Notice of Participation in the 2024 Total Solutions Exhibition for Electronic Devices

We exhibited the "new type substrate marking device" that supports a wide range of materials with high-quality fine printing and the "turntable-type substrate cutting machine."

Under the theme of "New Solutions for Cutting-Edge Class Printed Circuit Board Manufacturing," we exhibited the "New PCB Marking Device" and "PCB Separator" at the Mitsubishi Electric Corporation booth. The "New PCB Marking Device" offers high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as high-resolution printing compatible with various materials. For the "PCB Separator," we proposed a highly productive device that allows for parallel setup during PCB separation using a turntable system. Thank you for visiting us. ★ Our company is hosting various seminars, starting with the exhibited machines. If you are interested, please join us through the "Web Seminar Registration."

• Circuit board processing machine

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html

• Circuit board processing machine

【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

The "PCB Cutting Machine Robot Transport System" can accommodate inline PCB cutting by connecting with the preceding and following processes. Additionally, it can handle batch processing by consisting of a magazine for loading PCBs and a magazine for storing the cut PCBs in trays. With the turntable PCB cutting machine (MR2535H2T) and a robot with a traveling axis, it contributes to reducing takt time, while also expanding the flexibility of the line layout and tray packing of printed circuit boards after cutting, thereby aiding in the automation and labor-saving of factory production. 【Features】 - The line configuration can flexibly adapt to factory layouts, including straight, U-shaped, and L-shaped arrangements. - The multi-joint robot allows for the discharge of cut PCBs, enabling the setting of PCB placement positions in the discharge tray, which is effective for PCB positioning in the next automation process. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board processing machine

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

HP Inc. will hold the "HP Future of Work AI Conference 2025" at Tokyo International Forum, Hall B. At this event, under the message "Freedom to be particular about how we work," we will introduce the possibilities of on-device AI and its practical applications, along with case studies and technological trends. Whether you are considering implementing AI or have already started using it, you are sure to find hints for your next steps. We sincerely look forward to your attendance.

Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

Providing Solutions to Support Your Business Challenges We warmly invite you to visit our booth at K 2025 to learn more about our approach and explore our latest innovations. 【K 2025】 – The World's No.1 Trade Fair for Plastics and Rubber Exhibition Dates : October 8 (Wed) – October 15 (Wed), 2025 Venue : Messe Düsseldorf, Düsseldorf, Germany Opening Hours : 10:00 AM – 6:00 PM (local time) MATSUI Booth : Hall 11 – Booth I53

[Lecturer] Kazuhisa Yuki, Professor, Department of Mechanical Engineering, Faculty of Engineering, Yamaguchi University of Science and Technology [Key Lecture Content] Currently, the world is facing a serious energy crisis and environmental issues. Particularly, due to the rapidly growing highly information-oriented society, the power demand of global AI data centers is expected to double from the 2024 level, surpassing Japan's total electricity consumption. In the future, to achieve a rich highly information-oriented society while maintaining carbon neutrality, securing a cheap and stable power supply is essential, and energy conservation in data centers will become the most important challenge. Against this backdrop, two-phase liquid immersion cooling technology, which can significantly reduce power input associated with cooling while achieving high cooling performance, is attracting attention. In this lecture, we will discuss efficient cooling technologies for data centers, evaluated based on cooling performance (air cooling/liquid cooling/liquid immersion technology), and outline the potential and technical challenges of liquid immersion cooling technology in particular.