Search for products by classification category
Search for companies by industry
Added to bookmarks
Bookmark has been removed
You can't add any more bookmarks
By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Contact this company
1～1 item / All 1 items
We perform electroless Ni/Pd/Au (Nickel/Palladium/Gold) and Ni/Au (Nickel/Gold) plating. In the flip chip method, the formation of UBM (Under Bump Metallization) is essential for the bonding of metal pads and solder. In the case of wire bonding, applying a Pd plating film serves as a buffer during the bonding process, and it also allows for the Au film to be made thinner. Please feel free to contact us if you have any requests. 【Devices that require plating (examples)】 ■ Power MOSFET ■ IGBT ■ Diode ■ SiC ■ GaN *For more details, please download the PDF or feel free to contact us.
