Manufacturing and processing contract
江戸川電子

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Our company has been focusing on downsizing silicon wafers with the desire to "make efficient use of limited materials" while being mindful of the environment. We use large-diameter wafers until they are re-polished and made thinner, and then we downsize them to minimize waste and promote reuse. Please feel free to contact us if you have any requests. 【Process of Silicon Wafer Downsizing】 1. Downsizing 2. Heat treatment 3. Edge beveling 4. Lapping 5. Cleaning and inspection 6. Shipping *For more details, please download the PDF or contact us.
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