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  3. 名菱テクニカ 三菱電機グループ
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名菱テクニカ 三菱電機グループ

Establishment1980/11/01
capital6000Ten thousand
number of employees997
addressAichi/Higashi-ku, Nagoya-shi/1-14 Yata Minami 5-chome, inside Mitsubishi Electric Nagoya Works
phone052-722-1949
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last updated:Oct 31, 2025
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名菱テクニカ List of Products and Services

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Circuit board cutting machine Circuit board cutting machine
Substrate marking device Substrate marking device
Printed Circuit Board Cutting Time Simulation Printed Circuit Board Cutting Time Simulation
Instrument calibration Instrument calibration
絶縁材加工 絶縁材加工
展示会情報 展示会情報
お客様の声 お客様の声
自動化・省人化したい 自動化・省人化したい
展示会情報

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展示会への出展情報や過去の展示会の出展状況をご紹介します。

Report on the 2025 Total Solutions Exhibition for Electronic Devices

We exhibited the "PCB Separator" and "Turntable PCB Separator" that can be chosen based on production volume, as well as the "PCB Marking Device" that can accommodate a wide range of materials.

Under the theme of "New solutions for cutting-edge class printed circuit board manufacturing," we exhibited the actual machines "PCB Separator" and "Laser PCB Marking Device" at the Mitsubishi Electric Corporation booth. For the "PCB Separator," we proposed the standalone type 'MR2535H2' with a built-in dust collector that saves space, and the turntable type 'MR2535H2T' that allows parallel setup during PCB separation, enhancing productivity. For the "Laser PCB Marking Device," we offered high-resolution printing that supports the fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials. Thank you for visiting us. ★ Our company is hosting various seminars, including the ones featuring the exhibited machines. If you are interested, please participate through the "Web Seminar Registration."

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Report on the 2024 Total Solutions Exhibition for Electronic Devices

We exhibited the "new type substrate marking device" that supports a wide range of materials with high-quality fine printing and the "turntable-type substrate cutting machine."

Under the theme of "New Solutions for Cutting-Edge Class Printed Circuit Board Manufacturing," we exhibited the "New PCB Marking Device" and "PCB Separator" at the Mitsubishi Electric Corporation booth. The "New PCB Marking Device" offers high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as high-resolution printing compatible with various materials. For the "PCB Separator," we proposed a highly productive device that allows for parallel setup during PCB separation using a turntable system. Thank you for visiting us. ★ Our company is hosting various seminars, starting with the exhibited machines. If you are interested, please join us through the "Web Seminar Registration."

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Report on the 2023 Total Solutions Exhibition for Electronic Devices

We exhibited a "board cutting machine + robot transport system" that supports the automation of the printed circuit board cutting process.

We proposed the automation and labor-saving of the process from substrate supply to substrate division, palletizing onto the output tray, and substrate removal using the turntable substrate divider (MR2535H2T) and a robot with a traveling axis. ★Our company is hosting various seminars, starting with this exhibition machine. If you are interested, please join us through the "Web Seminar Registration."

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The 37th NePCON Japan 2023: First Exhibition of the H2T Circuit Board Divider Machine

We made our first exhibition of the turntable-type circuit board cutting machine MR2535H2T.

We will demonstrate and introduce high productivity through parallel setup during substrate processing. Additionally, we proposed a reduction in man-hours and costs through in-house production of jigs using the implementation substrate division system 'Jig-Designer.' In the February seminar, we will present the exhibition content from Internepcon Japan, which was held at Tokyo Big Sight from January 25 to 27. If you are interested, please join us via the "Web Seminar Registration."

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Notice of Participation in the 40th Internepcon Japan

We will exhibit a "turntable-type substrate cutting machine" that allows parallel setup during substrate cutting and a "substrate marking device" that can accommodate a wide range of materials!

We will be showcasing the actual machines of the "Turntable-type PCB Separator" and "Laser PCB Marking Device" under the theme of "Solutions that contribute to solving challenges in the production field." We propose the "PCB Separator," a highly productive turntable-type PCB separator 'MR2535H2T' that allows for parallel setup during PCB separation. For the "Laser PCB Marking Device," we offer high-resolution printing that supports fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials. We invite you to visit our booth (East Hall 4, Booth No. E4-17). ★ A commemorative gift will be given to the first customers who visit the booth.

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