古河電気工業 List of Products and Services

"GOFC" is a high-purity oxygen-free copper that is resistant to grain growth even when heated, and its low Young's modulus helps suppress chip delamination. It is intended as an alternative to standard oxygen-free copper for applications involving heat, such as power semiconductor substrates. Since it has the same composition as standard oxygen-free copper, it is easy to substitute, and it suppresses the "grain growth (coarsening)" that is a weakness of oxygen-free copper during heating. Additionally, the low Young's modulus reduces thermal stress caused by differences in thermal expansion rates between the substrate and the chip, resulting in a reliable product with less likelihood of delamination at the bonding surface. 【Features】 - Resistant to grain growth even when heated, reducing background noise during automatic inspection with cameras (improved signal-to-noise ratio). - Low Young's modulus minimizes the generation of thermal stress, suppressing chip delamination. - Suitable for heat dissipation materials such as heat sinks and heat spreaders. *For more details, please refer to the PDF document or feel free to contact us.*

• Other metal materials

The product is various copper alloys used for resistance materials. We provide a variety of resistance materials manufactured consistently from melting and casting in various forms. We propose the optimal shape and resistance value materials tailored to your usage. CMR and HRR have low T.C.R. (Temperature Coefficient of Resistance: the rate of change of resistance with temperature) and EMF (Electromotive Force against copper thermal electromotive force), making them suitable materials for shunt resistors and chip resistors. 【Features】 - Consistent manufacturing from melting and casting - Available in various forms (bars, round wires, flat wires, rods) according to customer applications - A lineup of materials with various resistance values, including Cu-Ni series (GCN5 to GCN30) and Cu-Sn series (0.15S to 1.5S) - CMR (equivalent to Manganin) and HRR (equivalent to Zeranin 30) have small variations in resistance values, making them suitable for shunt resistors and chip resistors - EFCR-100 with a volume resistivity of 100μΩ·cm is also under development *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials

The "EFTEC-550/EFCUBE series" is a high-performance copper alloy for connector terminals. The "EFTEC-550 series" features high conductivity and excellent stress relaxation properties, making it suitable for high current applications such as power connectors. The "EFCUBE series" has high strength, low Young's modulus, and good bendability, making it suitable for ultra-small board-to-board connectors. 【Features】 ■ Advantages of high conductivity and excellent stress relaxation properties - Maintains contact pressure even when generating heat under high current - Resistant to resistive heating, allowing for thinner (smaller) designs ■ Advantages of high strength and low Young's modulus - Allows for greater deflection, making it less likely to disengage and improving reliability - Minimal change in contact pressure even with variations in plug dimensions or wear *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials

"EFHD-97" is a product that imparts formability to Colson copper, which is non-magnetic and excels in the balance of strength and conductivity. While "Colson copper" is generally considered unsuitable for deep drawing, this product improves formability through a unique manufacturing process. As a result, items that were previously manufactured using stainless steel, bronze, or brass can be enhanced to achieve higher performance (non-magnetic, high conductivity, high durability). 【Features】 ■ Suitable for deep drawing ■ Non-magnetic with an excellent balance of strength and conductivity ■ High-strength and high-conductivity types are also under development *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials