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  6. Report on the 2024 Total Solutions Exhibition for Electronic Devices

Report on the 2024 Total Solutions Exhibition for Electronic Devices

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last updated:Nov 14, 2025

名菱テクニカ 三菱電機グループ
名菱テクニカ 三菱電機グループ
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We exhibited the "new type substrate marking device" that supports a wide range of materials with high-quality fine printing and the "turntable-type substrate cutting machine."

Under the theme of "New Solutions for Cutting-Edge Class Printed Circuit Board Manufacturing," we exhibited the "New PCB Marking Device" and "PCB Separator" at the Mitsubishi Electric Corporation booth. The "New PCB Marking Device" offers high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as high-resolution printing compatible with various materials. For the "PCB Separator," we proposed a highly productive device that allows for parallel setup during PCB separation using a turntable system. Thank you for visiting us. ★ Our company is hosting various seminars, starting with the exhibited machines. If you are interested, please join us through the "Web Seminar Registration."

    Circuit board processing machine
JPCA2024レポート.jpg

Report on the 2024 Total Solutions Exhibition for Electronic Devices

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JPCA2024レポート.jpg 02.jpg substrate_btn01.jpg divide_btn02.jpg
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【Exhibition Name】Total Solutions for Electronic Devices Exhibition 2024 【Dates】June 12, 2024 (Wednesday) to June 14, 2024 (Friday) 10:00 AM to 5:00 PM 【Venue】Tokyo Big Sight, East Hall 6, Mitsubishi Electric Booth (Booth No. 6G-42)

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【Circuit Board Marking Device: Features】 ■ Compatible with various materials such as metal and ceramics using fiber laser ■ Reduction in total cost due to higher precision printing and longer lifespan compared to CO2 laser ■ Capable of printing in small space areas due to fine printing 【Circuit Board Cutting Machine: Features】 ■ Equipped with two tables in an automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction in cutting time by setting Z-axis height for each router location ■ Built-in dust collector achieves compact device size

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Notice of Participation in the 2024 Total Solutions Exhibition for Electronic Devices

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We will be exhibiting the "New Circuit Board Marking Device" and "Circuit Board Separator" at the Total Solution Exhibition for Electronic Devices, held at Tokyo Big Sight from June 12 to June 14, 2024. We look forward to your visit at the Mitsubishi Electric Corporation booth. <Location> Tokyo Big Sight, East Hall 6 Inside the Mitsubishi Electric booth (Booth No. 6G-42) <Exhibition Details> "New Circuit Board Marking Device" We will propose high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as high-definition printing compatible with various materials. "Circuit Board Separator" We will propose a highly productive circuit board separation device that allows parallel setup during the separation process using a turntable system.

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名菱テクニカ

名菱テクニカ 三菱電機グループ

Industrial Machinery

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Since its establishment in 1980, when it was separated from Mitsubishi Electric Nagoya Works in the facilities and materials division, our company has been a member of the Mitsubishi Electric Group. Through various contract operations, we have nurtured our manufacturing capabilities and provided products and services related to various FA and mechatronic equipment to our customers. Moving forward, we will continue to contribute to solving the challenges faced in our customers' production sites by working on improving our comprehensive capabilities in manufacturing, including skill inheritance, production innovation, and quality improvement activities. As a trusted partner to our customers, we will value communication with them and deliver products and services that meet their satisfaction.

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