東京製作所 List of Products and Services

1. Prevents the lifting of 1.8mm component reels. 2. Suppresses static electricity caused by reel rotation. Uses stretchable rubber anti-static (ESD) rope. 3. Prevents part misplacement due to reel diffusion. 4. Easy attachment and detachment with a simple bracket. The method of setting the bracket may vary depending on the model. * Please feel free to contact us. Also, take a look at our catalog.

A ceramic coating of 10 microns has been applied to the surface of the metal squeegee, resulting in a flexible body and a hard surface. The tip of the squeegee has been thinly polished. By making the blade edge thinner, flexibility is enhanced. Increased flexibility allows it to conform to the metal mask (stencil), stabilizing the filling of cream solder. 【Features】 ◆ Step processing at the tip: Improved printing quality and stable quality ◆ Surface treatment: Enhanced durability with ceramic coating ◆ Blade processing: Both sides of the 40mm and 50mm widths have blade edge processing shapes *For more details, please refer to the PDF document or feel free to contact us.

Three types to match the size of the nozzle shaft: 1. Designed to fit the outer diameter of the shaft compared to conventional cleaning tools. It effectively removes dirt adhering to the shaft. 2. Easy to clean, resulting in reduced cleaning time. 3. The main body of the tool is designed to be long, making it easy to reach the shaft. Anyone can easily perform the cleaning. *For more details, please refer to the PDF materials (catalog) or feel free to contact us.*

○ Reduction of cream solder input amount: Reduction of material costs Decrease in waste amount ○ Guide section (white): Material and shape with low resistance ○ One-touch positioning of the guide section: Easy positioning at 10mm pitch Adjustable guide position according to the substrate size Substrate size: 200mm to 350mm ○ The guide section rises, making cleaning easy * For more details, please refer to the website materials and catalog, but feel free to contact us.

Stably adsorbs tiny solder ball shapes. Traditionally, solder balls are mounted using dedicated machines, but they can now be mounted using assembly machines. Reduction of defect rates. The hole diameter, number of adsorptions, and hole pitch for solder balls can be designed according to your requirements. The suction ports are precisely processed to reduce suction errors. Example: Simultaneous mounting of 590 solder balls. *Please feel free to contact us.

The brush material is for static electricity removal (ESD), so it cleans and discharges the circuit board. It can be set on the transport rail of the printing machine, eliminating the need to move the equipment (inline type). It is cheaper compared to other companies' products. Compatible with printing machines from various manufacturers: models with circuit board transport rails and intermediate conveyors. *For more details, please refer to the catalog or feel free to contact us.*

Chip components are becoming smaller, and a bonding process for 1005 components is necessary. If there are any issues with the application using a standard bonding nozzle, we will manufacture a nozzle tailored to your requirements. Our company's wire electrical discharge machining equipment allows for fine hole processing. We can accommodate requests for the inner diameter of the bond application and hole pitch. <Features> ★ Pipe inner diameter: φ0.25mm and up ★ Pipe pitch: Can be adjusted as needed. ★ Stopper: Can accommodate tip sizes and special sizes. Type for 1005: Single point application, double point application Note: Depending on the characteristics of the bond, the size of the pipe may change. Please feel free to inquire if you have any requests. *For more details, please refer to the PDF file or feel free to contact us.

The shapes and materials of the mounting components are diverse. Our company achieves stable production through the design of nozzles for mounting machines that leverage our know-how. We possess processing technology for wire diameters of φ0.05 using horizontal wire processing machines, enabling ultra-fine processing. In addition to processing, we can also handle roughening of the adhesion surface through electrical discharge machining and non-stick treatments. [Processing of a part measuring 3mm x 3mm with a depth of 0.03mm, width of 0.08mm, and pitch of 0.2mm using a horizontal wire processing machine.] We accommodate various machine manufacturers and can change the material of the nozzle tip to urethane rubber, pads, or Delrin (POM). [Features] ■ Stable adhesion for mounting is possible with special nozzles. ■ We have processing technology for wire diameters of φ0.05. ■ We can also roughen the adhesion surface through electrical discharge machining. ■ Non-stick treatments are also available. *For more details, please refer to the PDF materials or feel free to contact us.

○ Reduction of cream solder input amount: Reduction of material costs and waste amount ○ Guide section (white): Material and shape with less resistance ○ One-touch positioning of the guide section: Easy positioning at 10mm pitch Guide position adjustable according to substrate size Substrate size: 200mm to 350mm ○ The guide section raises, making cleaning easy * For more details, please refer to the website materials and catalog, and feel free to contact us.

■ LED Components 　◎ Protruding Type - Scratch Prevention Measures 　　Material Change at the Tip: Nozzle tip processed using resin material (POM) 　　Special Shape: Compatible with micro chip components from 1608 to 3216 　◎ Surface Adhesive Type - Return Prevention Measures 　　Slit Processing: Slit processing possible on the nozzle suction surface using a horizontal wire processing machine with a wire diameter of 50μ, with a minimum width of 80μ and depth of 30μ. 　　Non-Adhesive Treatment: Non-adhesive surface treatment on the nozzle tip ■ Connector Components 　◎ Medium Suction Type: Minimum nozzle tip size 　　　　　　　　　　Performance Value: Outer diameter 0.6x10mm (Inner diameter 0.25mm) 　◎ Horizontal Suction Type: Compatible with parts where top surface suction is difficult 　　　　　　　　　　Minimum Pin Count: 2P~ can be manufactured ■ Switch Components 　◎ Protruding Component Rotation Type: Avoids suction on round and square protrusions 　　　　　　　　　　Such as detector switches ■ Shielded Large Components 　◎ Component Frame Suction: Suction pitch designed according to the size of the component ■ Large Flat Components 　◎ Suction Pad Type: Uses suction pads to hold large components 　　　　　　　　　　　Compatible with various pad sizes

■ LED Components 　　★ Surface Adhesive Type = Countermeasure for Carrying 　　　◎ Slit Processing: Slit processing with a width of 80μ and a depth of 30μ is possible using a horizontal wire processing machine with a wire diameter of 50μ on the nozzle suction surface. 　　　◎ Non-Adhesive Treatment: Non-adhesive surface treatment at the nozzle tip. 　　★ Convex Type = Scratch Prevention Measure 　　　◎ Change of Tip Material: Processing of the nozzle tip using resin material (POM). 　　　◎ Special Shape: Compatible with microchip components of 1608 parts. ■ Connector Components 　　◎ Medium Suction Type: Minimum nozzle size 　　　　　　　　　　Track record: Outer diameter 0.6mm x 10, inner diameter 0.25mm. 　　◎ Horizontal Suction Type: Suitable for parts where top surface suction is difficult. 　　　　　　　　　　Minimum pin count 2P and up can be manufactured. ■ Switch Components 　　◎ Convex Part Avoidance Specification: Type that avoids suctioning convex parts of round and square shapes. 　　　　　　　　　　For detector switches, etc. ■ Shield Large Components 　　◎ Suctioning the outer frame of the part: Suction pitch is designed according to the size of the part.

■ Shield Components Problem: The components are large ○ Tip Suction Pad: Design the suction pitch according to the size of the component. Large shield components that were manually placed can now be implemented. ■ LED Problem: Surface adhesion ○ Slit Processing: By applying precision processing to the tip, adhesive components can be implemented. Reduces contact area and mitigates adhesion. Eliminates the need to carry components back. ■ Connectors Problem: Unable to suction from the top surface ○ Side Suction: Enables the implementation of components without a suction area on the top surface. Similar components with different pin counts can be suctioned using the same method. Minimum pin count: 2P and up can be produced. ■ IC Components Problem: Suction surface slips ○ Nozzle Tip: Made of urethane rubber, pad, and treated with a rough surface. Increases the friction coefficient with the component to prevent slipping. ■ Switches Problem: Protrusions hinder suction ○ Internal processing of the nozzle to avoid protrusions: Maintains vacuum and enables suction while avoiding the switch area. ■ Various Special Nozzles

We will manufacture special nozzles to accommodate various sizes and shapes of parts. ☆ LED Surface adhesive type: Countermeasures for carrying home ■ Slit processing: Slit processing with a width of at least 80μ and a depth of 30μ is performed on the nozzle's suction surface using a horizontal wire processing machine with a wire diameter of 50μ. ■ Non-adhesive treatment: Non-adhesive surface treatment on the nozzle tip. Dome shape: Scratch prevention measures Using resin material (POM) for nozzle tip processing. ☆ Connector: Medium suction Outer diameter size 0.6mm x 10 Inner diameter 0.25mm ☆ Other special parts with low surface friction coefficient Slipping countermeasures: Parts where the nozzle slips during suction ■ Rough processing: Rough processing of the nozzle suction surface (Ra1.5μ to Ra2μ) ■ Urethane rubber: Urethane rubber is attached to the nozzle tip. ■ Suction pad: Can also adhere to BGA, CSP, etc.

The shapes and materials of mounting components such as LEDs, connectors, shields, and switches have become increasingly diverse. For those struggling with complex shapes that are difficult to adhere to, we offer stable production through the design of nozzles for mounting machines, utilizing our expertise. We can also manufacture various machine cutters, consumables, and jigs (such as circuit board cutting cutters). *We have recently started producing solder jet nozzles. We possess processing technology for wire diameters of φ0.05mm using horizontal wire processing machines, enabling ultra-fine processing. We accommodate various machine manufacturers. 【Features】 ■ Scratch prevention measures ■ Take-back measures ■ Support for parts that are difficult to adhere to from the top ■ Design of suction pitch according to the size of the parts ■ Compatible with various pad sizes *For more details, please refer to the PDF materials or feel free to contact us.

- Surface treatment increases hardness and prevents substrate debris adhesion. - Custom manufacturing is possible (blade angle modification) = extends lifespan. - Used cutters can be sharpened and reprocessed (also possible for other manufacturers' products). * We also manufacture sewing blades after shrink printing. This is listed in the product information. * For more details, please feel free to contact us.

We would like to introduce the "Selective Nozzle for Soldering Equipment" that we handle. By using materials and surface treatments suitable for soldering, we achieve a long lifespan and offer it at a low cost. We can also manufacture the base of the nozzle. 【Features】 ■ Selection of materials and surface treatments that are strong against solder, improving durability ■ Stability of soldering jet conditions ■ Improvement of surface roughness and reduction of oxide adhesion ■ Low cost ■ Improved precision by integrating the flange and nozzle *For more details, please download the PDF or feel free to contact us.

1. It is possible to process hole diameter, width, etc. using wires of 0.1 mm or less. 2. Processing of materials such as steel, carbide, synthetic diamond, and ceramics is also possible. 3. It is possible to extend the lifespan depending on the material. *Please feel free to consult us regarding processing shapes, dimensions, etc.