プリケン List of Products and Services

Puriken Co., Ltd. is involved from the product development stage, designing and manufacturing prototypes of printed circuit boards to support our customers' product development. We have a wealth of design equipment such as CR5000BD and component library management tools, as well as comprehensive facilities for all processes of circuit board manufacturing. We have extensive experience in sets, industrial equipment, automotive (electrical equipment), components, and semiconductors! We have a proven track record in a wide variety of applications including video, communication, audio, and sensors. 【Business Content】 ■ Design and manufacturing of printed wiring boards ■ Component mounting and procurement ■ Metal mask production *For more details, please refer to the PDF document or feel free to contact us.

Our company has various equipment for performing maskless processing. We possess "LDI (Direct Imaging System)" for pattern exposure and resist exposure (formation), as well as "IJP (Ink Jet Printer)" for symbol creation. Additionally, for the manufacturing of high-density build-up substrates, we use the "Mitsubishi laser processing machine for substrate drilling" and the "Via Mechanics single-axis drilling machine (equipped with a vision system)." 【Features of Maskless Processing】 - Short delivery times and reduced initial costs due to the absence of mask production and management - Ability to respond to short delivery times even for repeat orders - Lot tracing is possible by digitizing symbols - High-precision substrate manufacturing is achievable through our unique correction technology and LDI *For more details, please refer to the PDF materials or feel free to contact us.

In our manufacturing facility, we perform "packaging and shipping" after the inspection is completed. To maintain the condition of the circuit boards, we package them in vacuum-sealed bags and take great care in handling the products. At the time of shipping, we will notify customers of the shipping status via email to ensure their peace of mind. 【Features】 ■ Packaged in vacuum-sealed bags ■ Shipping status notified via email *For more details, please refer to the PDF document or feel free to contact us.

In our process equipment, we conduct various "inspections" in the inspection room. We extract inspection nets edited from Gerber data and perform continuity and insulation tests using multiple probes. For visual and image inspections, we conduct a complete inspection of the appearance based on work instructions and processing drawings, using image inspection machines, magnifying glasses, loupes, calipers, and other tools. 【Visual and Image Inspection Main Inspection Items】 ■ Pattern Appearance: Conductor thinning, chipping, etc. ■ Resist: Smudging, peeling, etc. ■ Outline: Processing errors, number of V-cuts, etc. ■ Dimensions: Outline dimensions, board thickness ■ Conformity: Misalignment between holes and lands, resist misalignment, silk misalignment, etc. *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "contour processing" using processing equipment. We are capable of "contour processing" to finish the product shape from the manufacturing panel, and we use routers for this processing. Additionally, we can also handle "V-cut processing" and "perforation processing," where multiple holes or slits are made in a row, allowing for easy separation after implementation. [Types] ■ V-cut processing ■ Perforation processing ■ Contour processing *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "surface treatment" using process equipment. This refers to the finishing treatment of terminal parts, and we can handle water-soluble heat-resistant preflux treatment in-house. Other surface treatments (lead and lead-free solder leveling, gold plating, wire bonding gold plating, etc.) will be handled by our partner companies. [Types] ■ Heat-resistant preflux ■ Solder leveling ■ Gold plating ■ Nickel plating ■ Wire bonding *For more details, please refer to the PDF document or feel free to contact us.

Our company conducts "silk" printing using process equipment. The direct silk printing system is a system that directly prints onto substrates using high-speed printer heads and UV heat-curing ink. In a high-speed drying oven, the epoxy components of solder resist ink and symbol ink are thermally cured. 【Features of the Direct Silk Printing System】 ■ Automatic correction for scaling and tilt ■ Direct conversion from Gerber data ■ No need for films or plates ■ Reduced costs associated with storage space and equipment *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "resist" processing using equipment in the production line. Using a horizontal continuous double-sided spray coater, liquid resist ink is coated by scanning along an axis perpendicular to the transport direction with an air atomization spray. After applying to the surface, the substrate is automatically flipped to coat the reverse side as well. Additionally, during the pre-drying process, solvents in the resist ink are removed. 【Process】 ■ Surface leveling ■ Debris removal roller ■ Coating ■ Pre-drying *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "etching (outer layer)" using process equipment. In the plating room, the unnecessary parts of the copper are chemically dissolved. After etching and completing the conductor pattern, the etching resist (partial protective mask) is no longer needed, so it is removed, resulting in the copper foil pattern. 【Process】 ■ Etching ■ Stripping *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "patterning (outer layer)" using process equipment. In the clean room, to protect the through-hole plating, after forming the through-hole with copper plating, a photosensitive dry film is applied. The film is adhered to the substrate, and after exposure to ultraviolet light, the unexposed areas are swollen and removed in the developing room. 【Features of Photosensitive Dry Film】 ■ Photosensitive resist in film form ■ Sandwich structure sandwiched between polyester film and polyethylene film *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "resin filling" using process equipment. Conductive metal and non-conductive non-metal pastes are applied to the surface of the substrate, and after being embedded in the holes, they are printed using a screen plate. By overheating and curing the resin, and then performing lid plating after polishing, a flat surface is achieved. 【Process】 1. Drilling 2. Copper plating 3. Resin filling 4. Lid plating *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "hole processing" using process equipment. In the NC room, we drill two reference holes for installation in the drilling device and insert stack pins. After setting it in the device, we use NC data that controls the drilling position according to our processing conditions to carry out the drilling. CO2 (carbon dioxide) lasers cannot penetrate copper due to reflection on copper foil, making them suitable for forming blind vias. We can pre-develop the via holes, perform etching, and then drill holes with a laser. 【Process】 ■ Drilling of reference holes ■ Fixing the panel stack ■ Drilling ■ Laser drilling ■ Completion of drilling *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "lamination pressing" using process equipment. We also carry out "Brown treatment (inner layer oxidation treatment)" which etches copper with chemical solutions, and "lamination assembly" where inner layer core materials, prepregs, and copper foils are stacked according to specified layer configurations in the pressing room. Lamination pressing involves placing the assembled lamination blocks inside a lamination mold onto the heating plates of the lamination press, where they are heated and pressurized to bond and integrate them. 【Process】 ■ Brown treatment (inner layer oxidation treatment) ■ Lamination assembly ■ Lamination pressing *For more details, please refer to the PDF document or feel free to contact us.

Our company conducts "intermediate inspections" using process equipment. By optically reading the patterns of printed circuit boards with AOI, we can detect various defects. Inspections can be performed using data or by sampling (using a clean board as a master), with a maximum range of 674mm x 720mm. 【Process】 ■ Inner layer pattern inspection ■ Measurement of impedance control boards ■ Surface leveling *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "etching (inner layer)" using process equipment. In the plating room, unnecessary copper parts are chemically dissolved. After the etching is completed and the conductor pattern is finished, the unnecessary etching resist (partial protective mask) is removed, resulting in a copper pattern. 【Characteristics of Ferric Chloride Etching Solution】 ■ Fast etching speed ■ High viscosity ■ Excellent etching precision ■ Recyclable *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "patterning (inner layer)" using process equipment. In the press room, we check the inner layer pattern with an X-ray drilling machine and create reference holes. In the developing room, we clean the boards cut to specified sizes and improve the adhesion of the dry film. In the clean room, we peel off the polyethylene film with an auto-laminating cutter while pressing it with a heat roll to ensure adhesion between the film and the substrate, followed by exposure to ultraviolet light. In the developing room, we swell and peel off the unexposed areas. [Process] ■ Reference hole processing ■ Surface leveling ■ Exposure ■ Development *For more details, please refer to the PDF document or feel free to contact us.

Our company performs "material cutting" using process equipment. The material (copper-clad laminate) arrives via a fixed size method. In the NC room, it is cut to work size using a wide-cut saw, and the corners are beveled. If the corners are at right angles, they are more likely to damage other substrates, so beveling improves work efficiency. 【Features】 ■ Material (copper-clad laminate) arrives via a fixed size method ■ Cut to work size using a wide-cut saw ■ Corner beveling *For more details, please refer to the PDF document or feel free to contact us.

At our company, we perform "CAM" using process equipment. We check the Gerber data or DXF data sent by our customers for any design flaws or manufacturing issues. Subsequently, we carry out drawing editing, laser drawing, and AOI data in CAM, and after the checker data, all manufacturing data is stored on our server. [Types] ■ Drawing Editing ■ Laser Drawing ■ AOI Data ■ Router Data ■ Checker Data *For more details, please refer to the PDF materials or feel free to contact us.

We would like to introduce our company's "ISO initiatives." As a corporate social mission, our environmental philosophy is to contribute to the realization of a sustainable human society and a healthy global environment through corporate activities rooted in a spirit of inquiry into circuit board design and manufacturing technology. Additionally, our quality policy aims to earn customer trust by providing quality that meets requirements and expectations. 【Guidelines for Action】 ■ Strive to purchase and sell products that are compatible with environmental conservation ■ Comply with environmental laws and regulations, as well as other requirements agreed upon by our company ■ Set goals for environmental objectives, such as actively reducing environmental pollutants, in order to achieve our environmental philosophy and strive for continuous improvement in environmental performance ■ Conduct environmental education and publicly disclose our activities *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce "implementation," which is a key point in our design. Since the temperature behind tall components tends to rise less, we consider the flow direction of reflow when arranging components. If it leads to mass production, we will adjust the pad dimensions, shapes, and mounting pitch to match the specifications of the mass production factory. 【Features】 ■ Align the mounting surface of components that cannot undergo double reflow Heavier components are placed on the back side of the mounting ■ Arrange components considering the flow direction of reflow ■ Match the thermal capacity of the land on both sides of chip components as much as possible ■ Consider the space for soldering iron for hand-placed components *For more details, please feel free to contact us.

We would like to introduce "EMC," which is a key aspect of our design. Check the component placement to ensure that the crystal is not located at the edge of the board, that the filter circuit is near the external IF, and that the damping resistor is placed close to the output pin. Also, verify the position of the termination resistor and the placement of the bypass capacitor. For wiring, confirm that high-speed signal lines are not routed to the edge of the board, and route high-speed signals and bus lines as much as possible in the inner layers. 【Features】 ■ Plain ■ Component placement ■ Wiring *For more details, please feel free to contact us.

We would like to introduce "signal quality," which is a key design point for our company. The appropriate pattern width and via for the current value are roughly 1A/1mm and 1A/φ1.0mm. The placement of capacitors should be as close as possible to the corresponding terminals for those with smaller multipliers. GND vias should be placed as close to the pads as possible, and power lines should connect to the corresponding terminals via the capacitors, taking into account simultaneous switching of bus lines. 【Features】 ■ Appropriate pattern width and via for the current value ■ Solid patterns may become narrower due to via clearance ■ Placement of capacitors ■ Clock, control signals, and reset signals should be routed in a way that does not interfere with other wiring *For more details, please feel free to contact us.

□Problems (What should I do!) 1. I can't get the samples for the customer ready in time! (What should I do!) 2. The manufacturer I always rely on has turned me down! (What should I do!) 3. Is the current specification okay for the new evaluation (developing the product)... I don't understand the circuit board! (What should I do!) □Solutions (Because it's Priken, we can do it!) 1. I can't get the samples for the customer ready in time! (What should I do!) Example) An engineer who understands circuits responds at the contact point, we have all the board manufacturing equipment, and we collaborate with over 10 assembly factories (Because it's Priken, we can do it!) 2. The manufacturer I always rely on has turned me down! (What should I do!) Example) We think of feasible methods, listen to what the customer wants to achieve, and propose optimal specifications, delivery times, and costs (Because it's Priken, we can do it!) 3. Is the current specification okay for the new evaluation (developing the product)... I don't understand the circuit board! (What should I do!) Example) We have a track record with various industries (over 10,000 items annually), we propose optimal materials and specifications, and we also explain the reasons (Because it's Priken, we can do it!) *For more details, please refer to the PDF document or feel free to contact us.

Our company provides PCB manufacturing, component procurement, and prototyping, including small-scale production, starting with AW design. Even without PCB data, we can recreate data from physical samples, and we also handle component procurement, component assembly, and rework tasks. With our PCB process tracking service "Progress-kun," you can view the production progress of PCBs ordered by customers in real-time. 【Unique Services】 ■ Data can be recreated from physical samples even without PCB data ■ Component procurement, component assembly, and rework tasks are also available ■ Real-time viewing of production progress for PCBs ordered by customers ■ On-site seminars and factory tours related to PCBs are available upon request *For more details, please refer to the PDF materials or feel free to contact us.

Our company is engaged in the design, manufacturing, and component assembly of printed circuit boards, as well as the production of metal masks. In particular, in board manufacturing, we offer a range of products tailored to your needs, starting with "standard boards" that can be produced as single-sided, double-sided, or multilayer through-hole boards, as well as "BVH/IVH multilayer boards" that connect only the necessary layers without penetrating the holes of multilayer boards. 【Product Lineup】 ■ COB (Chip on Board) boards ■ Edge through-hole boards ■ Impedance control boards ■ Pad on through-hole boards (with resin or metal paste) ■ Cavity boards (recessed boards or special laminated boards), etc. *For more details, please download the PDF or feel free to contact us.

We would like to introduce "cost," which is a key point in our design. The number of boards is determined while satisfying physical conditions, considering efficient area and shape. We select appropriate layer composition and materials to avoid being over-spec. We aim to make the line and space as large as possible, while keeping the board thickness/hole diameter (aspect ratio) as small as possible. 【Features】 ■ Considers efficient area and shape while satisfying physical conditions ■ Takes into account usage and specifications ■ If it leads to mass production, considers the specifications of the mass production factory *For more details, please feel free to contact us.

Smartphone chip components are becoming increasingly smaller, and product testing for 0201 sizes is actively being conducted. In printed circuit boards, the formation of micro-openings and the ability for high-precision alignment are becoming important. At Priken, we provide substrates that achieve both micro-openings and high positional accuracy by forming solder resist openings using direct imaging methods. Please feel free to contact us if you have any requests. 【Specifications】 ■ Minimum opening size: Φ70±5μm ■ Pattern/resist clearance: 20μm ■ Mask film-less *For more details, please download the PDF or feel free to contact us.

At our company, we operate a simulation tool called "Estimate-kun," which is specialized in circuit board manufacturing, to propose various structures of circuit boards based on our extensive prototyping experience. By providing us with the basic specifications, we can suggest circuit boards that can be manufactured more quickly and at an optimal cost. Additionally, we will propose points for relaxing design rules based on the balance of risk, process steps, and cost. 【Features】 ■ Extract necessary materials and process conditions for various structures of circuit boards ■ Achieve matching with various specifications ■ Produce circuit boards at suitable costs *For more details, please download the PDF or feel free to contact us.

We handle "electrical characteristic measurement substrates" used in the development processes of chip components and connectors, as well as in shipping inspections. We provide comprehensive proposals for precise impedance management, design rules considering product reliability, structures suitable for measurement methods, and surface treatments, delivering high-precision and durable substrates. 【Features】 ■ Impedance control: ±10% / coupon management, ±3% / selection ■ Proposals for design rules, structures, and surface treatments tailored to measurement applications ■ One-stop solution: from evaluation board creation to metal masks and assembly *For more details, please download the PDF or feel free to contact us.

We would like to introduce our "substrate that dissipates heat faster." With the emergence of high-output power semiconductors, new implementation methods and thermal management strategies are required. From the perspective of printed circuit board manufacturing, we propose a substrate structure that can dissipate heat more quickly. Additionally, we customize the substrate to optimize the arrangement and shape of thermal vias according to usage, allowing for greater heat dissipation. 【Features】 ■ Simple thermal calculations conducted from the perspective of substrate manufacturing ■ Suitable designs presented based on calculation results ■ Proposals for substrate structure and heat dissipation strategies by our technical department *For more details, please download the PDF or feel free to contact us.

We would like to introduce "prototypes," which are the main products of Puriken Co., Ltd. These are intended for products that have not yet been released to the market. Some are aimed for release in 2 to 3 years, and together with our development department and customers, we are creating the future of printed circuit boards. In response to demand, we are making them lighter, thinner, shorter, and smaller. To achieve this, we continue to select new materials, pursue production processes, and develop technologies. [Features] - Compatible with various products - Available in as little as 1 day - Orders accepted from just one board *For more details, please refer to the related links or feel free to contact us.

We would like to introduce the production system of Puriken Co., Ltd. The number of orders received in a month ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be made on the same day the order is received. What makes this possible is our one-stop system, which allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. 【Features】 ■ Accommodates a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from a single circuit board *For more details, please refer to the related links or feel free to contact us.

We are pleased to present materials introducing "substrates that dissipate heat faster." This document provides a detailed comparison of the structural differences between thermal vias and copper pins, noting that while their cross-sections may appear similar, the filling materials inside the thermal vias differ. It also includes information on "high thermal conductivity substrates" and more. The explanations are supported by graphs, tables, and formulas, making the content easy to reference. We encourage you to download it and read through it. [Contents] ■ Structural comparison of thermal vias and copper pins ■ What are high thermal conductivity substrates? ■ Comparison of thermal conductivity between thermal vias and copper pins ■ Effects of changing the filling material in thermal vias *For more details, please download the PDF or feel free to contact us.

We are pleased to present materials introducing our "Measurement Substrates for Electrical Characteristics." This document summarizes the error factors in impedance management, the differences between models and actual products in "Aligning Impedance," and includes information on "Differences Between Measurement Substrates and General Substrates." The content is designed to be easily referenced during your consideration of implementation. Please feel free to download and read it. 【Contents Included】 ■ Aligning Impedance ■ Differences Between Measurement Substrates and General Substrates ■ Compatibility with Measurement Methods *For more details, please download the PDF or feel free to contact us.

We are pleased to offer a document introducing "What can be done with the manufacturing simulator." This document provides a detailed explanation of various functions such as product layout functionality, yield prediction functionality, and finishing prediction functionality. It is designed to be a useful reference when considering implementation. We encourage you to take this opportunity to download and review it. 【Featured Functions】 ■ Product Layout Functionality ■ Yield Prediction Functionality ■ Finishing Prediction Functionality ■ Cost Estimation Functionality ■ Impedance Management Optimization Functionality *For more details, please download the PDF or feel free to contact us.

We are pleased to present materials introducing our "Solder Resist Formation Technology." This document includes specifications such as terminal size, clearance, solder mask thickness, and surface treatment, along with images. Please make use of it when selecting products. [Featured Products] ■ SMD (Solder Mask Define) ■ NSMD (Non-Solder Mask Define) *For more details, please download the PDF or feel free to contact us.

We are pleased to present materials introducing our comprehensive web system "PrikenPlus＋." This system allows you to check the specifications, manufacturing processes, and shipping status of the printed circuit boards you ordered in real-time through our PCB process tracking service "Shinchoku-kun," with detailed explanations of its usage and features. We also provide information on security, such as the information that will be made public and the expected completion diagrams, making it easy to reference when considering implementation. We encourage you to take this opportunity to download and review it. 【Contents】 ■ Introduction to usage and features ■ About security ・Regarding the network ・Regarding public information ・Regarding expected completion diagrams ・Regarding the public period *For more details, please download the PDF or feel free to contact us.

【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Full support from circuit board design to manufacturing and component mounting (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all equipment in the circuit board manufacturing process), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K and 8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples available! For more details, please download the materials or contact us.

【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Comprehensive support from circuit board design to manufacturing and component assembly (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all circuit board manufacturing process equipment), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K/8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples are available! For more details, please download the materials or contact us.