武蔵野ファインガラス List of Products and Services

At Musashino Fine Glass, we supply glass substrates in various sizes. In our small board cutting process (using an XY cross-cutting machine), we can cut raw glass such as soda glass and alkali-free glass, and we can also perform cutting of patterned substrates based on alignment using a CCD camera. We can carry out cutting, edge chamfering, and finishing cleaning with a cleaning machine directly connected to a clean room, making it suitable for research and testing purposes. 【Features】 ■ Cutting process with a large cutting machine (XY cross-cutting) - Compatible with soda glass, alkali-free glass, etc. - Processing dimensions: min 120mm×120mm to max 1500mm×1300mm - Processing accuracy (tolerance): ±0.2mm - Processing thickness: 0.3mm to 2.8mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Glass

"Glass thinning processing (slimming)" is a technology that dissolves glass with chemical solutions to create thin and lightweight products. Utilizing Musashino Fine Glass's etching technology, processing is possible with a maximum size of 550mm x 650mm and a minimum size of 100mm x 100mm. The processing accuracy achieves within ±10% of the target thickness. Additionally, the slimmed thin glass can be combined with other glass processing techniques of our company, such as pattern processing, through-hole processing, and cutting processing, using photoresist or laser modification. 【Features】 ■ A technology that dissolves glass with chemical solutions to create thin and lightweight products ■ Processing is possible with a maximum size of 550mm x 650mm and a minimum size of 100mm x 100mm ■ Slimming that meets the quality requirements for use in electronic components ■ Possible to combine with other glass processing techniques of our company *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Glass
• LCD display

We would like to introduce our "composite processing (fine through holes, engraving, etc.)" that we perform. It is possible to use photoresist for the purpose of protecting wiring. A protective layer can be patterned with photoresist on a substrate where wiring has already been completed, allowing for engraving and through-hole processing. Additionally, through-holes processed with laser modification and etching have edges that are nearly vertical, making it easier to insert components. After the through-hole processing, counterboring can be performed to facilitate the insertion of components. 【Processing Examples (Partial)】 ■ Processing for Wiring Protection - Photoresist can be used for the purpose of wiring protection. - A protective layer can be patterned with photoresist on a substrate where wiring has already been completed, allowing for engraving and through-hole processing. - Photoresist can be removed with inorganic or organic alkalis. *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Glass

At Musashino Fine Glass, we accept processing of support substrates for semiconductor wafers. We offer substrates made of borosilicate glass, non-acrylic glass, and quartz glass. Rectangular substrates can be processed up to a maximum size of 370×470mm, and circular substrates up to a maximum diameter of φ300mm, with processing methods available for sizes as small as 10mm square. During the prototype development phase, we can process from just one piece, so please feel free to consult with us when needed. 【Processing Overview】 ■ Processing Substrates: Borosilicate glass, non-acrylic glass, quartz glass ■ Processing Sizes: Maximum rectangular size 370×470mm, maximum circular size φ300mm (minimum size available upon consultation) ■ Thickness Accuracy: TTV≦1μm is possible ■ Processing Quantity: Processing from one piece during prototype development, mass production is also possible *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Circuit board design and manufacturing
• Other semiconductors

"Glass photolithography processing" is a technology that engraves arbitrary patterns into glass materials. By forming arbitrary patterns on the glass material using photoresist and then engraving, it is possible to create uneven surfaces and through-holes. Photolithography using organic resist films has advantages in terms of cost and durability, and it is less likely to damage the substrate when removing the resist, which also prevents adverse effects on wiring applied before processing. 【Features】 ■ Forms arbitrary patterns on glass materials using photoresist ■ Capable of processing uneven surfaces and through-holes in glass ■ Less likely to damage the substrate when removing the resist ■ Does not adversely affect wiring applied before processing ■ Can reduce total manufacturing costs *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Glass

At Musashino Fine Glass, we have developed a technology that performs etching after modifying the glass using lasers. By irradiating with ultra-short pulse lasers, we create regions with different physical properties within the glass, allowing us to etch into the desired shapes. This processing method, which combines "laser" and "etching," enables the realization of long and narrow fine hole drilling that was previously difficult to achieve. 【Examples of Achievements】 ■ Aspect ratio of approximately 5, substrate thickness 0.4mm, hole diameter φ80μm ■ Aspect ratio of approximately 7.5, substrate thickness 0.6mm, hole diameter φ80μm ■ Aspect ratio of approximately 2.8, substrate thickness 0.5mm, hole diameter φ180μm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Our company conducts chemical etching processing of glass substrates, which can be shaped into various forms by dissolving glass in acid, thanks to our liquid resist that has HF resistance. The finished surface is smooth, and defects such as "microcracks" that occur during machining are less likely to arise, resulting in high strength. 【Features】 ■ Minimal damage to glass ■ Capable of processing narrow areas and thin glass *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Etching Equipment