プリケン List of Products and Services

Our company performs "patterning (outer layer)" using process equipment. In the clean room, to protect the through-hole plating, after forming the through-hole with copper plating, a photosensitive dry film is applied. The film is adhered to the substrate, and after exposure to ultraviolet light, the unexposed areas are swollen and removed in the developing room. 【Features of Photosensitive Dry Film】 ■ Photosensitive resist in film form ■ Sandwich structure sandwiched between polyester film and polyethylene film *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company performs "etching (outer layer)" using process equipment. In the plating room, the unnecessary parts of the copper are chemically dissolved. After etching and completing the conductor pattern, the etching resist (partial protective mask) is no longer needed, so it is removed, resulting in the copper foil pattern. 【Process】 ■ Etching ■ Stripping *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company performs "resist" processing using equipment in the production line. Using a horizontal continuous double-sided spray coater, liquid resist ink is coated by scanning along an axis perpendicular to the transport direction with an air atomization spray. After applying to the surface, the substrate is automatically flipped to coat the reverse side as well. Additionally, during the pre-drying process, solvents in the resist ink are removed. 【Process】 ■ Surface leveling ■ Debris removal roller ■ Coating ■ Pre-drying *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company conducts "silk" printing using process equipment. The direct silk printing system is a system that directly prints onto substrates using high-speed printer heads and UV heat-curing ink. In a high-speed drying oven, the epoxy components of solder resist ink and symbol ink are thermally cured. 【Features of the Direct Silk Printing System】 ■ Automatic correction for scaling and tilt ■ Direct conversion from Gerber data ■ No need for films or plates ■ Reduced costs associated with storage space and equipment *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company performs "surface treatment" using process equipment. This refers to the finishing treatment of terminal parts, and we can handle water-soluble heat-resistant preflux treatment in-house. Other surface treatments (lead and lead-free solder leveling, gold plating, wire bonding gold plating, etc.) will be handled by our partner companies. [Types] ■ Heat-resistant preflux ■ Solder leveling ■ Gold plating ■ Nickel plating ■ Wire bonding *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company performs "contour processing" using processing equipment. We are capable of "contour processing" to finish the product shape from the manufacturing panel, and we use routers for this processing. Additionally, we can also handle "V-cut processing" and "perforation processing," where multiple holes or slits are made in a row, allowing for easy separation after implementation. [Types] ■ V-cut processing ■ Perforation processing ■ Contour processing *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

In our process equipment, we conduct various "inspections" in the inspection room. We extract inspection nets edited from Gerber data and perform continuity and insulation tests using multiple probes. For visual and image inspections, we conduct a complete inspection of the appearance based on work instructions and processing drawings, using image inspection machines, magnifying glasses, loupes, calipers, and other tools. 【Visual and Image Inspection Main Inspection Items】 ■ Pattern Appearance: Conductor thinning, chipping, etc. ■ Resist: Smudging, peeling, etc. ■ Outline: Processing errors, number of V-cuts, etc. ■ Dimensions: Outline dimensions, board thickness ■ Conformity: Misalignment between holes and lands, resist misalignment, silk misalignment, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

In our manufacturing facility, we perform "packaging and shipping" after the inspection is completed. To maintain the condition of the circuit boards, we package them in vacuum-sealed bags and take great care in handling the products. At the time of shipping, we will notify customers of the shipping status via email to ensure their peace of mind. 【Features】 ■ Packaged in vacuum-sealed bags ■ Shipping status notified via email *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing