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  3. TNSシステムズ
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TNSシステムズ

addressChiba/Matsudo-shi/Fundamental 14-2-707
phone047-703-1500
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last updated:Dec 13, 2024
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YAG laser thin film processing system

Can be used for various applications! Such as patterning of organic devices and cutting of metal wiring for ICs, etc.

We provide a YAG laser thin film processing system that is widely used for semiconductor development, failure analysis, and repair applications such as FPD. It offers stable, high-quality laser irradiation at both high and low power, significantly reducing the impact on the substrate and surrounding areas, and enabling high-quality laser processing on materials different from conventional ones. **Main Applications:** - Removal of protective films and organic thin films using DUV lasers - Cutting and removal of IC metal wiring such as gold and aluminum, exposing underlying patterns - Drilling for EB testers and probing - Pre-treatment for FIB (such as pre-processing), pre-treatment for SEM, TEM, etc. (such as marking) - Precise transfer of laser marks from the back surface of samples to the front using failure analysis equipment - Simple photomask creation and photomask modification - Correction of various defects in FPDs: CF protrusion correction, OC foreign matter protrusion correction, ITO short cutting, etc. - Direct patterning on organic films and correction of pattern collapse - Spot annealing - Integration into electrical measurement systems for defect and failure analysis, etc. We can customize and provide integration into various devices such as semi-auto systems and probers for a wide range of applications.

  • Semiconductor inspection/test equipment

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Photo-emission microscope

A low-cost system capable of performing limited-function fluorescence analysis.

Achieves a low price by limiting functions while equipped with detectors equivalent to high-performance products from other companies.

  • Other microscopes

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High current connector and switch compatible with up to 10,000A.

By adopting low-contact resistance louvers, high conductivity performance and heat generation are suppressed.

● Design and manufacturing tailored to requirements ● Production of multi-contact connectors and switches ● Stable contact pressure ● High conductivity performance ● Heat generation suppression by reducing contact resistance ● From a few A to 10,000 A ● Capable of producing insulated, water-cooled types, flat (fork-type), positioning structures, and movable part position absorption types ● Also capable of producing peripheral jigs and devices such as aluminum chambers, vacuum equipment, electrical measurement jigs, and dedicated interfaces.

  • Other Connectors

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