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After considering whether we can technically respond to the specifications provided, we will present you with a quotation! Our company possesses machine tools for precision mold processing. Using cutting processing, we can manufacture custom-shaped products tailored to your needs, even from a single stem part. If you could provide us with the product specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to let us know. 【Features】 <Prototypes> ■ We have machine tools for precision mold processing and can manufacture from a single piece. ■ We produce custom-shaped products according to your requirements. <Standard Mass Production Items> ■ The base part, which is a forged component, is produced in-house using our own molds. ■ With thorough quality control, we can supply high-quality products. *For more details, please refer to the PDF document or feel free to contact us.

【All 8 pages! A clear diagrammatic explanation of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) have various roles tailored to different processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting - Gate cut - Tie bar cut - Support cut ■ Post-cutting - Lead cut - Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

We also propose the processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them onto a transport tray after cutting them into individual pieces. It is equipped with a 3t servo press with 2 heads. We design the device to meet our customers' needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting molds, lead cutting molds, forming molds, and more, tailored to the device.

【All 8 pages! A clear diagram of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) have various roles tailored to different processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting 　・ Gate cut 　・ Tie bar cut 　・ Support cut ■ Post-cutting 　・ Lead cut 　・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we also have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are a wide variety of lead frame types used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, mass-producing and supplying various lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, mass-producing and supplying various lead frames with high precision and quality.

If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we also have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality. If you could provide us with the shape of the frame and other details, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out to us. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality.

The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. It allows for fine adjustments through low-pressure transfer control. An interactive condition setting screen is provided, enabling easy operation from the user's perspective via a 10-inch touch panel. As an option, it can accommodate vacuum molding specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Plunger cleaning with one-touch operation ■ Addition of short shot mode ■ Compatibility with vacuum molding specifications (optional) ■ Real-time monitoring of resin pressure with an internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us. Special site Related link - https://www.rohm-mechatech.co.jp/

By reducing the use of precious metals, we contribute to lowering product costs! Our company conducts consistent production and quality control in-house, from base press processing of hermetic seal components to assembly and plating. We also have a track record of thin Au plating, which helps reduce the use of precious metals and contributes to lowering product costs. If you could provide us with the product specifications, we will consider whether we can accommodate your request through technical evaluation. Please feel free to contact us when needed. 【Mass Production Standard Product Features】 ■ In-house production of the forged base components using our own molds ■ Contribution to "response speed, quality, and cost" through in-house integrated production ■ Ability to supply high-quality products through thorough quality control ■ Secured production capacity of 10 million pcs per month, accommodating customers with high volume needs *For more details, please refer to the PDF document or feel free to contact us.

If you could provide us with details about the shape of the frame, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We design and manufacture molds, assemble stamping molds, and mass-produce a variety of lead frames with high precision and quality for supply. If you could provide us with details about the shape of the frame, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out to us. 【Features】 ■ Proven track record of mass production ■ We design and manufacture molds, assemble stamping molds, and mass-produce a variety of lead frames with high precision and quality for supply.

If you could provide us with details about the shape of the frame, we will conduct a technical review to see if we can accommodate your request! At Rohm Mecatech, we also have a proven track record of mass production of lead frames for light-emitting diodes (LEDs). There are various types of lead frames used in semiconductor devices. We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality. If you could provide us with details about the shape of the frame, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out to us. 【Features】 ■ Proven track record of mass production ■ We handle everything from mold design and manufacturing to the assembly of stamping molds, producing and supplying a wide range of lead frames with high precision and quality.

【All 8 pages! A clear diagram of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) come in various types, each designed for different roles according to the various processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting - Gate cut - Tie bar cut - Support cut ■ Post-cutting - Lead cut - Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

We also propose processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3t servo press with 2 heads. We design the device to meet customer needs. Additionally, we handle everything from design to manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more, tailored to the device.

"IATF16949 certification obtained. Numerous achievements in mass production of lead frames for automotive IC components!" Our company designs and manufactures molds, assembles stamping molds, and mass-produces various lead frames with high precision and quality. We have obtained IATF16949 certification at our mass production facilities in the Philippines and Thailand, and we have numerous achievements in mass production of lead frames for automotive IC components. If you could provide us with the shape of the frame and plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to contact us. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping mold ■ Begin mass production after the stamping mold is completed *For more details, please refer to the PDF document or feel free to contact us.

"High precision positioning is possible with the adoption of precision ball screws!" "Features" - Energy-saving achieved by using AC servo motors - Digital adjustment of open height allows for compatibility with various molds - High precision positioning is possible with the adoption of precision ball screws - Processing conditions can be set according to the workpiece, including stop time specification, ram speed, and position specification We also accept inquiries for the design of prototype semiconductor package lead forming cut molds tailored to tabletop servo presses. ~Basic Information~ Main body size: 390mm(W) × 340mm(D) × 580mm(H) Main body weight: 50kg Mold size (standard): 118mm(W) × 170mm(D) × 131mm(H) Workpiece (standard size): MAX 80mm(W) ~Applications~ Trial production, small batch production, mass production

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are replaced due to wear. For molds in fields other than semiconductors, we can offer proposals based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues of a customer who was struggling with poor maintenance of molds made with current matching production. 【Challenge】 Poor maintenance of molds made with current matching production - In molds produced with current matching for punches and dies, if either the punch or die needs to be replaced, both must be purchased as a set. - There were instances where the entire mold set had to be sent back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. 【Solution】 Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace them individually at the customer's site without the need for current matching when either the punch or die wore out. For more details on this case, please contact us or download the catalog for confirmation.

We have produced numerous frames using copper alloys. We provide high-precision, high-quality mass production! Our company manufactures lead frames through stamping. We handle a variety of frame production using copper alloys, including Alloy 194, and we can assist with stable supply of frames. If you could provide us with the shape of the frame and plating specifications, we will consider whether we can accommodate your request and conduct a technical review, so please feel free to contact us. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce. ■ After a technical review to determine feasibility, we will submit a quotation. ■ Place an order for the stamping mold and proceed with production. ■ Once the stamping mold is completed, mass production will begin. *For more details, please refer to the PDF materials or feel free to contact us.

We also propose processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals of semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them onto a transport tray. It is equipped with a 3t servo press with 2 heads. We design the device to meet customer needs. Additionally, we handle everything from design to manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the device.

【All 8 pages! A clear diagram of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) come in various types, each designed for different roles according to the various processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting ・ Gate cut ・ Tie bar cut ・ Support cut ■ Post-cutting ・ Lead cut ・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

We also propose processing of leads after molding, from the equipment to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them onto a transport tray after cutting them into individual pieces. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the equipment.

With thorough quality control, we can supply high-quality products! From prototyping to mass production, leave it to us! Our company conducts integrated production and quality management in-house, from press processing to assembly and plating. We can also accommodate mass production for stems with Cu heat sink specifications. By using copper in the heat sink section, high heat dissipation is expected. If you could provide us with the product specifications, we will consider whether we can accommodate your request from a technical standpoint. Please feel free to contact us when you need our services. 【Cu Heat Sink Stem Features】 ■ We can accommodate heat sink shapes that are difficult to manufacture with press molds using Cu heat sink specifications. ■ By adopting a Cu heat sink, high heat dissipation is expected. *For more details, please refer to the PDF materials or feel free to contact us.

"We have experience using materials such as the 42Ni series and Cu series! We can assist with stable supply of frames." Our company produces lead frames through stamping. We have handled many frame productions using 42 alloy and can assist with stable supply of frames. If you could provide us with the shape of the frame and plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping mold ■ Once the stamping mold is completed, mass production will begin *For more details, please refer to the PDF materials or feel free to contact us.

We provide molds designed for long-term use, focusing on materials with minimal aging changes and high-quality finishes! At Rohm Mecatech, we offer high-precision, high-quality mold designs using advanced engineering techniques for thermosetting resins. We can also handle conventional molds using hydraulic presses, from design to production. Using new equipment introduced in each process, skilled workers carefully finish the machining. [Features] ■ We can handle conventional molds using hydraulic presses, from design to production. ■ We use new equipment introduced in each process. ■ Skilled workers complete machining with care and high precision. *For more details, please refer to the PDF document or feel free to contact us.

【All 8 pages! A clear diagrammatic explanation of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to molds used for cutting and bending the lead parts and excess resin after semiconductor package molding. Trim and forming molds (T/F molds) have various roles tailored to different processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting - Gate cut - Tie bar cut - Support cut ■ Post-cutting - Lead cut - Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are replaced as they wear out. For molds in fields other than semiconductors, we can provide proposals based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues faced by a customer who was struggling with poor maintenance of molds made with current matching production. **Challenge** Poor maintenance of molds made with current matching production - In molds produced with current matching for punches and dies, if either the punch or die needs to be replaced, both must be purchased as a set. - It was sometimes necessary to send the entire mold assembly back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. **Solution** Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace them individually at the customer's site without the need for current matching when either the punch or die wore out. For more details on this case, please contact us or download the catalog for confirmation.

Custom mold design compatible with existing molding equipment is also possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we have extensive experience with mold molds for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package areas measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and precisely finish the machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package areas measuring 30mm square through EDM processing - Use of new equipment introduced in each process - Skilled workers meticulously and precisely finish the machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold designs compatible with existing molding equipment are also possible! We have experience in producing opto-modules and more! At Rohm Mecatech, we have numerous achievements in mold designs for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously complete high-precision machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing - Utilization of new equipment introduced in each process - Skilled workers meticulously complete high-precision machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold designs compatible with existing molding equipment are possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we also have extensive experience with molded molds for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and precisely complete the machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing - Utilization of new equipment introduced in each process - Skilled workers meticulously and precisely complete the machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold designs compatible with existing molding equipment are also possible! We have a proven track record in the production of opto-modules and more! At Rohm Mecatech, we have extensive experience with molded molds for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously complete high-precision machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing - Use of new equipment introduced in each process - Skilled workers meticulously complete high-precision machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold designs compatible with existing molding equipment are also possible! We have experience in producing opto-modules and more! At Rohm Mecatech, we have numerous achievements in mold designs for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously complete high-precision machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing - Utilization of new equipment introduced in each process - Skilled workers meticulously complete high-precision machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold designs compatible with existing molding equipment are also possible! We have a track record of producing items such as opto-modules! At Rohm Mecatech, we have extensive experience with mold designs for packages that include lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) on semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers ensure careful and high-precision processing. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) on semiconductor package sections measuring 30mm square through EDM processing - Use of new equipment introduced in each process - Skilled workers perform careful and high-precision processing - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Using precision mold processing technology, it is possible to design and manufacture molds that maintain a certain level of accuracy even when punches and dies are replaced due to wear. For molds intended for fields other than semiconductors, we can offer suggestions based on the know-how cultivated in the semiconductor industry. If you have any concerns, please feel free to contact us. This time, we would like to introduce a case where we solved the issues faced by a customer who was struggling with poor maintenance of molds made with current matching production. 【Issue】 Poor maintenance of molds made with current matching production - In molds produced with current matching for punches and dies, if either the punch or die needs to be replaced, both must be purchased as a set. - There were instances where the entire mold set had to be sent back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. 【Solution】 Improved maintenance through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace them individually at the customer's site without current matching when either the punch or die wore out. For more details on this case, please contact us or download the catalog for confirmation.

【All 8 pages! A clear diagrammatic explanation of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and excess resin after semiconductor package molding. Trim and forming molds (T/F molds) come in various types, each designed for different roles according to the various processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting ・ Gate cut ・ Tie bar cut ・ Support cut ■ Post-cutting ・ Lead cut ・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

Contributing to the reduction of lead time in semiconductor package development! Providing a small number of samples at a low cost! "Do you urgently want to improve existing packages due to end-user demands?" "Do you suddenly need sample products for an exhibition?" "Do you have requests such as wanting to confirm specifications with prototypes before mass production?" In response to customer voices saying, "I want to prepare lead frames quickly and at a low cost," we offer the "7DAYS Prototype Service." Instead of the common etching process for lead frame prototypes, we use MERC processing (punching and knockout processing), allowing us to produce lead frames in as little as 7 days, thereby contributing to the shortening of the semiconductor package development period. 【Features】 ■ Sample creation in as little as 7 days ■ Shortening of the semiconductor package development period ■ Reduced lead time for design samples ■ Providing a small number of samples at a low cost ■ Initial costs are generally unnecessary 【Main Benefits of the Service】 ■ Quickly turning ideas into reality, facilitating smooth research and development ■ Quickly identifying issues, enabling risk avoidance during mass production ■ Allowing for faster market introduction of new products Please feel free to contact us first.

We provide molds designed for long-term use, focusing on materials with minimal aging changes and high-quality finishes! At Rohm Mecatech, we offer high-precision, high-quality mold designs for thermosetting resins using advanced design technology. We can also handle conventional molds using hydraulic presses, from design to production. Using new equipment introduced in each process, skilled workers carefully finish the machining. [Features] ■ We can handle conventional molds using hydraulic presses, from design to production. ■ We use new equipment introduced in each process. ■ Skilled workers complete the machining with care and high precision. *For more details, please refer to the PDF materials or feel free to contact us.

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that of Japan in terms of both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continuously improving through interaction with Japanese staff. **Features** - Introduction of new equipment equivalent to that of Japan - Consistent production system for both semiconductor molds and lead frames - Support for global-scale business with a reliable network - Continuous improvement of local staff's technical skills through interaction with Japanese staff **Company Overview** - Established: November 23, 1993 - Capital: 150 million pesos - Number of Employees: 280 - Products: Semiconductor manufacturing molds, lead frames - Certifications: ISO 9001 / ISO 14001 / IATF 16949

【All 8 pages! A clear illustration of the main 5 processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and excess resin after semiconductor package molding. Trim and forming molds (T/F molds) come in various types, each designed for different roles according to the various processes. This document provides a clear explanation of each process with illustrations. We are currently offering this catalog for free. Feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting ・ Gate cut ・ Tie bar cut ・ Support cut ■ Post-cutting ・ Lead cut ・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

We have experience using materials such as the 42Ni series and Cu series! We can assist with stable supply of frames." "Our company produces lead frames through stamping. We have handled numerous frame productions using 42 alloy and can assist with stable supply of frames. If you provide us with the shape of the frame and plating specifications, we can conduct a technical review to see if we can accommodate your request, so please feel free to contact us. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Order and manufacture the stamping mold ■ Begin mass production after the stamping mold is completed *For more details, please refer to the PDF materials or feel free to contact us.

"We have experience using materials such as 42Ni and Cu! We can assist with stable supply of frames." Our company produces lead frames through stamping. We have handled numerous frame productions using 42 alloy and can assist with stable supply of frames. If you could provide us with the shape of the frame and plating specifications, we will conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frame you wish to produce ■ After a technical review to determine feasibility, we will submit a quotation ■ Place an order for the stamping mold and proceed with production ■ Once the stamping mold is completed, mass production will begin *For more details, please refer to the PDF materials or feel free to contact us.

【All 8 pages! A clear diagram of the 5 main processes of trim and forming molds!】 "Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding. Trim and forming molds (T/F molds) have various roles tailored to different processes. This document provides a clear explanation of each process with diagrams. We are currently offering this catalog for free. Please feel free to download it. 【Contents】 ■ What are trim and forming molds? ■ Pre-cutting ・ Gate cut ・ Tie bar cut ・ Support cut ■ Post-cutting ・ Lead cut ・ Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview

Introducing new equipment for production capacity and quality control! Supplying high quality to Japan, Asia, and the world. We have implemented new equipment equivalent to that of Japan in both production capacity and quality control. We have established a consistent production system for semiconductor molds and lead frames. We respond with a supply system that exceeds previous standards, supporting global-scale business with a reliable network, and the technical skills of local staff are continuously improving through interaction with Japanese staff. **Features** - Introduction of new equipment equivalent to that of Japan - Consistent production system for semiconductor molds and lead frames - Support for global-scale business with a reliable network - Continuous improvement of local staff's technical skills through interaction with Japanese staff **Company Overview** - Established: November 23, 1993 - Capital: 150 million pesos - Number of Employees: 280 - Products: Semiconductor manufacturing molds, lead frames - Certifications: ISO 9001 / ISO 14001 / IATF 16949

We provide molds designed for long-term use, focusing on materials with minimal aging changes and high-quality finishes! At Rohm Mecatech, we offer high-precision, high-quality mold designs using advanced engineering techniques for thermosetting resins. We can also handle conventional molds using hydraulic presses, from design to production. Using new equipment introduced in each process, our skilled workers carefully finish the machining. **Features** - We can handle conventional molds using hydraulic presses, from design to production. - We use new equipment introduced in each process. - Skilled workers perform careful and high-precision machining. *For more details, please refer to the PDF materials or feel free to contact us.*

From the design and manufacturing of molds to the assembly of stamping molds, we mass-produce various lead frames with high precision and high quality for supply. There are many types of lead frames used in semiconductor devices. At Rohm Mecatech, we produce lead frames using stamping molds, and we have a wealth of experience with lead frames that require deep pressing or bending. If you could provide us with the desired shape of the frame, we can conduct a technical review to see if we can accommodate your request, so please feel free to reach out to us. [Process for Requesting Lead Frames] ■ Send us the drawings of the lead frame you wish to manufacture. ■ After a technical review to determine feasibility, we will submit a quotation. ■ Place an order for the stamping mold and proceed with manufacturing. ■ Once the stamping mold is completed, mass production will begin. *For more details, please refer to the PDF document or feel free to contact us.