名菱テクニカ Product Lineup

Under the theme of "New solutions for cutting-edge class printed circuit board manufacturing," we exhibited the actual machines "PCB Separator" and "Laser PCB Marking Device" at the Mitsubishi Electric Corporation booth. For the "PCB Separator," we proposed the standalone type 'MR2535H2' with a built-in dust collector that saves space, and the turntable type 'MR2535H2T' that allows parallel setup during PCB separation, enhancing productivity. For the "Laser PCB Marking Device," we offered high-resolution printing that supports the fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials. Thank you for visiting us. ★ Our company is hosting various seminars, including the ones featuring the exhibited machines. If you are interested, please participate through the "Web Seminar Registration."

Under the theme of "New Solutions for Cutting-Edge Class Printed Circuit Board Manufacturing," we exhibited the "New PCB Marking Device" and "PCB Separator" at the Mitsubishi Electric Corporation booth. The "New PCB Marking Device" offers high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as high-resolution printing compatible with various materials. For the "PCB Separator," we proposed a highly productive device that allows for parallel setup during PCB separation using a turntable system. Thank you for visiting us. ★ Our company is hosting various seminars, starting with the exhibited machines. If you are interested, please join us through the "Web Seminar Registration."

We proposed the automation and labor-saving of the process from substrate supply to substrate division, palletizing onto the output tray, and substrate removal using the turntable substrate divider (MR2535H2T) and a robot with a traveling axis. ★Our company is hosting various seminars, starting with this exhibition machine. If you are interested, please join us through the "Web Seminar Registration."

We will demonstrate and introduce high productivity through parallel setup during substrate processing. Additionally, we proposed a reduction in man-hours and costs through in-house production of jigs using the implementation substrate division system 'Jig-Designer.' In the February seminar, we will present the exhibition content from Internepcon Japan, which was held at Tokyo Big Sight from January 25 to 27. If you are interested, please join us via the "Web Seminar Registration."

We will be showcasing the actual machines of the "Turntable-type PCB Separator" and "Laser PCB Marking Device" under the theme of "Solutions that contribute to solving challenges in the production field." We propose the "PCB Separator," a highly productive turntable-type PCB separator 'MR2535H2T' that allows for parallel setup during PCB separation. For the "Laser PCB Marking Device," we offer high-resolution printing that supports fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials. We invite you to visit our booth (East Hall 4, Booth No. E4-17). ★ A commemorative gift will be given to the first customers who visit the booth.