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  2. Testing, Analysis and Measurement
  3. 東芝ナノアナリシス
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Testing, Analysis and Measurement
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東芝ナノアナリシス

addressKanagawa/Isogo-ku, Yokohama-shi/8 Shin-Sugita-cho, Toshiba Corporation, Yokohama Office
phone045-770-3471
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last updated:Dec 07, 2023
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東芝ナノアナリシス Product Lineup

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Non-destructive observation of the inside of the tablet.

Visualizing the voids inside caplet tablets using a 3D X-ray microscope! Low X-ray absorption rate appears dark.

Tablets have important functions that adjust the melting points and times to ensure ease of ingestion, ease of handling, suppression of odors and bitterness, and that the appropriate amount acts at the correct site. The 3D X-ray microscope (X-ray CT) can confirm the internal structure, such as the coating layer and the distribution of powdered medicine, and since it is non-destructive, it can also be used to check for changes in condition due to drying or wetting. Please feel free to contact us when needed. 【Calculation of Porosity Inside Caplet Tablets Overview】 ■ Visualization of the internal voids of caplet tablets using a 3D X-ray microscope ■ Voids are displayed darkly due to low X-ray absorption rates *For more details, please refer to the PDF document or feel free to contact us.

  • Other microscopes and optical inspection equipment

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Three-dimensional X-ray microscopic observation of tablets.

High-resolution and high-contrast observation! Non-destructive 3D observation is possible.

The ratio of internal components in tablets has significant meaning to ensure that the appropriate amount acts at the correct site. By visualizing the internal state in three dimensions using a 3D X-ray microscope (X-ray CT), it is possible to confirm the distribution state of powdered drugs and other substances. X-rays that pass through the sample are converted into light and magnified with optical lenses, allowing for high-resolution and high-contrast observation. 【Basic Structure of the 3D X-ray Microscope】 ■ X-ray source ■ Sample ■ Scintillator ■ Optical lens ■ Detector *For more details, please refer to the PDF document or feel free to contact us.

  • Other microscopes and optical inspection equipment

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Contracted analysis service "You can see that without breaking it!"

You can observe the internal structures and defects of semiconductors, electronic components, and organic composite materials by magnifying them.

"That can be seen without breaking it!" is a contracted analysis service that reveals hidden abnormalities. Non-destructive observation methods include magnetic field microscopy that visualizes current paths, ultrasonic microscopy that detects delamination with high sensitivity, and X-ray microscopy (X-ray CT) that allows for three-dimensional observation of internal structures. By combining these methods, it is possible to capture various phenomena. Additionally, high-brightness X-rays enable real-time observation of the water absorption and disintegration state of tablets, and video provision is also possible. Please feel free to contact us. 【Features】 ■ Visible peeling and cracking ■ Visible three-dimensional structures ■ Visible magnetic fields and currents ■ Visible numerical values of interest (particle size, volume, orientation, voids, density) ■ Real-time visibility of shape changes *For more details, please download the PDF or feel free to contact us.

  • Contract Analysis

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Non-destructive analysis using magnetic field microscopy and 3D X-ray microscopy.

Analysis of low-resistance short defects, which was difficult with previous non-destructive testing, is now possible!

A magnetic field microscope is a non-destructive analysis technique that measures the magnetic field distribution generated by electric currents from outside the measurement target and estimates the current paths flowing within the measurement target. By observing abnormal areas identified by the magnetic field microscope, such as shorts, with a 3D X-ray microscope (X-ray CT), detailed cause analysis can be performed non-destructively. Please feel free to contact us if you have any inquiries. 【Analysis Flow】 1. Abnormal detection using a magnetic field microscope 2. Observation using a 3D X-ray microscope *For more details, please refer to the PDF document or feel free to contact us.

  • Other analyses

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Three-dimensional structure observation of MEMS devices.

Achieve high-resolution and high-contrast observation! Non-destructive 3D observation is possible.

The "MEMS" structure, which has a three-dimensional and movable component, is sealed in a hollow form. To observe this structure as it is, it is necessary to conduct observations without any processing such as opening it. The 3D X-ray microscope (X-ray CT) allows for non-destructive three-dimensional observation and is effective for quality analysis, defect analysis, and reverse engineering. 【Features of the 3D X-ray Microscope】 ■ Enables non-destructive three-dimensional observation of the internal structure of the object ■ By magnifying the X-rays that have passed through the sample with optical lenses, high-resolution and high-contrast observations are possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other microscopes

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Analysis of the etch pit shape on SiC wafers

Introducing a case where etch pits formed on SiC wafers were observed using a 3D X-ray microscope (X-ray CT)!

In order to promote the spread of power semiconductors, the development of low-defect SiC wafers is underway. X-ray CT is a method that visualizes the shape of materials in three dimensions non-destructively and allows for quantitative evaluation. In the PDF document, you can see the CT images obtained when observing the etched pits formed on SiC wafers using a 3D X-ray microscope (X-ray CT). [Overview] ■ Shape analysis of etched pits using X-ray CT *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis

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Open - Fault Location Identification

It is possible to visualize the internal condition that cannot be detected by visual inspection non-destructively!

There may be cases where electrical products fail due to wire disconnection. If the wiring is covered with opaque resin or similar materials, it is difficult to locate the disconnection just by visual inspection. In such cases, it is possible to find the disconnection point through X-ray transmission observation. Please feel free to contact us when needed. 【Overview】 ■Identification of disconnection points using X-ray transmission observation *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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Reliability evaluation content

We provide reliability evaluation services based on your requested specifications and evaluation criteria!

Our testing laboratory provides reliability evaluation services through a controlled environment and established procedures. In addition to standard specifications, we can also accommodate evaluation conditions based on your requested specifications. We support semiconductors, electronic panels, electronic components, mounted circuit boards, glass, and various materials. 【Environmental Testing and Mechanical Strength Testing (Partial)】 ■ High-Temperature Testing ■ Low-Temperature Testing ■ High-Temperature and High-Humidity Testing ■ HAST Testing / Autoclave Testing ■ Temperature Cycle Testing / Thermal Shock Testing / Heat Cycle Testing *For more details, please refer to the PDF document or feel free to contact us.

  • Other services

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