多摩エレクトロニクス List of Products and Services

This product is a Low Shift type absorption UV-IR cut filter that transmits visible light or visible light + near-infrared. *BAG is an abbreviation for [Blue Absorbing Glass]. It provides optical characteristics with minimal dependence on the angle of incidence across the UV to IR range. It is used in various applications such as PC facial recognition cameras, drive recorders, in-car monitors, 4K/8K cameras, broadcast cameras, industrial cameras, 360-degree cameras, surveillance cameras, drones, smartphones, and wearable devices. The BAG filter forms an absorption layer through special processing on a glass substrate, which means that the optical characteristics do not depend on the thickness of the glass substrate. Therefore, we can provide products that maintain the strength of the glass substrate without changing the characteristics even when made thinner. 【Features】 ■ Low shift characteristics ■ Compatible with thin and low-profile designs ■ High strength ■ No limitations on optical characteristics due to thickness ■ Dual bandpass compatibility *For more details, please refer to the PDF document or feel free to contact us.

• Other filters

Tama Electronics Co., Ltd. started in 1979 as a production base for the Oki Electric Semiconductor Group, beginning with testing services. Since then, we have continuously expanded our business fields, including chip processing, memory final testing, and WCSP product assembly, accumulating numerous production achievements and advanced technology and know-how. To flexibly respond to the increasingly sophisticated and diverse needs of our customers, we prioritize "quality," "cost," and "speed" in all aspects and continually strive to improve our knowledge and skills. 【Business Activities】 ■ Dicing processing (silicon/glass/ceramic/quartz/other composite materials) ■ Vapor deposition, thin film, and film processing; design, manufacturing, and sales of optical filters such as IR cut filters and BAG filters ■ Taping services (tape reel storage) ■ Packaging format changes (tray ⇔ tape reel/stick ⇔ tape reel/split packaging, etc.) ■ Visual inspection (integrated circuits/optical filters/other electronic components) ■ Contract manufacturing of equipment *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

Our company applies the die-slicing processing technology we have cultivated over many years to offer cutting processing for thick products such as glass and ceramics. Using slicers and die cutters suitable for processing thick substrates, we can handle substrates with a maximum thickness of 24mm. By using materials like wax during cutting, we provide high processing accuracy and reliable quality. 【Slicing Processing】 ■ Compatible Work Sizes - Square Work: Up to 90mm (can be modified to accommodate up to 200mm) - Round Work: Up to 4 inches (can be modified to accommodate up to 8 inches) ■ Maximum Cutting Thickness: Up to 24mm (including the base material) *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment

"Dicing processing" is a method of cutting substrates into a grid pattern using a diamond blade. Our company is capable of processing substrates such as semiconductor wafers, optical glass components, and ceramics to sizes of 0.5mm and above. We will set conditions according to the specifications of the products you require. Dicing tape is advantageous in terms of cost. Cutting with wax and other materials is effective for pursuing dimensional accuracy and dicing irregularly shaped substrates. Please feel free to contact us with your requests. 【Product Lineup】 ■ Glass Dicing ■ Ceramic Dicing ■ Thick/Composite Material Laminate Wafer Dicing ■ Crystal Dicing *For more details, please download the PDF or feel free to contact us.

• Processing Contract