addressing heat generation are crucial. The reliability of busbars is directly linked to the stable operation of the system, making high insulation and secure connections essential. Our busbars (bus bars) for high current substrates address these challenges. 【Usage Scenarios】 - Power units for data centers - Power supply within server racks - Power systems requiring high-density mounting 【Benefits of Implementation】 - Improved safety due to high insulation - Enhanced system efficiency through space-saving - Reduced assembly labor and prevention of wiring errors - Miniaturization of the entire device

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum part ■ Dramatically improves the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND for the aluminum part ■ Dramatic improvement in the utilization of the aluminum part ■ Automatic mounting with reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We would like to introduce the "Polyester Hybrid Laminated Board" handled by Kyoei Electric Co., Ltd. The polyester resin can be colored with pigments such as white and N7 gray. The laminate thickness ranges from T1 to T40, and the substrate consists of alternating layers of glass cloth and glass mat. Our company can manufacture products exceeding 1 meter, so please feel free to contact us when needed. 【Features】 ■ Polyester resin, vinyl ester resin ■ Substrate: alternating layers of glass cloth and glass mat ■ Laminate thickness: approximately T1 to T40 ■ Maximum dimensions: approximately 1000*2300 ■ Can be colored with pigments in polyester resin (white, N7 gray, etc.) *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND connection for the aluminum part ■ Dramatic improvement in the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities by machining only the substrate portion to mount components. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum ・High-frequency bonding film ・Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. Our special technology enables substrate-ization, achieving high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the equipment - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transportation and installation. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and miniaturization. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and operations during transport and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-formed busbars used for high current applications. By utilizing our special technology for substrate formation, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate formation is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Miniaturization of the entire device - The greatest advantage of substrate formation is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transport and installation. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplified substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those found in powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be done safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

Hybrid substrates integrate multiple substrate materials with different characteristics by combining them in horizontal and vertical directions (layering), allowing for the unification of what was previously divided into multiple boards, thus achieving a reduction in assembly labor and space-saving. Additionally, we offer "honeycomb substrates" that are ultra-lightweight and have excellent electrical properties through a composite technology that incorporates honeycomb materials into the substrate and layers them. Honeycomb materials are particularly effective when bonded with fluoropolymer (Teflon) substrates. Fluoropolymers are used as materials for high-frequency substrates due to their low dielectric constant, but the base material itself is soft, making it difficult to handle. When scaled up, thin substrates can bend or break, while making the substrate thicker can lead to warping due to its own weight. Honeycomb materials are lightweight and have high strength, allowing for reinforcement of the substrate when bonded, which helps to reduce warping. Furthermore, not only does it contribute to weight reduction, but the air within the honeycomb also serves as an insulating layer, making it effective when a lower dielectric constant is desired. Moreover, because the honeycomb material provides reinforcement, handling becomes easier compared to when using the substrate alone, thus improving work efficiency. *For more details, please refer to the PDF document or feel free to contact us.*

• Printed Circuit Board
• Circuit board design and manufacturing

Molded cast products can conform to any shape for mold production and ensure insulation performance. They also excel in electrical properties, mechanical strength, dimensional stability, and chemical resistance. Leveraging our unique position as both a manufacturer and a trading company, we propose the optimal resin from multiple options based on the usage environment and the most important performance criteria you prioritize. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve the desired properties. Resins come with various performance characteristics. If you want to use them outdoors or need something resistant to chemicals, please feel free to consult us. 【Cast Products】 ■ High-strength resins ■ Low thermal expansion resins ■ Thermal conductive resins 【Applications and Examples】 ■ Switching devices ■ Circuit breakers ■ Power conditioners ■ Gap spacers 【Quality Control】 ■ Dielectric strength testing ■ Corona discharge testing *For more details, please refer to the PDF document or feel free to contact us using the form below.

• Vacuum Equipment
• Resin mold

We solve heat problems caused by the miniaturization of devices with the power of resin. We offer proposals for applications such as EV vehicles, high-efficiency motors, and power devices, where the demand for heat dissipation is increasing. Leveraging our unique position as both a manufacturer and a trading company, we suggest suitable resins from multiple manufacturers based on the usage environment and other factors. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve desired properties. Please feel free to consult us with any other requests. 【Features】 ■ Achieves thermal conductivity of 2.6 W/m·K ■ Breakdown voltage of 17 kV/mm *For more details, please refer to the PDF document or feel free to contact us.

• Other Auto Parts

The "Patch Seal Series" is a waterproof silicone adhesive sheet for construction and civil engineering that demonstrates excellent airtightness and waterproofing effects over an extended period. Starting with the reliable "Shinetsu Patch Seal," which combines excellent workability and reliability, we also offer products suitable for applications requiring strength, such as "Patch Seal Cross" and "Patch Seal Transparent." 【Features】 ■ Exhibits stable performance over a wide temperature range of -40℃ to 180℃ ■ Excellent adhesion, sticking well to most materials, including metal and concrete ■ Made of silicone, providing outstanding durability and weather resistance ■ Can be easily cut and applied on-site to match the shape of the waterproof surface ■ Demonstrates excellent airtightness and waterproofing effects over an extended period *For more details, please refer to the PDF materials or feel free to contact us.

• others

Kyoei Denshi owns numerous facilities, including large vacuum chambers and vacuum stirrers. We carry out manufacturing and processing through the following steps: main agent/hardener → vacuum injection → pressurization → curing → demolding → product. 【Casting Method (Mass Production) Tohoku Factory Equipment Line】 ■ Large Vacuum Chambers (2 units) ■ Blast Equipment (1 unit) ■ Tg Measurement Device (Rigaku) (1 unit) ■ Vacuum Stirring Machines (2 units) *For more details, please refer to the PDF materials or feel free to contact us.

• Vacuum Equipment
• Other measurement, recording and measuring instruments

At Kyoei Denshi, we handle LED lighting manufactured by Vulkano. The company provides support for the consideration of LED implementation, including on-site environmental measurements and evaluation services using illuminance meters, as well as investment recovery simulations for LED introduction. We take pride in our many achievements through total coordination, including product delivery. 【Support for Implementation Consideration】 ■ On-site environmental measurements and evaluation services using illuminance meters ■ Investment recovery simulations for LED introduction ■ LED lighting selection and simulation services based on the customer's lighting layout, height, and target illuminance *For more details, please refer to the PDF materials or feel free to contact us.

• LED lighting

At Kyoei Denshi Co., Ltd., we are capable of producing long and large substrates exceeding 1,000mm in length. We accommodate various specifications such as high frequency, thick copper, and high multilayer. We support ultra-large size "large high multilayer substrates" for motherboards used in information and communication devices and for BTB applications, as well as "long substrates" up to a maximum of 1,000mm for LED lighting and A0 print heads. 【Features】 ■ Capable of producing ultra-large sizes ■ Vacuum forming press machine / heating plate size 750×1,100 ■ Supports up to 24 layers ■ Products up to a maximum of 1,000mm for LED lighting and A0 print heads *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

The manufacturing base of Kyoei Denshi has established the latest production lines, is engaged in the development of new technologies, and is capable of producing printed circuit boards from prototypes to mass production across a wide range of fields. 【Features】Our unique manufacturing technology allows us to provide circuit boards that cannot be made elsewhere. ■ By utilizing technology to bond aluminum and substrates, we have significantly improved the design flexibility of aluminum-based substrates and enabled aluminum grounding. ■ By laminating honeycomb materials, we achieve both warpage prevention and lightweight, low dielectric properties for the circuit boards. ■ By converting busbars and coils into circuit boards, we realize insulation and miniaturization. *For more details, please contact us or download the PDF for more information.

• Printed Circuit Board