AOCジャパン List of Products and Services

We will integrate your desired laser processing optical system into a compact platform.

We can propose precision processing equipment tailored to your needs, such as coaxial observation, ultra-precision stages, and dedicated optical systems for drilling, on a multifunctional platform.

We will integrate various lasers and optical systems into a Class 1 compliant safety enclosure according to the application. We can provide proposals while confirming the laser oscillator type and precision requirements through sample processing.

High-quality finishing achieved through femtosecond pulse laser processing.

Our company offers a "Glass Micro Hole Drilling Machine (Through Glass Vias)" that can create fine straight holes in glass, silicon, and ceramics. It supports high aspect ratio hole processing with a minimum diameter of 10μm, and we have delivered over 100 units. Based on our expertise in laser cutting and processing technology, we can also propose etching solutions tailored to specific applications. 【Features】 ■ High-precision processing with a minimum hole diameter of 10μm ■ Capable of straight hole processing with a maximum aspect ratio of 1:50 ■ Compatible with processing glass, silicon, and ceramics ■ Contributes to the performance improvement of semiconductor chips and GPUs *We are currently accepting sample processing requests. If you are interested, please apply through the <Contact Us> section. You can also view materials from <Download Catalog>.

The "DCS Series" is a laser fine processing machine equipped with wavelengths, pulse widths, and output energy that can precisely cut, shape, slice, and mark CVD diamonds. It is utilized in countries around the world, with over 1,000 units installed. It is used in processes such as tool edge processing and the precise polishing of semiconductor wafers. 【Examples of Applications】 ■ Tool edge processing ■ 4P diamond three-dimensional shape processing ■ Internal marking ■ Polishing of diamond wafers *For more details, please refer to the materials available for download in the catalog. We are also accepting inquiries for sample processing. Feel free to contact us.

We offer laser processing machines for films and resin substrates equipped with laser oscillators that cover a wide range of pulse widths and wavelengths, from nanoseconds to picoseconds and femtoseconds. Our unique trepanning head allows for high aspect ratio drilling at 1:50, and we can accommodate various substrate and film processing needs, including cutting, marking, and thin film removal. Based on the results of sample processing, we will provide proposals considering your budget and target takt time. 【Features】 ■ Improves productivity and yield with precision and high-speed cutting for FPCs and PCBs used in semiconductor mounting. ■ Capable of supporting dual head configurations and automatic transport and discharge functions. ■ Rapid maintenance and support system unique to our Japanese corporation. *For more details, please view the materials by clicking the "Download Catalog" button. For sample processing inquiries, feel free to contact us through the "Contact Us" section.