ペルノックス List of Products and Services

As a resin formulation manufacturer, we have consistently sold only resin products since our founding. This time, as a new business venture, we have combined the know-how we have accumulated over the years to manufacture and sell electrode films as resin processed products. In product development, we partnered with overseas medical device manufacturers and engaged in research and development. We improved upon traditional electrode films by achieving lower impedance, enhanced flexibility, reduced costs, and increased quality stability. Our electrodes can be used for a wide range of biomedical sensing applications, including ECG, EMG, EEG, and AED pads.

• Composite Materials

■ Easy electrical bonding without soldering Enables secure electrical connections without the need for soldering, making it suitable for users who are not skilled with soldering tools or for environments where heat cannot be applied. ■ Safe for heat-sensitive components and flexible substrates Cures at room temperature, preventing thermal damage to LEDs, plastic parts, FPCs, and other heat-sensitive devices. ■ Strong adhesion with stable, low-resistance conductivity Optimized silver filler formulation provides both excellent conductivity and high adhesive strength, ensuring long-term reliability even under vibration or mechanical stress. ■ Flexible after curing—ideal for bent or vibrating areas Maintains flexibility after curing, enabling use on curved surfaces, moving parts, or areas subject to repeated bending. ■ Suitable for creating or repairing circuit patterns Can be applied to form or repair conductive traces, making it useful for prototyping, R&D, and precision repair work. ■ Automatic mixing with a dedicated nozzle—simple one-handed operation A single push dispenses and mixes both components automatically, eliminating manual ratio control and improving work efficiency. ■ No special storage requirements Can be stored at room temperature—no refrigeration or freezing required—making it convenient for on-site use.

• Repair Agent
• Solder
• glue

It would be great to have a resin that maintains its performance unchanged even at high temperatures. This is the developed heat-resistant epoxy encapsulation resin created to solve that challenge. We would like to introduce our latest product lineup, which has undergone continuous improvements for power semiconductor modules, automotive devices, and components that require high heat resistance. *For more details, please download the PDF or feel free to contact us.

• glue

This is a solvent-based liquid paint designed with a focus on thermal radiation (infrared radiation) among the three heat dissipation mechanisms: thermal conduction, heat transfer (convection), and thermal radiation. It enables non-contact heat dissipation by radiating heat within the system as electromagnetic waves. By spray painting on substrates with relatively low emissivity, such as metal heat sinks or heat dissipation plates, the emissivity of the substrate can be improved. It has excellent weather resistance and can be used outdoors. *For more details, please download the PDF or feel free to contact us.*

• paint

○Two-component polyurethane resin that can cure quickly at room temperature ○Low viscosity, making injection work easy ○Good adhesion between different materials ○Rubber-like products with Shore A hardness of 80 or higher ○Flexible yet tough resin with excellent impact resistance *For more details, please download the PDF or feel free to contact us.*

• glue
• Other consumables

○ Since it is a Japanese formulation, it is easy to procure in Japan. Compared to overseas products, we can deliver in a short time. ○ Please consult us regarding the adjustment of binder types, solvent types, Ag amounts, and AgCl amounts. * For more details, please download the PDF or feel free to contact us. Contact: Business Strategy Office, Yamamura Email address: yamamura@pelnox.co.jp

• paint
• Coating Agent

○ Can be used for conductive bonding to heat-sensitive components and film substrates. ○ It is an epoxy type with good adhesion. ○ It is a non-hazardous material, making it easy to manage. *For more details, please download the PDF or feel free to contact us.*

• glue

Attention those struggling with adhesives! =====Amazing Features of ZC-210===== 1. Non-spreading, Thixotropic Ratio = 3 2. Capable of thin film curing, approximately 0.1mm 3. Coating toughness 4. Heat resistance, Tg = 175℃ 5. Quick curing, cures in 10 minutes at 160℃ *For more details, please download the PDF or feel free to contact us.

• glue

＝＝＝＝＝If you have any of the following concerns, please reach out!＝＝＝＝＝ ◆ UV-curable adhesives or sealants cannot be used due to shadow areas or light-blocking sections ◆ Curing with UV light is required, but post-curing is necessary ◆ Want to improve production line efficiency with short curing times ◆ Want to stop curing in a heating furnace *For more details, please download the PDF or feel free to contact us.

• glue