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"SKC-17" is a compression-molded plate made from carbon powder and thermosetting resin, designed to match the strength characteristics of Chinese-made graphite materials. It has a density of 1.63, a bending strength of 14 MPa, and a bending modulus of elasticity of 3.65 GPa, and is used for small-diameter semiconductor silicon wafers. This plate is intended for customers who manually remove wafers from the plate after processing. 【Key Characteristics】 ■ Main Component: Synthetic graphite powder as the main component + unsaturated polyester resin ■ Manufacturing Method: Compression molding ■ Bending Strength: 14 MPa ■ Bending Modulus of Elasticity: 3.65 GPa *For more details, please download the PDF or feel free to contact us.
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Free membership registration"SKB-13" is a plate primarily composed of aluminum hydroxide and unsaturated polyester resin. It has excellent workability and a material composition that suppresses the heat generated during processing. It effectively reduces wire breakage and clogging of cutting tools such as wires, making it suitable for wire saws, inner blades, and outer blades. Additionally, it has been redesigned to address the common issue of warping in general resin plates after heating, resulting in a plate that is less prone to warping even after heating and cooling. 【Features】 ■ Excellent workability ■ Low water absorption ■ Less prone to warping even after heating and cooling ■ Compatible with hot adhesives ■ Reduces wire breakage and clogging of cutting tools *For more details, please download the PDF or feel free to contact us.
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