ASMPT Japan List of Products and Services

ASMPT offers optimal software proposals at each level: 【Equipment Level】【Line Level】【Factory Level】. - Equipment Level: Device-to-device communication that is not restricted to device manufacturers based on the IPC-HERMES-9852 standard. - Line Level: Seamless data integration based on the IPC CFX standard. - Factory Level: MES (Manufacturing Execution System) and smart factory packages provided by Critical Manufacturing, known as ASM WORKS. Regardless of the device manufacturer or software you use, existing systems within the factory can be integrated. Furthermore, by adding necessary system modules to ASM WORKS, customization tailored to customer needs is possible. ASMPT is prepared with various development resources, hardware, and software to propose the best plan for enhancing your production competitiveness. Trust ASMPT (formerly known as ASM Assembly Technology).

• Other operation management software

ASMPT has developed a simple yet high-performance air control frame system, the DEK VectorGuard stencil frame, which transcends traditional mechanisms. Traditional stencils experienced tension loss due to repeated printing and cleaning, raising concerns about print quality. However, the DEK VectorGuard maintains consistently stable tension throughout the stencil's lifespan, making it effective for narrow opening and narrow pitch applications. By adopting the air control frame system, the DEK VectorGuard also eliminates tension differences among operators during stencil installation. Features and Benefits: ■ A simple yet high-performance air control frame system that could become the future industry standard ■ Optimizes tension across the entire stencil from four directions ■ Adopts an air control frame system that eliminates tension differences caused by operators ■ Achieves stable tension throughout the stencil's lifespan ■ Does not use epoxy adhesives that may degrade or wear over time ■ Reduces stencil storage space by 75% compared to traditional methods ■ Compatible with cutting-edge stencils such as 3D stencils ■ Offers a variety of frame sizes

• Soldering Equipment

The DEK TQ (SMT stencil printer and solder printer) from ASMPT (formerly known as ASM Assembly Technology) is compact, requiring only 1.3 square meters of installation space. Furthermore, it is a high-performance solder printer with significantly improved 【high speed】【high precision】【maintainability】. With its evolved linear drive, off-belt printing, and innovative clamping system, it achieves a stable printing process with unprecedented accuracy even for 0201 (mm) components. Additionally, it allows for 【paste replenishment without stopping production】 and enables 【up to 8 hours of production without assistance】, equipped with numerous automation features, making it an ideal printer for future smart factories. <Features> ■ Ultra-high precision printing accuracy of ±17.5um with 2.0Cpk ■ Maximized throughput with a core cycle time of 5 seconds ■ Automation and labor-saving capabilities ■ Compatible with various interfaces and communication standards used in SMT smart factories *For more details, please download the PDF or contact us.

• Soldering Equipment

For those who want to avoid the hassle of preparing and operating adhesive application machines (dispensers). The SIPLACE Glue Feeder allows for easy adhesive application in several locations. ● Since adhesive application occurs within the assembly process, it enables an efficient adhesive process while minimizing the impact on assembly speed. ● Adhesive is applied in dot (hemispherical) form on the underside of components. ● The amount of adhesive applied is automatically calculated on the supporting server system (SIPLACE Pro) based on the size of the components being applied. (Manual settings are also possible.) ● SIPLACE Vision (image recognition) determines the quality of the applied adhesive. In the event that it is judged to be defective, it will not be used on the product, providing peace of mind. ● It is equipped with a nozzle heater that temporarily reduces viscosity for high-viscosity adhesives. ● The mounting structure is similar to that of component feeders, allowing it to be installed on the same feeder cart, making installation and removal very easy. ● Installation and removal are simple, allowing for easy replenishment of adhesive as well as cleaning and maintenance at your convenience. ● Smooth movement within and between assembly machines enables flexible adhesive application.

• Mounter

Are you having trouble with the installation of support pins for the circuit board on your implementation machine? The ASM Smart Pin Support is a production support system that automatically and accurately installs circuit board support pins during the setup of the mounter, eliminating the hassle for operators and preventing installation errors. Trust ASMPT (formerly known as ASM Assembly Technology). ●【Visual confirmation of support pins】You can visually confirm the automatic installation positions of the circuit board, components, and support pins on the screen of the linked production support server software "Siplace Pro." ●【Mouse operation on the screen】You can easily and safely place support pins in the desired location using mouse operations on the screen. ●【Automatic support for installation and storage】Support pins are stored in a pin stocker, and installation and storage are performed automatically with each setup change. With this support, after the system is implemented, it will automatically handle the installation of support pins, freeing you from the hassle.

• Mounter

We are pleased to introduce our new product, the SPI solder printing inspection machine, ASM ProcessLens. 【Features】 ■ A high-performance SPI system equipped with a DLP (Digital Light Projector) chip featuring 8 million digitally controlled micro-mirrors. ■ Measurement without shadows is possible through moiré pattern projection and multiple light sources. ■ High-resolution 2D images, 3D on-the-fly correction for substrate warping, and extremely powerful image processing algorithms enable even more advanced measurements, achieving stabilization of the printing process and improvements in throughput and productivity. Leave it to ASMPT (formerly known as ASM Assembly Technology). *For more details, please contact us or download the PDF for more information.

• Circuit Board Inspection Equipment

ASM ProcessExpert is a groundbreaking solder paste inspection system that significantly reduces false reports and achieves quality assurance and productivity improvements through the combination of ASM ProcessLens (hardware) and ASM ProcessEngine (software), which are 5D inline SPI technologies. With overwhelming inspection accuracy and autonomous adjustments to printing parameters through self-learning, it contributes to cost reduction by decreasing line stoppages and the frequency of user assistance. It automatically sets the printing process in real-time, recognizes trends, modifies printing process parameters, and directly and autonomously changes the printing parameters of DEK printers. It addresses parameters such as cleaning cycles, offsets, squeegee pressure, and printing speed, contributing to cost reduction by significantly reducing inflexible threshold settings, false reports, line stoppages, and the frequency of user assistance.

• Other mounting machines
• Circuit Board Inspection Equipment

The platform of the DEK NeoHorizon iX is based on a highly stable frame design. The torsional rigidity and unique high resonance frequency provide the machine's frame with a foundation for long life and long-term precision. The DEK Neo-Horizon iX has improved the repeatability of processes based on the AVS measurement method to a maximum of ±20 μm @ 2 CpK, thanks to its excellent controller and bus system. All printers are AVS certified and will be shipped with an AVS certificate. Features: - Flexible configuration allows for easy addition of options later - Machine repeatability: ±12.5 [μm] @ > 2 Cmk (±6 Sigma) - Compatible with DEK Grid-Lok (automatic substrate support system) and 2D solder inspection functions *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

The "SIPLACE SX" is the most flexible machine with SIPLACE capacity-on-demand solutions, featuring an open architecture platform that facilitates the introduction of new technologies. Leave it to ASMPT (formerly known as A.S.M. Assembly Technology (ASM)). 【Features】 Covers all components with three heads Standard pressure-controlled placement with all heads and nozzles. ■ High-speed placement of small components down to 0201 mm with SIPLACE SpeedStar ■ SIPLACE MultiStar: A head that automatically changes modes on demand, covering a wide range of component sizes ■ SIPLACE TwinStar: A head for irregular components such as high, large, and heavy parts *For more details, please refer to the PDF document or feel free to contact us.

• Mounter

- 70% reduction in printing machine setup time - Particularly effective for small lot and diverse product manufacturing - 80% adoption rate among customers using ASM printing machines - Maintenance can be easily performed Leave it to ASMPT (formerly known as ASM Assembly Technology).

• power supply

The "SIPLACE TX micron" is a surface mount machine suitable for advanced packaging applications, capable of achieving a minimum accuracy of ±10 μm (3σ). By using "pressure control" to detect contact with the substrate before releasing components, it minimizes warping and vibrations of the substrate while preventing defects such as solder bridges. It has minimal angular error and can be implemented in tight spaces, as well as accommodating the mounting of extremely small components sized 0201 m. 【Features】 ■ Maximum mounting speed of 93,000 CPH ■ Mounting accuracy of ±10 μm (3σ) * Equipped with vacuum clamps ■ High-resolution scale made of glass ceramic ■ Advanced software algorithms * For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Mounter
• Soldering Equipment
• Other mounting machines

The "SIPLACE TX" is an assembly solution that offers high precision (22 μm (3 σ)) and high speed (up to 78,000 cph) with a small footprint (1 m × 2.3 m). It can mount the next generation of small components, 0201 mm, at full speed just like other components. It supports efficient mass production, non-stop setup changeovers, and cutting-edge production concepts. Trust ASMPT (formerly known as A.S.M. Assembly Technology (ASM)). 【Features】 ■ SIPLACE SpeedStar placement head with precision of up to 25 μm (3 σ) ■ SIPLACE MultiStar: up to 25,500 CPH ■ SIPLACE TwinStar: head for odd-shaped components ■ SIPLACE JEDEC tray feeder: with up to 18 JEDEC trays ■ SIPLACE TX Micron: mounting precision of up to 15 μm (3 σ) *For more details, please refer to the PDF document or feel free to contact us.

• Database

The "SIPLACE Xs Series" is an implementation platform suitable for demanding mass production applications such as smartphones, tablets, notebooks, LED arrays, and automotive electronics. It is the optimal machine for cases requiring world-class implementation speed, the lowest dpm rate, non-stop setup changes, rapid new product introductions, high-speed implementation of large boards, and ultra-small components. Leave it to ASMPT (formerly known as A.S.M. Assembly Technology (ASM)). 【Features】 Covers all components with three heads All heads and nozzles feature pressure-controlled implementation as standard. ■ High-speed implementation of small components down to 0201 mm with SIPLACE SpeedStar ■ SIPLACE MultiStar: A head that automatically changes modes on demand, covering a wide range of component sizes ■ SIPLACE TwinStar: A head for irregularly shaped components such as high, large, and heavy parts *For more details, please refer to the PDF document or feel free to contact us.

• Mounter