リトルデバイス List of Products and Services

"MR-BGA" is a mounting ball that allows for implementation simply by forming a metal film on a rubber ball instead of melting metal. Since it can be joined at room temperature, it enables the mounting of components that are sensitive to heat. Additionally, because it is not melted, it can be removed and used like a connector. The shape and size are similar to BGA solder balls, but the connection process is based on contact pressure, similar to a connector process. It features a low resistance of 5mΩ, excellent high-frequency characteristics, no reflective noise, a transfer speed of 25Gbps, and outstanding durability against vibration. [Features] - Low contact pressure of 5g per pin - Cold and heat resistance from -40°C to 200°C, with a momentary tolerance of 300°C *For more details, please download the PDF or contact us.

• Other metal materials