ローム・メカテック List of News Articles

From the design and manufacturing of molds to the assembly of stamping molds, we mass-produce and supply various lead frames with high precision and high quality. There are many types of lead frames used in semiconductor devices. At Rohm Mecatech, we produce lead frames using stamping molds, and we have numerous achievements in lead frames that require deep pressing/bending. If you could provide us with the desired shape of the frame, we will conduct a technical review to see if we can accommodate your request, so please feel free to let us know. [Process for Requesting Lead Frames] ■ Send us the drawings of the lead frame you wish to manufacture. ■ After a technical review to determine feasibility, we will submit a quotation. ■ Place an order for the stamping mold and proceed with manufacturing. ■ Once the stamping mold is completed, mass production will begin. *For more details, please refer to the PDF materials or feel free to contact us.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your needs! At Rohm Mecatech, we have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your needs, so please feel free to reach out to us. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality.

After considering whether we can technically respond to the specifications provided, we will present you with a quotation! Our company possesses machining equipment for precision mold processing. Using cutting processing, we can manufacture custom-shaped products tailored to your needs, even from a single stem part. If you could provide us with the product specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to let us know. 【Features】 <Prototypes> ■ We have machining equipment for precision mold processing and can manufacture from a single piece. ■ We produce custom-shaped products according to your requirements. <Mass Production Standard Products> ■ The base part, which is a forged component, is produced in-house using our own molds. ■ With thorough quality control, we can supply high-quality products. *For more details, please refer to the PDF document or feel free to contact us.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out to us. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we also have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to let us know. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality.

We also propose processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3t servo press with 2 heads. We design the equipment to meet our customers' needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting molds, lead cutting molds, forming molds, and more.

The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. With low-pressure transfer control, fine adjustments are possible. It features an interactive condition setting screen, allowing for easy operation from the user's perspective via a 10-inch touch panel. As an option, it can accommodate vacuum molding specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Plunger cleaning with one-touch operation ■ Added short shot mode ■ Compatible with vacuum molding specifications (optional) ■ Real-time monitoring of resin pressure with internal pressure sensor (optional) ■ Multi-pot (2 to 5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us. Special site Related link - https://www.rohm-mechatech.co.jp/

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are individually replaced. For molds in fields other than semiconductors, we can offer proposals based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues of a customer who was struggling with poor maintenance of molds made through current matching production. 【Issue】 Poor maintenance of molds made through current matching production - In molds produced through current matching, if either the punch or die needs to be replaced, both the punch and die must be purchased as a set. - It was often necessary to send the entire mold set back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. 【Solution】 Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance between the punch and die and finishing them with micron-level precision, it became possible to replace them individually at the customer's site without the need for current matching. For more details on this case, please contact us or download the catalog for confirmation.

Please leave the lead frames for tantalum capacitors to us. At Rohm Mecatech, we produce lead frames for tantalum capacitors using stamping molds. We have a large-scale production system both in Japan and overseas, with ample capacity to quickly respond to customer requests at any time. If you could provide us with the desired shape of the frame, we can conduct a technical review to see if we can accommodate your needs, so please feel free to reach out. [Process for Requesting Lead Frames] ■ Send us the drawings of the lead frame you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Place an order for the stamping mold and proceed with production ■ Once the stamping mold is completed, mass production will begin *For more details, please refer to the PDF materials or feel free to contact us.

The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. With low-pressure transfer control, fine adjustments are possible. It features an interactive condition setting screen, allowing for easy operation from the user's perspective via a 10-inch touch panel. As an option, it can accommodate vacuum molding specifications. Please feel free to contact us when needed. 【Features】 ■ Plunger cleaning with one-touch operation ■ Added short shot mode ■ Compatible with vacuum molding specifications (optional) ■ Real-time monitoring of resin pressure with internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us. Special site Related link - https://www.rohm-mechatech.co.jp/

We also offer processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet our customers' needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting molds, lead cutting molds, forming molds, and more.

We also propose processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet our customers' needs. Additionally, we accept design and manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the equipment.

【All 8 pages! A clear illustration of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) come in various types, each designed for different roles according to the various processes. This document provides a clear explanation of each process with illustrations. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting 　・ Gate cut 　・ Tie bar cut 　・ Support cut ■ Post-cutting 　・ Lead cut 　・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

We also propose the processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle the design and manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the equipment.

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in mass production of lead frames for automotive IC components. If you could provide us with the shape of the frame and plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Lead Frame Requests】 ■ Send us the drawings of the lead frame you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping mold ■ Begin mass production after the stamping mold is completed *For more details, please refer to the PDF document or feel free to contact us.

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in the mass production of lead frames for automotive IC components. If you could provide us with the shape of the frame and plating specifications, we would be happy to conduct a technical review to see if we can accommodate your needs, so please feel free to reach out. 【Process for Lead Frame Requests】 ■ Send the drawings of the lead frame you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping mold ■ Begin mass production after the stamping mold is completed *For more details, please refer to the PDF document or feel free to contact us.*

We also propose the processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3t servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting molds, lead cutting molds, forming molds, and more, tailored to the equipment.

【All 8 pages! A clear diagram of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) have various roles tailored to different processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting 　・ Gate cut 　・ Tie bar cut 　・ Support cut ■ Post-cutting 　・ Lead cut 　・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

We also propose processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them onto a transport tray after cutting them into individual pieces. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the equipment.

We also propose processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, aligns and transfers them onto a transport tray after cutting them into individual pieces. It is equipped with a 3t servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle the design and manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the equipment.

The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. With low-pressure control for transfer, it allows for fine adjustments. It features an interactive condition-setting screen and can be easily operated from a user perspective using a 10-inch touch panel. As an option, it can accommodate vacuum forming specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Plunger cleaning with one-touch operation ■ Addition of short shot mode ■ Support for vacuum forming specifications (optional) ■ Real-time monitoring of resin pressure with an internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us. Special site Related link - https://www.rohm-mechatech.co.jp/

The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. With low-pressure transfer control, fine adjustments are possible. It features an interactive condition setting screen, allowing for easy operation from the user's perspective via a 10-inch touch panel. Optionally, it can accommodate vacuum forming specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Plunger cleaning with one-touch operation ■ Added short shot mode ■ Compatible with vacuum forming specifications (optional) ■ Real-time monitoring of resin pressure with internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us. Special site Related link - https://www.rohm-mechatech.co.jp/

Please leave the lead frames for tantalum capacitors to us. At Rohm Mecatech, we produce lead frames for tantalum capacitors using stamping molds. We have a large-scale production system both in Japan and overseas, allowing us to respond quickly to customer requests with ample capacity. If you could provide us with the desired shape of the frame, we will conduct a technical review to see if we can accommodate your needs, so please feel free to reach out. [Process for Requesting Lead Frames] ■ Send us the drawings of the lead frame you wish to produce. ■ After a technical review to determine feasibility, we will submit a quotation. ■ Place an order for the stamping mold and proceed with production. ■ Once the stamping mold is completed, mass production will begin. *For more details, please refer to the PDF document or feel free to contact us.

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are individually replaced. For molds in fields other than semiconductors, we can offer proposals based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues of a customer who was struggling with poor maintenance of molds made through current matching production. **Challenge** Poor maintenance of molds made through current matching production - In molds produced through current matching, if either the punch or die needs to be replaced, both the punch and die must be purchased as a set. - There were instances where the entire mold had to be sent back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. **Solution** Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace them individually at the customer's site without current matching when either the punch or die wore out. For more details on this case, please contact us or download the catalog for confirmation.

The "Fusion-MEP30" is a mold device specialized for prototypes and experiments. It allows for fine adjustments through low-pressure transfer control. An interactive condition setting screen is provided, enabling easy operation from the user's perspective via a 10-inch touch panel. As an option, it can accommodate vacuum molding specifications. Please feel free to contact us when needed. 【Features】 ■ Plunger cleaning with one-touch operation ■ Addition of short shot mode ■ Support for vacuum molding specifications (optional) ■ Real-time monitoring of resin pressure with internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us. Special site Related link - https://www.rohm-mechatech.co.jp/

We also propose processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them onto a transport tray after cutting them into individual pieces. It is equipped with a 3t servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the equipment.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we also have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. Our company designs and manufactures molds, assembles stamping molds, and mass-produces a variety of lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to let us know. [Features] ■ Proven track record of mass production ■ From mold design and manufacturing to stamping mold assembly, we mass-produce and supply various lead frames with high precision and quality.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we also have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out to us. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality.

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that in Japan in terms of both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continuously improving through interaction with Japanese staff. 【Features】 ■ Introduction of new equipment equivalent to that in Japan ■ Consistent production system for both semiconductor molds and lead frames ■ Support for global-scale business with a reliable network ■ Continuous improvement of local staff's technical skills through interaction with Japanese staff 【Company Overview】 ■ Established: November 23, 1993 ■ Capital: 150 million pesos ■ Number of Employees: 280 ■ Products: Semiconductor manufacturing molds, lead frames ■ Certifications: ISO 9001 / ISO 14001 / IATF16949

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are individually replaced. For molds in fields other than semiconductors, we can offer proposals based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues faced by a customer who was struggling with poor maintenance of molds made through current matching production. **Challenge** Poor maintenance of molds made through current matching production - In molds produced with current matching for punches and dies, if either the punch or die needs to be replaced, the entire set of punch and die must be purchased together. - It was sometimes necessary to send the entire mold set back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. **Solution** Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace the worn-out punch and die at the customer's site without the need for current matching. For more details on this case, please contact us or download the catalog for confirmation.

"Contributing to the reduction of lead time in semiconductor package development! Providing a small number of samples at a low cost!" "Do you have requests such as 'I urgently want to improve the existing package due to end-user demands'?" "I suddenly need sample products for an exhibition." "I want to confirm specifications with prototypes before mass production." In response to customer requests for 'quick delivery and low-cost preparation of mold tooling,' we offer the '7DAYS Prototype Service.' We can produce prototype mold tooling in as little as 7 days, contributing to the reduction of the development period for semiconductor packages. **Features** ■ Sample creation in as little as 7 days ■ Reduction of the development period for semiconductor packages ■ Shortened lead time for design samples ■ Providing a small number of samples at a low cost ■ Cost reduction possible by manufacturing only the reconfiguration parts **Main Benefits of the Service** ■ Quickly turning ideas into reality, facilitating smooth research and development ■ Quickly identifying issues, allowing for risk avoidance during mass production ■ Enabling faster market introduction of new products Please feel free to contact us first.

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that of Japan in both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continually improving through interaction with Japanese staff. **Features** - Introduction of new equipment equivalent to that of Japan - Consistent production system for semiconductor molds and lead frames - Support for global-scale business with a reliable network - Continuous improvement of local staff's technical skills through interaction with Japanese staff **Company Overview** - Established: November 23, 1993 - Capital: 150 million pesos - Number of Employees: 280 - Products: Semiconductor manufacturing molds, lead frames - Certifications: ISO 9001 / ISO 14001 / IATF 16949

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that in Japan in terms of both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continuously improving through interaction with Japanese staff. 【Features】 ■ Introduction of new equipment equivalent to that in Japan ■ Consistent production system for both semiconductor molds and lead frames ■ Support for global-scale business with a reliable network ■ Continuous improvement of local staff's technical skills through interaction with Japanese staff 【Company Overview】 ■ Established: November 23, 1993 ■ Capital: 150 million pesos ■ Number of Employees: 280 ■ Products: Semiconductor manufacturing molds, lead frames ■ Certifications: ISO 9001 / ISO 14001 / IATF 16949

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are replaced due to wear. For molds in fields other than semiconductors, we can offer proposals based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues faced by a customer who was struggling with poor maintenance of molds made through current matching production. 【Issue】 Poor maintenance of molds made through current matching production - In molds produced through current matching, if either the punch or die needs to be replaced, both must be purchased as a set. - There were instances where the entire mold had to be sent back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. 【Solution】 Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace the worn-out punch and die at the customer's site without the need for current matching. For more details on this case, please contact us or download the catalog for confirmation.

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that of Japan in both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continuously improving through interactions with Japanese staff. **Features** - Introduction of new equipment equivalent to that of Japan - Consistent production system for both semiconductor molds and lead frames - Support for global-scale business with a reliable network - Continuous improvement of local staff's technical skills through interaction with Japanese staff **Company Overview** - Established: November 23, 1993 - Capital: 150 million pesos - Number of Employees: 280 - Products: Semiconductor manufacturing molds, lead frames - Certifications: ISO 9001 / ISO 14001 / IATF16949

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in the mass production of lead frames for automotive IC components. If you could provide us with the specifications for the frame shape and plating, we can conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Place an order for the stamping mold and proceed with production ■ Once the stamping mold is completed, mass production will begin *For more details, please refer to the PDF document or feel free to contact us.

"Contributing to the reduction of lead time in semiconductor package development! Providing small quantities of samples at low cost!" "Do you have requests such as 'I urgently want to improve the existing package due to end-user demands'?" "I suddenly need sample products for an exhibition." "I would like to confirm specifications with prototypes before mass production." In response to customer voices expressing the need for "quick delivery and low-cost preparation of mold tooling," we offer the "7DAYS Prototype Service." We can produce prototype mold tooling in as little as 7 days, contributing to the shortening of the semiconductor package development period. 【Features】 ■ Sample creation in as little as 7 days ■ Shortening of the semiconductor package development period ■ Reduced lead time for design samples ■ Providing small quantities of samples at low cost ■ Cost reduction possible by manufacturing only the reconfiguration parts 【Main Benefits of the Service】 ■ Quickly turning ideas into reality, facilitating smooth research and development ■ Quickly identifying issues, enabling risk avoidance during mass production ■ Accelerating the market introduction of new products Please feel free to contact us first.

"Contributing to the reduction of lead time in semiconductor package development! Providing a small number of samples at a low cost!" "Do you have requests such as 'I urgently want to improve the existing package due to end-user demands'?" "I suddenly need sample products for an exhibition" "I want to confirm specifications with prototypes before mass production," etc.? In response to customer requests for "quick delivery and low-cost preparation of mold molds," we offer the "7DAYS Prototype Service." Prototype mold molds can be produced in as little as 7 days, contributing to the reduction of the development period for semiconductor packages. 【Features】 ■ Sample creation in as little as 7 days ■ Shortening the development period for semiconductor packages ■ Reducing lead time for design samples ■ Providing a small number of samples at a low cost ■ Cost reduction possible by manufacturing only the reconfiguration parts 【Main Benefits of the Service】 ■ Quickly turning ideas into reality, facilitating research and development ■ Quickly identifying issues, enabling risk avoidance during mass production ■ Enabling faster market introduction of new products Please feel free to contact us first.

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in mass production of lead frames for automotive IC components. If you could provide us with the shape of the frame and plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to manufacture ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping molds ■ Start mass production after the stamping molds are completed *For more details, please refer to the PDF document or feel free to contact us.

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in mass production of lead frames for automotive IC components. If you could provide us with the shape of the frame and plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping molds ■ Begin mass production after the stamping molds are completed *For more details, please refer to the PDF document or feel free to contact us.*

"Contributing to the reduction of lead time in semiconductor package development! Providing a small number of samples at a low cost!" "Do you have requests such as 'I urgently want to improve the existing package due to end-user demands'?" "I suddenly need sample products for an exhibition." "I want to confirm specifications with prototypes before mass production." In response to customer voices saying, "I want to prepare mold molds quickly and at a low cost," we offer the "7DAYS Prototype Service." We can produce prototype mold molds in as little as 7 days, contributing to the shortening of the semiconductor package development period. **Features** ■ Sample creation in as little as 7 days ■ Reduction of the semiconductor package development period ■ Shortening of lead time for design samples ■ Providing a small number of samples at a low cost ■ Cost reduction possible by manufacturing only the reconfigured parts **Main Benefits of the Service** ■ Quickly turning ideas into reality, facilitating research and development ■ Quickly identifying issues, enabling risk avoidance during mass production ■ Quickly bringing new products to market Please feel free to contact us first.

"Contributing to the reduction of lead time in semiconductor package development! Providing a small number of samples at a low cost!" "Do you have requests such as 'I urgently want to improve the existing package due to end-user demands'?" "I suddenly need sample products for an exhibition" "I want to confirm specifications with prototypes before mass production," etc.? In response to customer requests for "quick delivery and low cost for preparing mold molds," we offer the "7DAYS Prototype Service." Prototype mold molds can be produced in as little as 7 days, contributing to the shortening of the semiconductor package development period. 【Features】 ■ Sample creation in as little as 7 days ■ Reduction of the semiconductor package development period ■ Shortened lead time for design samples ■ Providing a small number of samples at a low cost ■ Cost reduction possible by manufacturing only the reconfiguration parts 【Main Benefits of the Service】 ■ Quickly turning ideas into reality, facilitating research and development ■ Quickly identifying issues, allowing for risk avoidance during mass production ■ Enabling faster market introduction of new products Please feel free to contact us first.

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in the mass production of lead frames for automotive IC components. If you could provide us with the shape of the frame and the plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Lead Frame Requests】 ■ Send us the drawings of the lead frame you wish to manufacture ■ After a technical review to determine feasibility, we will submit a quotation ■ Place an order for the stamping mold and proceed with production ■ Once the stamping mold is completed, mass production will begin *For more details, please refer to the PDF document or feel free to contact us.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying various lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to let us know. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying various lead frames with high precision and quality.

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that in Japan in terms of both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continuously improving through interaction with Japanese staff. **Features** - Introduction of new equipment equivalent to that in Japan - Consistent production system for both semiconductor molds and lead frames - Support for global-scale business with a reliable network - Continuous improvement of local staff's technical skills through interaction with Japanese staff **Company Overview** - Established: November 23, 1993 - Capital: 150 million pesos - Number of Employees: 280 - Products: Semiconductor manufacturing molds, lead frames - Certifications: ISO 9001 / ISO 14001 / IATF 16949